An exemplary embodiment of the present application provides a polyimide resin in which the functional group represented by Chemical Formula 1 or 2 is bonded to at least one end of the polyimide resin.

The present invention relates to a resin composition containing a compound having a maleimido group, a divalent group having at least two imido bonds and a saturated or unsaturated divalent hydrocarbon group.

Provided herein are polyimide dispersants, as well as methods for producing polyimide dispersants. The polyimides can be defined by the formula below ##STR00001##
wherein A, individually for each occurrence, represents a cyclic diimide moiety represented by the structure below ##STR00002##
where B represents a cyclic moiety substituted with a first cyclic imide group and a second cyclic imide group; Y, individually for each occurrence, represents a bivalent linking group; L, individually for each occurrence, is absent or represents a cyclic imide group; R, individually for each occurrence, represents a polymeric tail; and n is an integer from 1 to 20.

A polyimide substrate, a manufacturing method thereof, and a display substrate having same are disclosed. The method for manufacturing the polyimide substrate comprises steps of: providing a diamine containing a dioxazole structure; polymerizing a fluorine-containing dianhydride with the diamine containing the dioxazole structure to form a polyamic acid containing oxazole and fluorine; and cyclodehydrating the polyamic acid containing oxazole and fluorine to produce a polyimide containing oxazole and fluorine, followed by forming the polyimide substrate by film formation of the polyimide containing oxazole and fluorine. Thus, a light transmission performance of the polyimide substrate is improved.

A method of making a biphenol dianhydride composition includes heating a first solution including a biphenol tetraacid of the formula (I) wherein Ra, Rb, p and q are as defined herein; at least one of sodium ions, potassium ions, calcium ions, zinc ions, aluminum ions, iron ions, phosphate ions, sulfate ions, chloride ions, nitrate ions, and nitrite ions; and a non-halogenated solvent. The first solution is heated under conditions effective to provide a second solution including the corresponding biphenol dianhydride, the at least one of sodium ions, potassium ions, calcium ions, zinc ions, aluminum ions, iron ions, phosphate ions, sulfate ions, chloride ions, nitrate ions, and nitrite ions, and the non-halogenated solvent.

##STR00001##

A thermoset barrier film including: a reaction product of the formulas (I), (II), (III), (IV), or a mixture thereof, as defined herein. Also disclosed are methods of making and using the thermoset barrier film, and devices incorporating the thermoset barrier film.

A high temperature resistant polyimide film and its preparation method. The present invention relates to a polyimide film and its preparation method and solves the problems of honeycomb's and skin panel's core adhesive—polyimide film with insufficient heat resistance, no climbing of bonding core structure and adhesive fillet formation. The high temperature resistant polyimide film is made by polyimide solution, inorganic filler modifier and interface coupling agent by the steps of: under specific temperature and stirring conditions, adding inorganic filler modifier and interface coupling agent to polyimide solution, stirring to obtain the adhesive agent; filtering and degassing the adhesive agent, casting to a stainless steel drum with carrier cloth and release paper to obtain a self-supporting film; then heating and annealing to obtain the final polyimide film. The present invention is applied to high temperature resistant polyimide film and its preparation method.

Provided is a curable composition having excellent workability and being capable of forming a cured product having excellent heat resistance. The curable composition of the present invention includes a compound represented by Formula (1) below and a solvent: In Formula (1) below, R.sup.1 and R.sup.2 each represent a curable functional group, and D.sup.1 and D.sup.2 each represent a single bond or a linking group. L represents a divalent group having a repeating unit containing a structure represented by Formula (I) below and a structure represented by Formula (II) below. In Formula (I) and Formula (II) below, Ar.sup.1 to Ar.sup.3 each represent a group in which two hydrogen atoms are removed from an aromatic ring structure or a group in which two hydrogen atoms are removed from a structure in which two or more aromatic rings are bonded through a single bond or a linking group. X represents —CO—, —S—, or —SO.sub.2—, and Y represents —S—, —SO.sub.2—, —O—, —CO—, —COO—, or —CONH—. n represents an integer of 0 or greater.

Provided is a detachable layer-forming composition which, for example, contains an organic solvent and a polyamic acid, both ends of which are derived from a diamine and sealed with an aromatic dicarboxylic acid, such as the polyamic acid represented by this formula.

##STR00001##

In the formula, X represents a tetravalent aromatic group, Y represents a divalent aromatic group, R.sup.1-R.sup.4 each independently represent a hydrogen atom, a C1-10 alkyl group, or a C6-20 aryl group, and m is a natural number.

A flexible electronic device containing a polyimide film exhibiting excellent C-V characteristics. The polyimide film is a film that shows a maximum gradient of 0.005N or more in a capacitance-voltage measurement of a laminate in which a polyimide film having a film thickness of 0.75 μm is formed on a silicon wafer having a resistance value of 4 Ωcm; the maximum gradient meaning a maximum value of an absolute value of a gradient in a normalized capacity-voltage curve during a third scan of forward direction scans; a capacity-voltage curve being measured by applying a direct current voltage is to the polyimide film with respect to the silicon wafer between a lowest voltage V1 and a highest voltage V2, and measuring capacitance while the direct current voltage is scanned in a forward direction and scanned in a negative direction; the normalized capacity-voltage curve is being normalized so that the capacity at the lowest voltage V1 is 1.