A flame-retardant polyimide molding material and a molded article including the flame-retardant polyimide molding material, where the flame-retardant polyimide molding material includes a semi-aromatic polyimide resin (A) and carbon fiber (B), and the flame-retardant polyimide molding material includes 15 to 80 mass % of the carbon fiber (B).

Amine-substituted copolymers that may include an amine-substituted pyrrolidine-2,5-dione moiety. Polyamic acids and polyimides, which may be formed by contacting an amine substituted copolymer with a dianhydride, or a dianhydride and a diamine. Articles, such as wires, having a surface on which a polyimide is disposed. Methods for forming polymers.

An article includes a composition including a high heat amorphous thermoplastic polymer having a glass transition temperature of greater than 180° C.; a poly(phenylene ether) oligomer; a flow promoter comprising a polyester, a poly (carbonate-ester), an aromatic poly ketone, poly(phenylene sulfide), or a combination thereof; and a mineral filler, wherein particular amounts of each component can be as defined herein. The article further includes a metal layer disposed on a surface of the composition. The articles of the present disclosure can be especially useful in consumer electronics applications.

A polyimide resin composition containing a polyimide resin (A) and a fluororesin (B), wherein the polyimide resin (A) contains a repeating structural unit represented by the following formula (1) and a repeating structural unit represented by the following formula (2), a content ratio of the repeating structural unit of the formula (1) with respect to the total of the repeating structural unit of the formula (1) and the repeating structural unit of the formula (2) is 20 to 70 mol %, and the fluororesin (B) has a weight loss percentage measured using a differential scanning calorimeter after heating from 100° C. to 450° C. at a heating rate of 10° C./min in an air atmosphere of 1% or less:

##STR00001##

wherein R.sub.1 represents a divalent group having from 6 to 22 carbon atoms containing at least one alicyclic hydrocarbon structure; R.sub.2 represents a divalent chain aliphatic group having from 5 to 16 carbon atoms; and X.sub.1 and X.sub.2 each independently represent a tetravalent group having from 6 to 22 carbon atoms containing at least one aromatic ring; and a molded article thereof.

Examples of the present disclosure provide fluoropolymers and methods for forming and using such fluoropolymers. Fluoropolymers include polyfluorobenzoxazines and polyfluoroimides. Methods for forming polyphthalonitriles are also provided. The present disclosure is further directed to compositions containing one or more fluoropolymers and one or more metal oxides.

The present invention provides curable polyimides with low color that are resistant to long term thermo-oxidative degradation. These materials, which include polyimides that are fully aromatic, are synthesized in anisole and are contemplated for use in high temperature applications such as in the aerospace industry and for use as encapsulants for light emitting diodes that will be exposed to high temperatures.

A polyimide resin composition includes a polyimide resin (A) including a repeating structural units of formulas (1) and (2). The content ratio of the repeating structural unit of the formula (1) with respect to the total of the repeating structural units of the formulas (1) and (2) is 20 to 70 mol %. The polyimide resin composition further includes a fatty acid metal salt (B) including a fatty acid having 12 to 36 carbon atoms and optionally having a hydroxy group and at least one of an alkali metal, an alkaline earth metal, and a transition metal:

##STR00001##

wherein R.sub.1 represents a divalent group having 6 to 22 carbon atoms containing at least one alicyclic hydrocarbon structure; R.sub.2 represents a divalent chain aliphatic group having 5 to 16 carbon atoms; and X.sub.1 and X.sub.2 each independently represent a tetravalent group having 6 to 22 carbon atoms containing at least one aromatic ring.

A polyimide precursor solution contains a polyimide precursor having a weight average molecular weight of 40,000 or more, and an aqueous solvent containing a tertiary amine compound and water, in which a viscosity of the polyimide precursor solution after a storage at 25° C. for 14 days is 50% or more and 200% or less with respect to a viscosity of the polyimide precursor solution before the storage.

The present invention provides a resin composition which is highly sensitive and exhibits high chemical resistance even in the case of being baked at a low temperature of 250° C. or less and can suppress the generation of outgas after curing. The present invention is a resin composition which contains (a) an alkali-soluble resin containing polyimide, polybenzoxazole, polyamide-imide, a precursor of any one of these compounds and/or a copolymer of these compounds and (b) an alkali-soluble resin having a monovalent or divalent group represented by the following general formula (1) in a structural unit and in which the modification rate of a phenolic hydroxyl group in the alkali-soluble resin (b) is 5% to 50%.

##STR00001##

(In general formula (1), O represents an oxygen atom. R.sup.1 represents a hydrogen atom or a hydrocarbon group which has 1 to 20 carbon atoms and may be substituted and R.sup.2 represents an alkyl group having 1 to 5 carbon atoms. s and t each independently represent an integer from 0 to 3. Provided that (s+t)≥1. d represents an integer from 0 to 2. u represents an integer from 1 to 2, and * represents a chemical bond.)

Provided is a polyimide powder composition containing a thermoplastic polyimide resin powder (A) and silica particles (B) having a volume average particle size D50 of 90 nm or less.