Patent classifications
C08G59/506
Fluorinated polyimide-based epoxy materials
A curing agent for curing an epoxy resin comprises a fluorinated central moiety covalently bonded to first and second imide-amine moieties, the first and second imide-amine moieties include amine terminal functional groups, wherein the amine functional groups of the curing agent, when applied to the epoxy resin, take part in curing reactions with ring molecules of the epoxy resin.
SOLVENT-LESS IONIC LIQUID EPOXY RESIN
Solvent free epoxy system that includes: a hardener compound H comprising: a molecular structure (Y.sup.1R.sub.1Y.sup.2), wherein R.sub.1 is an ionic moiety Y.sup.1 is a nucleophilic group and Y.sup.2 nucleophilic group; and an ionic moiety A acting as a counter ion to R.sub.1; and an epoxy compound E comprising: a molecular structure (Z.sup.1R.sub.2Z.sup.2), wherein R.sub.1 is an ionic moiety, Z.sup.1 comprises an epoxide group, and Z.sup.2 comprises an epoxide group; and an ionic moiety B acting as a counter ion to R.sub.2. In embodiments, the epoxy compound E and/or the hardener H is comprised in a solvent-less ionic liquid. The systems can further include accelerators, crosslinkers, plasticizers, inhibitors, ionic hydrophobic and/or super-hydrophobic compounds, ionic hydrophilic compounds, ionic transitional hydrophobic/hydrophilic compounds, biological active compounds, and/or plasticizer compounds. Polymers made from the disclosed epoxy systems and their methods of used.
Latent epoxy resin formulations for liquid impregnation processes for production of fibre composite materials
Latent epoxy resin formulations are suitable for liquid impregnation processes for production of fiber composite materials.
COMPOSITION FOR CURABLE RESIN, AND CURED PRODUCT THEREOF
There are provided a benzoxazine compound-containing curable resin composition and a cured product obtained from the curable resin composition. The cured product can have a high strength and a high heat resistance, and therefore can be used under a severer condition in the fields of adhesive, sealant, paint, matrix resin for composite material, and the like. The curable resin composition contains (A) a polyfunctional benzoxazine compound having at least two benzoxazine rings and (B) a polyfunctional epoxy compound having at least one norbornane structure and at least two epoxy groups. The polyfunctional benzoxazine compound of (A) is a first benzoxazine compound or a second benzoxazine compound. The first benzoxazine compound is a compound having at least two benzoxazine ring structures represented by the following formula (1), and the second benzoxazine compound is represented by the following formula (2).
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SURFACE-MODIFIED INORGANIC NITRIDE, COMPOSITION, THERMALLY CONDUCTIVE MATERIAL, DEVICE WITH THERMALLY CONDUCTIVE LAYER, AND METHOD FOR MANUFACTURING SURFACE-MODIFIED INORGANIC NITRIDE
Provided are a novel surface-modified inorganic nitride, a composition, a thermally conductive material, a device with a thermally conductive layer, and a method for manufacturing a surface-modified inorganic nitride. The surface-modified inorganic nitride of the embodiment of the present invention contains an inorganic nitride and an onium salt adsorbed onto a surface of the inorganic nitride.
CURABLE RESIN COMPOSITION
A curable resin composition containing components (A) to (E) below: (A) a compound having two or more glycidyl groups in one molecule (excluding a component (B)); (B) a glycidyl group-containing acrylic polymer; (C) a tackifier having a phenol skeleton and an OH value of 100 or more; (D) an inorganic filler; and (E) a curing agent. One embodiment of the present invention is an adhesive for structure that has high flexibility and is excellent in resin strength, adhesive strength, and toughness coefficient.
FLUORINATED POLYIMIDE-BASED EPOXY MATERIALS
A curing agent for curing an epoxy resin comprises a fluorinated central moiety covalently bonded to first and second imide-amine moieties, the first and second imide-amine moieties include amine terminal functional groups, wherein the amine functional groups of the curing agent, when applied to the epoxy resin, take part in curing reactions with ring molecules of the epoxy resin.
Epoxy resin composition comprising 2-(2,2,6,6-tetramethylpiperidin-4-yl)propane-1,3-diamine as hardener
An epoxy resin composition including A) at least one epoxy compound, and B) a hardener composition including B1) from 0.1%-100% by weight of 2-(2,2,6,6-tetramethylpiperidin-4-yl)propane-1,3-diamine, and B2) from 99.9%-0% by weight of at least one further diamine and/or polyamine, where the stoichiometric ratio of the epoxy groups of A) and the number of active hydrogen atoms of the functional groups of B) varies from 1:2 to 2:1.
Hardener composition including 2-(2,2,6,6-tetramethylpiperidin-4-yl)propane-1,3-diamine
The present invention relates to 2-(2,2,6,6-tetramethylpiperidin-4-yl)propane-1,3-diamine, which can be used as hardener in epoxide applications.
Latent epoxy resin formulations for liquid impregnation processes for production of fibre-reinforced composites
Epoxy compositions containing at least one resin component and at least one hardener component, are suitable as a thermoset matrix for production of semi-finished fiber matrix products and cured fiber matrix laminates.