Polyol premixes and thermally insulating rigid polyurethane foams, such as those that can be used as a thermal insulation medium in the construction of refrigerated storage devices, are disclosed. A polymer polyol having a OH number of at least 200 mg KOH/g and a solids content of at least 40% by weight is utilized. The resulting polyurethane foams can exhibit improved thermal insulation properties without sacrificing other important physical and processing properties.

Disclosed is an adhesive for laminated sheets comprising a urethane resin obtained by blending: (A) an acrylic polyol; (B) at least one component selected from carboxylic acids and carboxylic anhydrides; and (C) an isocyanate compound. The acrylic polyol (A) is obtained by polymerization of a polymerizable monomer, has a glass transition temperature of from 35 C. to 20 C., and has a hydroxyl value of from 0.5 to 40 mgKOH/g. The adhesive for laminated sheets is excellent in initial adhesion to a film, peel strength after aging and hydrolysis resistance for a long time under high temperature when a laminated sheet is produced, and wherein the adhesive does not impart an adverse effect to the appearance of the laminated sheet and the lamination process of films while improving the curability. The laminated sheet is suitably prepared using the adhesive for laminated sheets. An article comprising the laminated sheet can be prepared using the laminated sheet.

Provided are a polymer polyol dispersion stabilizer, which is prepared by reacting a first polyol having a hydroxyl value (OHV) of 5 to 50 mgKOH/g and an ethylene oxide content of less than 20 wt %, a second polyol having an OHV of 50 to 100 mgKOH/g and an ethylene oxide content of 20 wt % or more, and a reactive unsaturated compound having one or more carbon-carbon double bonds and two or more carbon-oxygen double bonds, and a method of preparing the same.

There is provided a pressure-sensitive adhesive composition comprising a polymer formed by polymerizing a plurality of monomers. Here, the monomers include i) one or more selected from the group consisting of 2-ethylhexyl acrylate, butyl acrylate, isooctyl acrylate, 2-propylheptyl acrylate, n-octyl acrylate, 2-ethylhexyl methacrylate, butyl methacrylate, isooctyl methacrylate, 2-propylheptyl methacrylate, and n-octyl methacrylate, ii) one or more selected from the group consisting of acrylonitrile and methacrylonitrile, and iii) one or more selected from the group consisting of acrylic acid and methacrylic acid. The pressure-sensitive adhesive composition has high adhesive strength and water repellency, and particularly exhibits excellent chemical resistance and maintains an adhesive strength even when coming in contact with chemicals.

To provide a film which is excellent in releasing property with respect to a resin sealed portion and excellent in low migration property and peeling property with respect to a semiconductor chip, a source electrode or a sealing glass and which is suitable as a mold release film for producing a semiconductor element having a part of the surface of a semiconductor chip, source electrode or sealing glass exposed. A film 1 which comprises a substrate 3 and an adhesive layer 5, wherein the storage elastic modulus at 180 C. of the substrate 3 is from 10 to 100 MPa, and the adhesive layer 5 is a reaction cured product of a composition for adhesive layer comprising a specific acrylic polymer and a polyfunctional isocyanate compound, wherein the number of moles M.sub.OH of hydroxy groups and the number of moles M.sub.COOH of carboxy groups, derived from the acrylic polymer, and the number of moles M.sub.NCO of isocyanate groups derived from the polyfunctional isocyanate compound, satisfy a specific relation, and which is suitable as a mold release film for producing a semiconductor element.

A process for forming a conventional flexible polyurethane foam includes providing a polyol component including a PIPA polyol that is a dispersion having a solids content from 10% to 75 wt %, based on a total weight of the PIPA polyol, providing an isocyanate component that includes at least one polyisocyanate, providing an additive component that includes a catalyst, and forming a reaction mixture including the polyol component, the isocyanate component, and the additive component to form a flexible polyurethane foam with a resiliency value below 45%. The reaction mixture has an isocyanate index from 90 to 150. The PIPA polyol is a reaction product of a mixture including at least a low equivalent weight polyol having a number average hydroxyl equivalent weight of less than 80, a polyisocyanate compound having a number average isocyanate equivalent weight that is less than 225, and a liquid base poly ether polyol having a number average hydroxyl equivalent weight from 200 to 1500 and at least 80% of secondary hydroxyl groups based on a total amount of hydroxyl groups in the liquid base polyether polyol.

The present invention provides an adhesive composition for a flexible printed wiring board containing (A) an epoxy resin; (B) no phosphorus-containing epoxy resin; and (C) a polyamide-imide resin.

Provided are a polymer polyol dispersion stabilizer, which is prepared by reacting a first polyol having a hydroxyl value (OHV) of 5 to 50 mgKOH/g and an ethylene oxide content of less than 20 wt %, a second polyol having an OHV of 50 to 100 mgKOH/g and an ethylene oxide content of 20 wt % or more, and a reactive unsaturated compound having one or more carbon-carbon double bonds and two or more carbon-oxygen double bonds, and a method of preparing the same.