A two-component epoxy resin composition includes a first component K1 including at least one epoxy resin A that contains on average more than one epoxy group per molecule; and a second component K2 including a hardener B for epoxy resins; wherein the two-component epoxy resin composition contains between 2 and 35 wt.-%, based on the total weight of the composition, of at least one impact modifier I in either one or both of components K1 and K2; wherein the impact modifier I is a reaction product of at least one polymeric diol, at least one polyisocyanate, and cardanol. The two-component epoxy resin composition exhibits excellent toughness and impact peel strength

A two-component epoxy resin composition includes a first component K1 including at least one epoxy resin A that contains on average more than one epoxy group per molecule; and a second component K2 including a hardener B for epoxy resins; wherein the two-component epoxy resin composition contains between 2 and 35 wt.-%, based on the total weight of the composition, of at least one impact modifier I in either one or both of components K1 and K2; wherein the impact modifier I is a reaction product of at least one polymeric diol, at least one polyisocyanate, and cardanol. The two-component epoxy resin composition exhibits excellent toughness and impact peel strength

A single-component thermosetting epoxy resin adhesives, including: a) at least one epoxy resin having, on average, more than one epoxy group per molecule; b) at least one latent hardener for epoxy resins; and c) 2-7 wt % aerogel particles, relative to the total weight of the single-component thermosetting epoxy resin adhesive, wherein the epoxy resin adhesive has a viscosity of 1000-4000 Pas, in particular 1000-3500 Pas, at 25° C., wherein the viscosity is oscillographically determined by means of a rheometer having a heatable plate (MCR 301, AntonPaar) (gap 1000 μm, measurement plate diameter: 25 mm (plate/plate), deformation 0.01 at 5 Hz, temperature: 25° C.). The epoxy resin adhesives are characterized in that they can be easily applied in the temperature range from 40° C. to 70° C. and are scouring-resistant, even at higher temperatures.

A single-component thermosetting epoxy resin adhesives, including: a) at least one epoxy resin having, on average, more than one epoxy group per molecule; b) at least one latent hardener for epoxy resins; and c) 2-7 wt % aerogel particles, relative to the total weight of the single-component thermosetting epoxy resin adhesive, wherein the epoxy resin adhesive has a viscosity of 1000-4000 Pas, in particular 1000-3500 Pas, at 25° C., wherein the viscosity is oscillographically determined by means of a rheometer having a heatable plate (MCR 301, AntonPaar) (gap 1000 μm, measurement plate diameter: 25 mm (plate/plate), deformation 0.01 at 5 Hz, temperature: 25° C.). The epoxy resin adhesives are characterized in that they can be easily applied in the temperature range from 40° C. to 70° C. and are scouring-resistant, even at higher temperatures.

The present disclosure provides a polymeric material including a polymerized reaction product of a polymerizable composition including components and has a solids content of 90% or greater. The components include a uretdione-containing material including a reaction product of a diisocyanate reacted with itself; a first hydroxyl-containing compound; an optional second hydroxyl-containing compound having a single OH group; an epoxy component; and an accelerator. The first hydroxyl-containing compound has more than one OH group and the optional second hydroxyl-containing compound is a primary alcohol or a secondary alcohol. The present disclosure also provides a two-part composition, in which a polymeric material is included in the first part and the second part includes at least one thiol-containing compound. Further, a method of adhering two substrates is provided, including obtaining a two-part composition; combining at least a portion of the first part with at least a portion of the second part to form a mixture; disposing at least a portion of the mixture on a first substrate; and contacting a second substrate with the mixture disposed on the first substrate. The disclosure also provides a polymeric material and a method of making a two-part composition. Advantageously, two-part compositions according to the present disclosure can be used as coatings and adhesive systems with handling and performance similar to existing two-part urethane systems, but with less sensitivity to water.

Heat-curing epoxy resin compositions are characterized by high impact strength, good storage stability, and a low curing temperature. The epoxy resin compositions are suitable for use as a construction shell adhesive and for producing structural foams. They can already be cured in so-called bottom-baking conditions. Furthermore, it has been found that the use of an accelerator of the formula (Ia) or (Ib) results in an increase of the impact strength of heat-curing epoxy resin compositions.

Heat-curing epoxy resin compositions are characterized by high impact strength, good storage stability, and a low curing temperature. The epoxy resin compositions are suitable for use as a construction shell adhesive and for producing structural foams. They can already be cured in so-called bottom-baking conditions. Furthermore, it has been found that the use of an accelerator of the formula (Ia) or (Ib) results in an increase of the impact strength of heat-curing epoxy resin compositions.

The presently claimed invention provides a continuous process for preparing a polyurethane composition which behaves as a rheology modifier upon addition to paint and coating formulations. The present process employs mixers for homogenization of highly viscous polyurethane polymers and by adjusting the process parameters and reactor conditions in specified ranges obtained a polyurethane composition. The polyurethane composition obtained from the process of the present invention is used as thickener in water-borne paint and coating formulations.

Disclosed is a structural material-bonding adhesive capable of bonding materials other than iron, and maintaining the bonding ability in an environment at a high temperature and a low temperature, while maintaining performance similar to that of a structural material adhesive used as an adhesive for bonding iron materials. A curable resin composition contains an epoxy resin, blocked urethane, and an amine-based latent curing agent, wherein the blocked urethane is obtained by reacting a urethane polymer having a terminal isocyanate group with a blocking agent, the urethane polymer being obtained by reacting a polyisocyanate, a diol, and a branching agent containing at least three groups that react with an isocyanate group.

Disclosed is a structural material-bonding adhesive capable of bonding materials other than iron, and maintaining the bonding ability in an environment at a high temperature and a low temperature, while maintaining performance similar to that of a structural material adhesive used as an adhesive for bonding iron materials. A curable resin composition contains an epoxy resin, blocked urethane, and an amine-based latent curing agent, wherein the blocked urethane is obtained by reacting a urethane polymer having a terminal isocyanate group with a blocking agent, the urethane polymer being obtained by reacting a polyisocyanate, a diol, and a branching agent containing at least three groups that react with an isocyanate group.