An electrophotographic photosensitive member including a surface layer containing a specific polyester resin is provided. The polyester resin contains specific structures.

Copolyesters such as polyethylene terephthalate (PET) or polyethylene furanoate (PEF) modified with bifuran polyacids such as dimethyl-2,2′-bifuran-5,5′-dicarboxylate (BFE), 2,2′-bifuran-5,5′-dicarboxylic acid (BDA), or bis(2-hydroxyethyl)-2,2′-bifuran-5,5′-dicarboxylate (BHEB), and/or bifuran polyhydroxyls, may have improved properties such as glass transition temperature (T.sub.g), tensile modulus, barrier properties, crystallinity, and/or impact strength. Polyethylene terephthalate-co-bifuranoate (PETBF) has an improved T.sub.g. Also described are polyethylene furanoate-co-bifuranoates (PEFBF).

Copolyesters such as polyethylene terephthalate (PET) or polyethylene furanoate (PEF) modified with bifuran polyacids such as dimethyl-2,2′-bifuran-5,5′-dicarboxylate (BFE), 2,2′-bifuran-5,5′-dicarboxylic acid (BDA), or bis(2-hydroxyethyl)-2,2′-bifuran-5,5′-dicarboxylate (BHEB), and/or bifuran polyhydroxyls, may have improved properties such as glass transition temperature (T.sub.g), tensile modulus, barrier properties, crystallinity, and/or impact strength. Polyethylene terephthalate-co-bifuranoate (PETBF) has an improved T.sub.g. Also described are polyethylene furanoate-co-bifuranoates (PEFBF).

A polyarylate resin includes repeating units (1), (2), and (4).

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The polyarylate resin further includes a repeating unit (3) and a percentage of the number of repeats of the repeating unit (3) relative to the total number of repeats of each of the repeating units (1) and (3) is greater than 0% and less than 50%. Alternatively, the polyarylate resin does not include the repeating unit (3).

A polyarylate resin includes repeating units (1), (2), and (4).

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The polyarylate resin further includes a repeating unit (3) and a percentage of the number of repeats of the repeating unit (3) relative to the total number of repeats of each of the repeating units (1) and (3) is greater than 0% and less than 50%. Alternatively, the polyarylate resin does not include the repeating unit (3).

Polycarbonate block copolymers are provided, which have: (A) a polyester block of chemical formula 1; and (B) a polycarbonate block derived from a dihydric phenol of chemical formula 3 compound and phosgene. The copolymers may be prepared by (1) polymerizing ester oligomers to form a compound of chemical formula 1; and (2) copolymerizing the ester oligomer obtained in (1) with a polycarbonate oligomer prepared from a dihydric phenol compound of chemical formula 3 and phosgene, in the presence of a polymerization catalyst. The block copolymer may have a viscosity average molecular weight (Mv) of 10,000 to 200,000. The thermoplastic copolymer resins have excellent heat resistance, transparency, impact strength, and fluidity, and thus can be usefully applied in various products, including office devices, electric/electronic products, and automotive interior/exterior parts; ##STR00001##

The present invention relates to: (i) a resin composition having excellent thermal conductivity and capable of being processed into a thin-walled and flexible molded article, the resin composition containing: (a) a resin consisting of 40 to 60 mol % of a unit (A) having a biphenyl group, and 5 to 40 mol % of a linear unit (B), and 5 to 40 mol % of a linear unit (C), where a thermal conductivity of the resin itself is not less than 0.4 W/(m.Math.K); and (b) an inorganic filler having thermal conductivity of not less than 1 W/(m.Math.K), (ii) a heat-dissipating or heat-transferring resin material containing the resin composition, and (iii) a thermally conductive membrane containing the resin composition.

The present invention relates to: (i) a resin composition having excellent thermal conductivity and capable of being processed into a thin-walled and flexible molded article, the resin composition containing: (a) a resin consisting of 40 to 60 mol % of a unit (A) having a biphenyl group, and 5 to 40 mol % of a linear unit (B), and 5 to 40 mol % of a linear unit (C), where a thermal conductivity of the resin itself is not less than 0.4 W/(m.Math.K); and (b) an inorganic filler having thermal conductivity of not less than 1 W/(m.Math.K), (ii) a heat-dissipating or heat-transferring resin material containing the resin composition, and (iii) a thermally conductive membrane containing the resin composition.

The present invention concerns the use of a compound having the following formula (I), for the preparation of a polymer. The present invention also concerns the polymers obtained from polymerization of compound of formula (I), and their processes of preparation.

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The present invention concerns the use of a compound having the following formula (I), for the preparation of a polymer. The present invention also concerns the polymers obtained from polymerization of compound of formula (I), and their processes of preparation.

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