The present invention provides a composition comprising a) at least one epoxy resin, b) at least one cyclic amine of the formula (I)

##STR00001## in which R.sup.1 to R.sup.4 is H or an organic radical and

X(Y.sup.1).sub.m-(A.sup.1).sub.n-(Y.sup.2).sub.o-(A.sup.2).sub.p-(Y.sup.3).sub.q-(A.sup.3).sub.r-(Y.sup.4).sub.s, (II) where, independently of one another, m, n, o, p, q, r and s=0 or 1, A.sup.1, A.sup.2, A.sup.3=alkylene or alkenylene radical and Y.sup.1, Y.sup.2, Y.sup.3, Y.sup.4=NR.sup.5, PR.sup.5, O or S, where R.sup.5 independently=organic radical, where any two organic radicals selected from R.sup.1 to R.sup.5 and any radicals present in the alkylene and/or alkenylene radicals A.sup.1, A.sup.2, A.sup.3 may also form one or more further rings, with the proviso that at least one of the radicals selected from R.sup.1 to R.sup.5 present and any radicals present in the alkylene and/or alkenylene radicals A.sup.1, A.sup.2, A.sup.3 is substituted by at least one NHR.sup.6 or NH.sub.2 group, where R.sup.6=organic radical, and c) at least one salt of a very strong Brnsted acid with a counterion selected from metal ions, metal-containing ions, phosphonium ions and unsubstituted ammonium ions, and to processes for production thereof and use thereof.

The present invention relates to a composition comprising a) at least one epoxy resin, b) at least one amine having at least two secondary amino groups which are both part of an organic ring system, and c) at least one salt of a very strong Brosted acid with a counterion selected from metal ions, metal-containing ions, phosphonium ions and ammonium ions, and to processes for production thereof and use thereof.

The present invention relates to epoxy curing agents which are obtained from the reaction of a polyalkylene polyether modified polyepoxide resin and a polyamine component. They polyamine component is a reaction product of a polyethylene polyamine having 3 to 10 nitrogen atoms, for example, diethylenetriamine (DETA), and at least one aldehyde having 1 to 8 carbon atoms, for example, formaldehyde. The epoxy curing agent may be used as part of a two component coating system in the curing of liquid or pre-dispersed curable epoxy resins.

The invention relates to heat-curing and light-fixable epoxy-based compositions which are liquid at room temperature, comprising at least one epoxy-containing compound (A) having at least two epoxy groups, at least one curing agent (B) for the epoxy-containing compound, optionally an accelerator (C), at least one radiation-curing compound (D), at least one photoinitiator (E) for radical polymerization and at least one filler (F). The radiation-curing compound (D) comprises at least one at least trifunctional (meth)acrylate. In particular, the epoxy composition can be used for fixing and/or selectively encapsulating electrical, electronic and/or electromechanical components, and/or for bonding, coating and sealing.

Provided is a film adhesive which is preferably used as a NCF, void-free, has excellent electrical connectivity and its high reliability, does not develop cracks easily, and has high surface flatness. Also provided is a semiconductor device in which the film adhesive according to the present invention is used as an NCF during the manufacture of the semiconductor device. The film adhesive according to the present invention contains (A) an epoxy resin; (B) a bisphenol F type phenoxy resin; (C) a phenol resin-based curing agent; (D) a modified imidazole compound; (E) a silica filler; (F) oxyquinoline; and (G) a butadiene-acrylonitrile-methacrylic acid copolymer. The content of component (A) is 19.3 to 33.8 parts by mass. The content of component (B) is 7.5 to 9.1 parts by mass. The content of component (D) is 1.915 to 5 parts by mass. The content of component (E) is 30 to 60 parts by mass. The content of component (F) is 2.5 to 10 parts by mass. The liquid epoxy resin of component (A) contains a phenol novolac type epoxy resin and a liquid epoxy resin. The ratio of phenol novolac type epoxy resin to the epoxy resin of component (A) is not less than 46%. The equivalent ratio of component (C) relative to component (A) is 0.25 to 0.75.

The purpose of the present invention is to provide a curable resin composition capable of forming a cured object having excellent adhesiveness to conductor layers. The curable resin composition according to the present invention composes an epoxy compound (A), a triazole compound (B), and a tertiary amine compound (C) represented by the following formula (I). In formula (I), R.sup.1 and R .sup.2 each independently represent (R.sup.3O).sub.nH (wherein, R.sup.3 represents a C.sub.2-3 alkylene group and n is an integer of 1-3).

##STR00001##

The present invention relates to rapid-curing resin formulations as well as fiber-reinforced composite materials comprising the same and their use in the manufacture of molded articles, particularly where the manufacturing process requires high throughput and where resin formulations having consistent handling characteristics (e.g., tack and flexibility) would be preferable across normal to elevated laminating environments (as defined by temperatures between 20 C. and 60 C.). The present invention further relates to a manufacturing process for preparing an article, particularly a molded article, from a fiber-reinforced composite material comprising a rapid-curing resin formulation.

Provided is a film adhesive which is preferably used as a NCF, void-free, has excellent electrical connectivity and its high reliability, does not develop cracks easily, and has high surface flatness. Also provided is a semiconductor device in which the film adhesive according to the present invention is used as an NCF during the manufacture of the semiconductor device. The film adhesive according to the present invention contains (A) an epoxy resin; (B) a bisphenol F type phenoxy resin; (C) a phenol resin-based curing agent; (D) a modified imidazole compound; (E) a silica filler; (F) oxyquinoline; and (G) a butadiene-acrylonitrile-methacrylic acid copolymer. The content of component (A) is 19.3 to 33.8 parts by mass. The content of component (B) is 7.5 to 9.1 parts by mass. The content of component (D) is 1.915 to 5 parts by mass. The content of component (E) is 30 to 60 parts by mass. The content of component (F) is 2.5 to 10 parts by mass. The liquid epoxy resin of component (A) contains a phenol novolac type epoxy resin and a liquid epoxy resin. The ratio of phenol novolac type epoxy resin to the epoxy resin of component (A) is not less than 46%. The equivalent ratio of component (C) relative to component (A) is 0.25 to 0.75.

A process for preparing a reshapable thermoset resin material comprising curing epoxy resin wherein curing is carried out with (a) at least one imidazole compound and (b) at least one benzotriazole compound.

Amine-epoxy curing agents are disclosed including at least one saturated heterocyclic compound having two nitrogen heteroatoms according to formula (I) and at least one saturated fused bicyclic heterocyclic compound having three nitrogen heteroatoms according to formula (II):

##STR00001##

wherein X is independently selected from a hydrogen atom, a linear or branched C.sub.1 to C.sub.4 alkyl group and a substituted or un-substituted phenyl group, Y.sub.1 is a direct bond or a divalent polyethylene polyamine group having 1 to 8 nitrogen atoms or a divalent polyethylene polyamine derivative having 1 to 8 nitrogen atoms, Y.sub.2 is a direct bond or a divalent polyethylene polyamine group having 1 to 7 nitrogen atoms and R is independently a hydrogen atom or a group selected from C.sub.1-C.sub.8 linear, cyclic, and branched alkyl, alkenyl, and alkaryl groups.