The present invention relates to a method for manufacturing composite solder balls that are metallized on the surface and calibrated, these balls comprising a core consisting of a spherical support particle of diameter Do made of expanded polystyrene and having an intergranular porosity of at least 50%, and a shell covering said support particle and formed by a plurality of metallic surface layers. The present invention also relates to balls that can be obtained by the method according to the invention, as well as to the use thereof for the assembly of electronic boards.

In one example, an electronic device housing may include a substrate, a micro-arc oxidation layer formed on a surface of the substrate, and an electroless plating layer formed on the micro-arc oxidation layer. Example electroless plating layer may be one of an electroless tin plating layer and an electroless silver plating layer. Further, the electronic device housing may include an electrophoretic deposition layer formed on the electroless plating layer.

A method for manufacturing a wiring substrate includes forming a conductor layer including first and second pads, forming a resin insulating layer on the conductor layer, forming, in the insulating layer, a first opening exposing the first pad and a second opening exposing the second pad, forming a covering layer on the insulating layer such that the covering layer covers the first and second openings, forming a third opening in the covering layer such that the third opening communicates with the first opening and the first pad is exposed in the third opening, forming, on a surface of the first pad, a protective film formed of material different from material forming the conductor layer, removing the covering layer from the insulating layer, and forming a conductor post on the second pad such that the conductor post is formed of material that is same as the material forming the conductor layer.

The problem of the present invention is to provide a plating stack (a stack of plating films) for applying on surface of conductor circuits or the like, the plating stack can maintain high bond strength when solder is bonded on that and can be produced stably.

In the method for producing a plating stack of the present invention, a plating layer A mainly composed of a second metal is deposited on an object to be plated S mainly composed of a first metal by a substitution reaction, then a plating layer B mainly composed of palladium is deposited on the plating layer A, and then a plating layer C mainly composed of nickel is deposited on the plating layer B by a redox reaction. The first metal is, for example, copper. The second metal is, for example, gold, platinum or silver.

The electroless gold plating bath includes a gold sulfate, a thiosulfate, ascorbic acid compounds, and hydrazine compounds, the hydrazine compounds being at least one selected from the group consisting of adipic dihydrazide, propionic hydrazide, hydrazine sulfate, hydrazine monohydrochloride, hydrazine dihydrochloride, hydrazine carbonate, hydrazine monohydrate, sebacic dihydrazide, dodecanediohydrazide, isophthalic dihydrazide, hydrazide, 3-hydro-2-naphtboic hydrazide benzophenone hydrazone, phenylhydrazine, benzylhydrazine monohydrochloride, methylhydrazine sulfate, and isopropylhydrazine hydrochloride.

A sheet material includes a resin layer containing a binder and polypyrrole particles, an electroless plating film provided on the side of one main surface of the resin layer and including first electroless plating films and a second electroless plating film, and a transparent base material provided on the side of the other main surface of the resin layer.

In a preferred embodiment, there is provided a modified fabric composition, the composition comprising a fabric member and an electroactive member for storing energy, wherein the fabric member comprises a fabric framework defining a deformable plane and a plurality of projections extending at an angle from the plane, and wherein the electroactive member is coupled to at least one of the projections.

In the method for producing a plating stack, a plating layer A mainly composed of a second metal is deposited on an object to be plated S mainly composed of a first metal by a substitution reaction, then a plating layer B mainly composed of a third metal is deposited on the plating layer A, and then a plating layer C mainly composed of the second metal, the third metal, or a fourth metal is deposited on the plating layer B by a redox reaction. A concrete configuration of plating layers includes, for example, the plating layer A is gold, platinum or silver, the plating layer B is palladium, and the plating layer C is palladium.

The present invention aims to provide resin particles that have excellent heat resistance and that, when used as base particles of conductive particles, are applicable to mounting by thermocompression bonding at low pressure to produce a connection structure having excellent connection reliability. The present invention also aims to provide conductive particles, a conductive material, and a connection structure each including the resin particles. Provided are resin particles having a 5% weight loss temperature of 350° C. or higher, a 10% K value at 25° C. of 100 N/mm.sup.2 or more and 2,500 N/mm.sup.2 or less, and a 30% K value at 25° C. of 100 N/mm.sup.2 or more and 1,500 N/mm.sup.2 or less.

Provided is a molded circuit component 300 in which a metal layer 200 is formed with high adhesion by giving a degree of freedom to a base material 100. In the molded circuit component 300 in which the metal layer 200 is formed in a processing region 110 in the base material 100, a plurality of recesses 120 each having a plurality of holes 130 are continuously formed in the processing region 110, the processing region 110 has a ratio of a width to a maximum depth with respect to a surface of the base material 100 of 10:1 to 6:1, the processing region 110 is formed to have a width in a range of 20 μm to 200 μm, and formed to have a maximum depth with respect to the surface of the base material 100 in a range of 2 μm to 30 μm, the metal layer 200 can be formed in the processing region 110 by laminating using a plating method, and a catalyst that reacts with a metal that forms the metal layer 200 at the time of the lamination is attached to the holes 130 and the recesses 120.