The invention relates to a method of forming an epoxy resin curative, derived from a polyamine, and having exceptionally high purity with regard to contamination with said polyamine precursor. The invention also provides high purity epoxy resin curatives, epoxy resin curative compositions comprising said epoxy resin curatives, and uses of the same. In one aspect, the invention provides a method of forming an epoxy resin curative, by contacting a difunctional epoxide compound with one or more polyamine, to provide a diadduct, purifying the diadduct such that the purified diadduct comprises less than 0.1 wt. % of the one or more polyamine, as determined by GC, and using the diadduct to form a Mannich base, amide containing compound, ketimine, or aldimine, for use as an epoxy resin curative.