The present invention relates to a low-alkylphenol composition comprising a) at least one epoxy resin, b) at least one amine having at least two secondary amino groups that are both part of an organic ring system, and c) at least one salt of a strong Brønsted acid with a counterion selected from metal ions, metal-containing ions, phosphonium ions and ammonium ions, to processes for production thereof and to the use thereof.

The present invention relates to a composition comprising a) at least one epoxy resin, b) at least one amine having at least two secondary amino groups which are both part of an organic ring system, and c) at least one salt of a very strong Brønsted acid with a counterion selected from metal ions, metal-containing ions, phosphonium ions and ammonium ions, and to processes for production thereof and use thereof.

Provided is a curable composition containing a reactive mixture of components including an polyethersulfone having a chemical group reactive with an epoxide, a cycloaliphatic polyepoxide resin, a polyepoxide having a functionality greater than two, a liquid diepoxide resin, a first curative containing 9,9-bis(aminophenyl)fluorene or a derivative therefrom and having a curing onset temperature of from 150° C. to 200° C. The components can further comprise a second curative having a curing onset temperature of from 60° C. to 180° C. When thermally curing this composition, the second epoxy curative starts to cure before the first epoxy curative, thereby inhibiting vertical flow of the adhesive during the curing process.

A flux resin composition contains: 60-80% by weight of an epoxy resin; 0.01-2% by weight of an imidazole compound; 1-5% by weight of a thixo agent; 4-20% by weight of an activator; and 7-30% by weight of a phenolic compound. The epoxy resin contains at least one resin selected from the group consisting of naphthalene type epoxy resins, biphenyl aralkyl type epoxy resins, trisphenol methane type epoxy resins, biphenyl type epoxy resins, and dicyclopentadiene type epoxy resins. Content of the at least one resin falls within a range from 15% by weight to 40% by weight with respect to a total weight of the flux resin composition. The phenolic resin is liquid and contains a phenol novolac.

Methods and materials for sand control in water injection sites are disclosed. Proppant particles may be coated with some particles coated with a solid epoxy and other proppant particles coated with a solid epoxy curative (such as amine, hydroxyl, carboxyl, anhydride) that would bind the particles through an epoxy reaction. The invention may be advantageous for forming underground structures useful in the extraction of hydrocarbons.

Compositions and methods for forming epoxy resin systems are provided. In one embodiment, a composition is provided for an epoxy resin system including an epoxy resin blend comprising an epoxy resin, a first curing agent selected from the group of a polyarylene alkylphosphonate, a polyarylene arylphosphonate, and combinations thereof, and a second curing agent.

A prepreg contains: a reinforcing fiber material; and a resin composition with which the reinforcing fiber material is impregnated. The resin composition contains an epoxy resin, an amine curing agent, and an imidazole curing agent. An amount of the amine curing agent is less than or equal to 3.8 parts by mass, relative to 100 parts by mass of the epoxy resin, and a sum of the amount of the amine curing agent and an amount of the imidazole curing agent is less than or equal to 10 parts by mass, relative to 100 parts by mass of the epoxy resin. The fiber-reinforced composite material is a cured product of the prepreg.

Solvent free epoxy systems are disclosed that can include a hardener compound H comprising: a molecular structure (R.sub.1—(Y.sup.1)n), wherein R.sub.1 is an ionic moiety, Y.sup.1 is a nucleophilic group, n is a between 2 and 10; and an ionic moiety A acting as a counter ion to R.sub.1; and an epoxy compound E comprising: a molecular structure (R.sub.2—Z.sup.1)n), wherein R.sub.2 is an ionic moiety, Z.sup.1 comprises an epoxide group, n is a between 2 and 10, and an ionic moiety B acting as a counter ion to R.sub.2. In embodiments, the epoxy compound E and/or the hardener H is comprised in a solvent-less ionic liquid. The systems can further include accelerators, crosslinkers, plasticizers, inhibitors, ionic hydrophobic and/or super-hydrophobic compounds, ionic hydrophilic compounds, ionic transitional hydrophobic/hydrophilic compounds, biological active compounds, and/or plasticizer compounds. Polymers made from the disclosed epoxy systems and their methods of use are described.

This invention provides a cationic electrodeposition paint composition comprising an amino-group-containing epoxy resin (A), a blocked polyisocyanate compound (B), and a modified imidazole (C) having a specific structure, wherein the cationic electrodeposition paint composition satisfies the following (i) or (ii), or both: (i) the cationic electrodeposition paint composition further comprises a rust inhibitor (D) or (ii) a blocking agent (b-2) of the blocked polyisocyanate compound (B) is an oxime-based compound (b-2-1) and/or a pyrazole-based compound (b-2-2).

Provided is a fiber-reinforced composite material exhibiting high heat resistance and excellent appearance quality. is the composite material is based on an epoxy resin composition which contains constituents [A], [B], and [C] and satisfies conditions (i) and (ii): [A] a tri- or higher functional epoxy resin; [B] an aromatic amine; [C] an imidazole compound;
0.20≤b/a≤0.60; and  (i)
0.002≤c/a≤0.014;  (ii)
wherein a (mol) denotes the number of epoxy groups in 100 g of the epoxy resin composition, b (mol) denotes the number of active hydrogens contained in the constituent [B], and c (mol) denotes the number of imidazole rings contained in the constituent [C]).