In alternative embodiments, provided are processes comprising the continuous isolation and purification of cannabinoids and further isomerization of the purified cannabidiol to .sup.8tetrahydrocannabinol (.sup.8THC) and .sup.9tetrahydrocannabinol (.sup.9THC). In alternative embodiments, provided are processes for converting 8-THC into .sup.9-THC. In alternative embodiments, provided are processes for the industrial scale continuous isolation and purification of cannabinoids and further isomerization of the purified cannabidiol to .sup.9-THC.

The present application discloses a levelling compound for electrodepositing metals. The metal is of formula (II):

##STR00001##

The present application discloses a levelling compound for electrodepositing metals. The metal is of formula (II):

##STR00001##

The present application describes process for preparing an ortho-allylated hydroxy aryl compounds such as compounds of Formula (1) by reacting an allylic alcohol with a hydroxy aryl compound in the presence of aluminum compound selected from alumina and aluminum alkoxides and in a non-protic solvent wherein at least one carbon atom ortho to the hydroxy group in the hydroxy aryl compound is unsubstituted. The present application also includes compounds of Formula (1).

##STR00001##

The present invention relates to an ibuprofen conjugate in which ibuprofen (S-(+)-ibuprofen) is covalently linked to a guanidine-terminal-group-bound sugar alcohol derivative and to a pharmaceutical composition containing the same. The ibuprofen conjugate in which ibuprofen is covalently linked to a guanidine-terminal-group-bound sugar alcohol derivative can more effectively penetrate into the brain by passing through the blood-brain barrier (BBB), thus enabling efficient drug delivery to the brain, whereby administration of the ibuprofen conjugate in an optimal dose can minimize side effects of nonsteroidal anti-inflammatory drugs (NSAIDs) and can prevent or treat degenerative brain disease.

The present invention provides novel compounds having the general formula:

##STR00001## wherein R.sup.1 to R.sup.6, X, Y, A.sup.1 and A.sup.2 are as described herein, compositions including the compounds and methods of using the compounds.

The present invention provides novel compounds having the general formula:

##STR00001## wherein R.sup.1 to R.sup.6, X, Y, A.sup.1 and A.sup.2 are as described herein, compositions including the compounds and methods of using the compounds.

The present disclosure relates to a leveling compound for electrodepositing metals. The compound is of formula (I) or a salt thereof: ##STR00001##

The present disclosure relates to a leveling compound for electrodepositing metals. The compound is of formula (I) or a salt thereof: ##STR00001##

A composition containing an organic compound AB and an organic compound AA different from the organic compound AB. The organic compound AB is represented by the following formula (1) and has a fused polycyclic structure A with two or more rings and a ring structure B different from the fused polycyclic structure A. The organic compound AA has the fused polycyclic structure A and is represented by the following formula (2).

A-B (1)

AA).sub.n (2)

In formulae (1) and (2), each of the fused polycyclic structures A may have, as a substituent, a deuterium atom, a substituted or unsubstituted alkyl group, a substituted or unsubstituted aryl group, or a substituted or unsubstituted heteroaryl group.