A high-temperature-stable spin-on-carbon (“SOC”) material that fills topography features on a substrate while planarizing the surface in a one-step, thin layer coating process is provided. The material comprises low molecular weight polyimides or diimides that are pre-imidized in solution rather than on the wafer. The SOC layers can survive harsh CVD conditions and are also SC1 resistant, especially on TiN and SiOx surfaces.

A thermoset barrier film including: a reaction product of the formulas (I), (II), (III), (IV), or a mixture thereof, as defined herein. Also disclosed are methods of making and using the thermoset barrier film, and devices incorporating the thermoset barrier film.

The present invention provides a polyimide film in which a parameter A for the relationship of the viscosity (V) of a polyamic acid solution, the number average molecular weight (Mn) of polyamic acid, and the thickness (T) of a polyimide film falls within a range from 0.4 to 1.13.

A polyimide (PI) substrate, including a glass substrate is provided, wherein a first PI layer is disposed over the glass substrate, and a second PI layer is disposed over the first PI layer. The first PI layer is formed with a first PI material, and the second PI layer is formed with a second PI material. Disposal of the second PI layer over the first PI layer allows for manual and complete peeling of the second PI layer from the first PI layer.

A polymer alloy composition including: (a) a fluoropolymer selected from fluorinated ethylene propylene (FEP), perfluoroalkoxy alkane (PFA), ethylene tetra-fluoroethylene (ETFE), and a terpolymer of ethylene, tetrafluoroethylene, and hexafluoropropylene (EFEP); (b) a compatibilizing agent; and (c) a polyether imide (PEI) or polyimide (PI). Also disclosed is a method of forming a thermoplastic alloy. The polymer alloy may be used to form various extruded workpieces including, for example, a bag, film, container, filament, food package, coating (such as a coating or jacketing for a wire), powder for powder electrostatic powder coating, powder for dispersions, compression molded and various injection molded parts.

A polyimide material, a preparing method thereof, and a use thereof are provided. The polyimide material employs a newly introduced 2,4-trifluoromethyl dianhydride with benzene rings and fluorine-containing p-phenylenediamine, and the phenylenediamine with the simple binding structure is used to design a molecular structure of a target polyimide material compound. A polyimide material is provided. By introducing a new molecular structure containing a dianhydride structure with fluorine and benzene rings, and combining a diamine structure, the target polyimide material with a low coefficient of thermal expansion (CTE) performance parameter is obtained.

The present invention relates to a liquid crystal aligning agent composition including a terminal modifier of a specific chemical structure together with a polyimide or a precursor polymer thereof.

The present invention aims to provide an adhesive composition that is easily separable by irradiation with light even after high-temperature processing at 300° C. or higher with an adherend fixed thereon, an adhesive tape including an adhesive layer formed of the adhesive composition, and a method for processing an electronic component. The present invention is an adhesive composition including: a reactive resin having an imide backbone and containing a double bond-containing functional group in a side chain or at an end; and a silicone compound or a fluorine compound.

A method for the purification of a bisphenol A dianhydride composition includes contacting the bisphenol A dianhydride composition with a halogenated solvent to form a solution, and one or more of filtering the solution to remove ionic species; washing the solution with aqueous media to remove ionic species; crystallizing bisphenol A dianhydride from the solution to remove ionic species; and contacting the solution with an adsorbent to remove ionic species. A purified bisphenol A dianhydride composition is also described. The bisphenol A dianhydride composition can be used in the preparation of a poly(etherimide), and poly (etherimides) made from the bisphenol A dianhydride composition can be useful for forming a variety of articles.

This disclosure relates to a polyimide polymer that includes the reaction product of: (a) at least one diamine selected from the group consisting of a diamine of Structure (Ia) and a diamine of Structure (Ib),

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(b) at least one diamine of Structure (II),

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(c) at least one tetracarboxylic acid dianhydride, and optionally (d) at least one compound containing a first functional group reactive with an amine or an anhydride and at least a second functional group selected from the group consisting of a substituted or unsubstituted alkenyl group and a substituted or unsubstituted alkynyl group. Each variable in the above formulas is defined in the specification.