Patent classifications
C08L23/0884
THERMOPLASTIC RESIN COMPOSITION, METHOD OF PREPARING THE SAME, AND MOLDED ARTICLE INCLUDING THE SAME
The present invention relates to a thermoplastic resin composition, a method of preparing the same and a molded article including the same. More particularly, the thermoplastic resin composition includes a polycarbonate resin having a limited melt flow index, a polyorganosiloxane-polycarbonate resin, a vinyl cyanide compound-conjugated diene rubber-aromatic vinyl compound copolymer, a polyester resin and an epoxy group-containing copolymer in predetermined weight ratios.
THERMOPLASTIC RESIN COMPOSITION, METHOD OF PREPARING THE SAME, AND MOLDED ARTICLE INCLUDING THE SAME
The present invention relates to a thermoplastic resin composition, a method of preparing the same and a molded article including the same. More particularly, the thermoplastic resin composition includes a polycarbonate resin having a limited melt flow index, a polyorganosiloxane-polycarbonate resin, a vinyl cyanide compound-conjugated diene rubber-aromatic vinyl compound copolymer, a polyester resin and an epoxy group-containing copolymer in predetermined weight ratios.
HOT MELT COMPOSITION IN THE FORM OF A FILM FOR USE IN THIN FILM PHOTOVOLTAIC MODULES
The invention features a hot melt composition in the form of a film including from 40% by weight to 80% by weight of a non-functionalized alkyl acrylate, from 14% by weight to 50% by weight of an olefin polymer, from 2% by weight to 15% by weight of a first functionalized polymer comprising a functional group selected from the group consisting of epoxides and carboxylic anhydrides, and from 2% by weight to 15% by weight of a second functionalized polymer comprising a functional group capable of reacting with the functional group of the first functionalized polymer.
The hot melt composition in the form of a film has found utility as an encapsulant for thin film photovoltaic modules.
HOT MELT COMPOSITION IN THE FORM OF A FILM FOR USE IN THIN FILM PHOTOVOLTAIC MODULES
The invention features a hot melt composition in the form of a film including from 40% by weight to 80% by weight of a non-functionalized alkyl acrylate, from 14% by weight to 50% by weight of an olefin polymer, from 2% by weight to 15% by weight of a first functionalized polymer comprising a functional group selected from the group consisting of epoxides and carboxylic anhydrides, and from 2% by weight to 15% by weight of a second functionalized polymer comprising a functional group capable of reacting with the functional group of the first functionalized polymer.
The hot melt composition in the form of a film has found utility as an encapsulant for thin film photovoltaic modules.
VIBRATION-DAMPING MOLDED ARTICLE AND METHOD FOR PRODUCING RESIN COMPOSITION FOR VIBRATION-DAMPING MOLDED ARTICLE
A molded article which exhibits an improved vibration-damping effect. The vibration-damping molded article includes a resin composition including at least a thermoplastic resin A, an olefin-based elastomer B having a reactive functional group, and an inorganic filler C, wherein the inorganic filler C is coated with the olefin-based elastomer B.
VIBRATION-DAMPING MOLDED ARTICLE AND METHOD FOR PRODUCING RESIN COMPOSITION FOR VIBRATION-DAMPING MOLDED ARTICLE
A molded article which exhibits an improved vibration-damping effect. The vibration-damping molded article includes a resin composition including at least a thermoplastic resin A, an olefin-based elastomer B having a reactive functional group, and an inorganic filler C, wherein the inorganic filler C is coated with the olefin-based elastomer B.
Low-dielectric resin composition, low-dielectric resin/metal composite material and preparation method thereof, and electronic equipment
A resin composition comprises, based on 100% by weight of the resin composition: 45-70 wt % of a main resin, 20-45 wt % of a chopped glass fiber, 1-3 wt % of a toughening resin, 0.2-0.5 wt % of an unmodified glycidyl methacrylate, and 0-10 wt % of an auxiliaries. The main resin is selected from at least one of PBT resin and PPS resin. The chopped glass fiber has a dielectric constant of 4.0 to 4.4 at 1 MHz.
Low-dielectric resin composition, low-dielectric resin/metal composite material and preparation method thereof, and electronic equipment
A resin composition comprises, based on 100% by weight of the resin composition: 45-70 wt % of a main resin, 20-45 wt % of a chopped glass fiber, 1-3 wt % of a toughening resin, 0.2-0.5 wt % of an unmodified glycidyl methacrylate, and 0-10 wt % of an auxiliaries. The main resin is selected from at least one of PBT resin and PPS resin. The chopped glass fiber has a dielectric constant of 4.0 to 4.4 at 1 MHz.
High stiff thermoplastic compositions for thin-wall structures
A thermoplastic composition includes: from about 29 wt % to about 49 wt % of a thermoplastic polymer component including a first thermoplastic polymer consisting of polybutylene terephthalate and a second thermoplastic polymer consisting of polycarbonate, polyethylene terephthalate, copolymers thereof, or a combination thereof; from about 1 wt % to about 30 wt % of a component comprising a polyester elastomer, an ethylene/alkyl acrylate/glycidyl methacrylate terpolymer compatibilizer, or a combination thereof; and from about 50 wt % to about 70 wt % of a ceramic fiber component including ceramic fibers. The first thermoplastic polymer is present the composition in a ratio of at least 2:1 as compared to the second thermoplastic polymer. Articles including the thermoplastic composition are also described.
High stiff thermoplastic compositions for thin-wall structures
A thermoplastic composition includes: from about 29 wt % to about 49 wt % of a thermoplastic polymer component including a first thermoplastic polymer consisting of polybutylene terephthalate and a second thermoplastic polymer consisting of polycarbonate, polyethylene terephthalate, copolymers thereof, or a combination thereof; from about 1 wt % to about 30 wt % of a component comprising a polyester elastomer, an ethylene/alkyl acrylate/glycidyl methacrylate terpolymer compatibilizer, or a combination thereof; and from about 50 wt % to about 70 wt % of a ceramic fiber component including ceramic fibers. The first thermoplastic polymer is present the composition in a ratio of at least 2:1 as compared to the second thermoplastic polymer. Articles including the thermoplastic composition are also described.