A hybrid thermoplastic-thermosettable resin composition may include a polymeric backbone formed from a thermoplastic unit, and at least one crosslinkable group bonded to the thermoplastic. A method of forming a hybrid thermoplastic-thermosettable resin composition may include reacting a thermoplastic to introduce a cross-linkable group to form the thermoplastic-thermosettable resin composition. A method of forming a hybrid thermoplastic-thermoset resin may include providing a hybrid thermoplastic-thermosettable resin composition comprising a polymeric backbone formed from a thermoplastic unit, and at least one crosslinkable group bonded to the thermoplastic; and curing the hybrid thermoplastic-thermosettable resin composition by an external stimulus to form the hybrid thermoplastic-thermoset resin.

The present invention provides a multilayer body of an inorganic substrate and a highly heat-resistant transparent film which has sufficient heat resistance and is able to be mechanically separated from the inorganic substrate after being subjected to various processes on the inorganic substrate since the adhesion between the highly heat-resistant transparent film and the inorganic substance is adequately weak. A multilayer body of a highly heat-resistant transparent film and an inorganic substrate, wherein: an adhesive is not substantially used; the peel strength between the highly heat-resistant transparent film and the inorganic substrate is 0.3 N/cm or less; and the CTE of the highly heat-resistant transparent film is 50 ppm/K or less.

The present invention relates to a method for manufacturing a polyimide-powder composite separator using water and a polyimide-powder composite separator manufactured by the method, and is environmentally friendly since an organic solvent is not used in the overall process of manufacturing the composite separator and has advantageous effects in terms of time, cost, and manufacturing process since a high temperature/high pressure environment is not required.

A liquid crystal alignment agent and a preparation method thereof, a liquid crystal alignment film and a preparation method thereof, and a liquid crystal cell are provided. A piperazine monomer is added to a liquid crystal alignment agent, a bulk resistance value and a surface resistance value of a liquid crystal alignment agent material can be reduced, and the ability of the liquid crystal alignment agent material to release residual charges can be effectively improved, thereby increasing the reliability and stability of an electronic product. The liquid crystal cell using the liquid crystal alignment agent has advantages such as high voltage holding ratio (VHR) and low residual voltage.

The present disclosure provides a polyimide polymer, which includes a repeating unit represented by formula (I). Formula (I) is defined as in the specification. The present disclosure further provides a polyimide mixture and a polyimide film, wherein the polyimide mixture is prepared by the polyimide polymer, and the polyimide film is prepared by the polyimide mixture.

The present disclosure provides a low-dissipation flexible copper clad laminate, which includes a copper foil and a polyimide film. The polyimide film is attached to the copper foil. The polyimide film includes a polyimide, and the polyimide has a structure represented by formula (I). Formula (I) is defined as in the specification.

A polyimide precursor composition includes a solvent mixture containing an alcohol solvent and a water-insoluble solvent that is at least one selected from the solvent group consisting of water-insoluble ketones and water-insoluble ethers; and a polyimide precursor dissolved in the solvent mixture.

Provided are a polyamic acid solution that can be formed into a film without peeling even when the film is thick and can be stably stored at room temperature, and a laminate that can be suitably used for production of a flexible device. In the alkoxysilane-modified polyamic acid solution according to the present invention, an additive amount of an alkoxysilane compound that contains an amino group is more than 0.050 parts by weight and less than 0.100 parts by weight.

The present invention provides a polyimide film in which a parameter A for the relationship of the viscosity (V) of a polyamic acid solution, the number average molecular weight (Mn) of polyamic acid, and the thickness (T) of a polyimide film falls within a range from 0.4 to 1.13.

A polyimide precursor-containing aqueous composition contains a polyimide precursor, resin particles having a polyalkylene oxide group, and a solvent containing water and an aprotic polar solvent.