The present invention relates to a thermoplastic resin composition and a molded product using same, the thermoplastic resin composition including 100 parts by weight of a base resin including: (A) 65 to 75 wt % of a polycarbonate resin; (B) 20 to 30 wt % of a polybutyleneterephthalate resin; and (C) 3 to 7 wt % of a polyethylene terephthalate resin, (D) 3 to 7 parts by weight of a methyl methacrylate-butadiene-styrene graft copolymer, and (E) 1 to 5 parts by weight of a polyolefin-based polymer having a glycidyl group.

A conductive polyester laminated structure and a conductive packaging material are provided. The conductive polyester laminated structure includes a main structure supporting layer and two conductive layers. Each of the conductive layers is formed of a conductive polyester composition. The conductive polyester composition includes a polyester base material and a conductive reinforcing material. The conductive reinforcing material includes multiple carbon nanotubes, and the carbon nanotubes are dispersed in the polyester base material. In each carbon nanotube, a length of the carbon nanotube is defined as L, a diameter of the carbon nanotube is defined as D and is between 1 nanometer and 30 nanometers, and an L/D value of the carbon nanotube is between 300 and 2,000. The carbon nanotubes are in contact with each other to form multiple contact points, so that the conductive polyester composition has a surface impedance of not greater than 10.sup.7 Ω/sq.

A conductive polyester laminated structure and a conductive packaging material are provided. The conductive polyester laminated structure includes a main structure supporting layer and two conductive layers. Each of the conductive layers is formed of a conductive polyester composition. The conductive polyester composition includes a polyester base material and a conductive reinforcing material. The conductive reinforcing material includes multiple carbon nanotubes, and the carbon nanotubes are dispersed in the polyester base material. In each carbon nanotube, a length of the carbon nanotube is defined as L, a diameter of the carbon nanotube is defined as D and is between 1 nanometer and 30 nanometers, and an L/D value of the carbon nanotube is between 300 and 2,000. The carbon nanotubes are in contact with each other to form multiple contact points, so that the conductive polyester composition has a surface impedance of not greater than 10.sup.7 Ω/sq.

A thermoplastic resin composition of the present invention comprises: about 100 parts by weight of a polyester resin; about 15 to about 100 parts by weight of glass fibers; and about 2 to about 20 parts by weight of a modified olefin copolymer, the modified olefin copolymer comprising an epoxy modified olefin copolymer and a maleic anhydride modified olefin copolymer, wherein the weight ratio of the epoxy modified olefin copolymer and the maleic anhydride modified olefin copolymer is about 1:0.3 to about 1:3. The thermoplastic resin composition has excellent impact resistance, chemical resistance, and the like.

A thermoplastic resin composition of the present invention comprises: about 100 parts by weight of a polyester resin; about 15 to about 100 parts by weight of glass fibers; and about 2 to about 20 parts by weight of a modified olefin copolymer, the modified olefin copolymer comprising an epoxy modified olefin copolymer and a maleic anhydride modified olefin copolymer, wherein the weight ratio of the epoxy modified olefin copolymer and the maleic anhydride modified olefin copolymer is about 1:0.3 to about 1:3. The thermoplastic resin composition has excellent impact resistance, chemical resistance, and the like.

Provided is an epoxy resin composition that can achieve excellent low dielectric characteristics and high adhesive strength to metal. Specifically, provided is an epoxy resin composition comprising organic fine particles and an epoxy resin having a specific structure.

Provided is an epoxy resin composition that can achieve excellent low dielectric characteristics and high adhesive strength to metal. Specifically, provided is an epoxy resin composition comprising organic fine particles and an epoxy resin having a specific structure.

A thermoplastic composition includes 25 to 95 weight percent of a poly(etherimide); 5 to 70 weight percent of a polymer different from the poly(etherimide) that is partially miscible with the poly(etherimide); and 1 to 15 weight percent of a mineral filler having an average particle size of 0.1 to 10 micrometers; wherein each weight percent is based on the total weight of the composition. The thermoplastic composition can be prepared by melt-mixing the components of the composition. Articles including the composition are also described.

A thermoplastic composition includes 25 to 95 weight percent of a poly(etherimide); 5 to 70 weight percent of a polymer different from the poly(etherimide) that is partially miscible with the poly(etherimide); and 1 to 15 weight percent of a mineral filler having an average particle size of 0.1 to 10 micrometers; wherein each weight percent is based on the total weight of the composition. The thermoplastic composition can be prepared by melt-mixing the components of the composition. Articles including the composition are also described.

The invention provides a polyolefin composition comprising (i) a polyolefin (A) comprising epoxy groups; and (ii) a polyolefin (B) comprising carboxylic acid groups and/or precursors thereof, with the proviso that at least one of (A) and (B) is polyethylene. Preferably one of (A) and (B) is a low density polyethylene (LDPE) and the other is a polypropylene.