The present invention relates to novolac vinyl esters useful as thermal resistance conferring components for anaerobic curable compositions, and anaerobic curable compositions having such novolac vinyl esters. The compositions are particularly useful as adhesives and sealants.

The present invention discloses a fluorine-modified epoxy acrylic resin, an UV-curable varnish and a method for preparing the same, and a method for coating the varnish on a substrate. The fluorine-modified epoxy acrylic resin is prepared by a process including the following steps: generating an epoxy acrylic resin via a ring-opening esterification reaction between an unsaturated mono-carboxylic acid and at least one epoxy group in an epoxy resin; and generating an epoxy acrylic resin containing fluorinated side groups via an esterification reaction between a fluorocarboxylic acid or a fluorocarboxylic acid anhydride and at least one hydroxy group in the epoxy acrylic resin. The UV-curable varnish according to the invention is prepared based on the fluorine-modified epoxy acrylic resin. When the varnish is applied to the surface of a substrate, at least one performance of the material, thereby the service life of the material itself may be improved.

The present invention relates to a modified epoxy acrylate and a method for producing the same, a photoresist composition and a method for producing the same, and a transparent photoresist formed from the photoresist composition. The modified epoxy acrylate is an epoxy acrylate modified with phosphate monomer which has a structure represented by Formula I ##STR00001## wherein, n is an integer selected from 1˜21, R is a short-chain carboxylic acid ester group having the structural formula ##STR00002##  in which p is a bivalent saturated or unsaturated carbon chain having 1˜10 carbon atoms, and the carbon chain is optionally substituted by alkyl, alkenyl, hydroxy, nitro or halogen. Since the phosphate can react with the multi-valence metal in substrates so as to connect the polymer onto the substrates firmly through covalent bonds, therefore the adhesion force is improved significantly and the protective function of the tranparent photoresist is improved accordingly.

A vinyl ester resin composition comprising a reaction product of: (a) a polyepoxide resin; (b) an unsaturated carboxylic acid; and (c) a reactive carboxyl group terminated amphiphilic block copolymer, a reactive epoxy group terminated amphiphilic block copolymer, or a mixture thereof; and a cured thermoset composite product produced from the above vinyl ester resin composition.

This invention outlines a method for synthesizing a blended resin system in a one pot reaction that may utilize, for example, bio-based anhydrosugars such as isosorbide as a principle component to produce isosorbide dimethacrylate and other monomeric materials for thermosetting applications. This invention establishes a one-pot procedure for reacting a hydroxy group containing compound with methacrylic anhydride in the first step and using the by-product methacrylic acid to react with glycidyl ethers to form additional methacrylate compounds in the second step. This methodology can be formulated to produce a wide array of resin systems that have controlled ratios of hydroxy group containing compound/crosslinker/reactive diluent. Additionally, the novel resin systems may be partially to fully biobased, promoting global sustainability and reducing costs, and when free radically polymerized have properties that meet or exceed their petroleum derived counterparts.

The present invention relates to a tape comprising an epoxy based resin having ester groups and ethylenically unsaturated groups, alternatively a hybrid resin. The tape of the invention can be used for insulation in electrical machines, especially in high voltage machines. Preferably, the tape of the invention is used in combination with a composition for impregnating and/or coating a substrate comprising the tape of the invention, wherein the composition further comprises a second epoxy based resin having ester groups and ethylenically unsaturated groups, also an hybrid resin, a diluent and an initiator for a radical polymerization.

A multi-component composition for additive manufacturing, and related methods, are generally described.

The present invention relates to provision of a photosensitive resin composition, a photosensitive resin composition for photo via formation, and a photosensitive resin composition for interlayer insulating layer, each of which is excellent in resolution of via, adhesion strength to plated copper, crack resistance, and electrical insulation reliability. In addition, the present invention relates to provision of a photosensitive resin film and a photosensitive resin film for interlayer insulating layer, each of which is composed of the aforementioned photosensitive resin composition. Furthermore, the present invention relates to provision of a multilayer printed wiring board and a semiconductor package, and to provision of a method for producing the aforementioned multilayer printed wiring board. Specifically, the photosensitive resin composition is a photosensitive resin composition containing (A) a photopolymerizable compound having an ethylenically unsaturated group and (B) a polymerization initiator, wherein the photopolymerizable compound (A) having an ethylenically unsaturated group includes (A1) a photopolymerizable compound having an acidic substituent and an alicyclic structure together with an ethylenically unsaturated group.

The present invention relates to provision of a photosensitive resin composition containing (A) a photopolymerizable compound having an ethylenically unsaturated group and an acidic substituent, and (B) a photopolymerization initiator, wherein at least one of the components contained in the photosensitive resin composition is a component including a dicyclopentadiene structure; a photosensitive resin film using the foregoing photosensitive resin composition; a printed wiring board and a method for producing the same; and a semiconductor package.

This invention outlines a method for synthesizing a blended resin system in a one pot reaction that may utilize, for example, bio-based anhydrosugars such as isosorbide as a principle component to produce isosorbide dimethacrylate and other monomeric materials for thermosetting applications. This invention establishes a one-pot procedure for reacting a hydroxy group containing compound with methacrylic anhydride in the first step and using the by-product methacrylic acid to react with glycidyl ethers to form additional methacrylate compounds in the second step. This methodology can be formulated to produce a wide array of resin systems that have controlled ratios of hydroxy group containing compound/cross-linker/reactive diluent. Additionally, the novel resin systems may be partially to fully bio-based, promoting global sustainability and reducing costs, and when free radically polymerized have properties that meet or exceed their petroleum derived counterparts.