A wear resistant coated piston ring for an engine is provided. The piston ring includes a coating disposed on a ring body. The coating includes initially includes alternating first and second layers, wherein the first layers include trivalent chromium, and the second layers include nickel and phosphorous. The first layers are applied by depositing a trivalent chromium electrolyte, specifically Cr3+ electrolyte. The second layers are applied by electroless deposition. The coating is left in the as-is condition and is not heat treated before being disposed on a piston and then in an engine. The coating is naturally exposed to heat while the engine is running, and this heat causes the chromium, nickel, and phosphorous of the layers to diffuse and form a surface layer on a compound layer. The surface layer includes trivalent chromium, and the compound layer includes a ternary compound of chromium, nickel, and phosphorous.

A method for manufacturing a surge absorbing device is provided. The method includes providing an elongate ceramic tube having a hollow space defined therein and having open and opposite first and second end; forming a first plating layer and a second plating layer on the first end and the second end, respectively; placing a surge absorbing element within the hollow space within the ceramic tube; disposing first and second brazing rings on the first plating layer and the second plating layer, respectively; disposing first and second sealing electrodes on the first and second brazing rings respectively; and melting the first and second brazing rings in an inert gas atmosphere to attach the first and second sealing electrodes onto the first plating layer and the second plating layer, respectively.

A method for fabricating a metallic wire mesh touch sensor with reduced visibility. A metallic wire mesh is formed on a transparent substrate such that the surface of the metallic wires is roughened or textured, so as to cause high scattering of incident light, thereby minimizing specularly reflected light towards the user. The metal lines are formed over patterned catalytic photoresist. The rough or textured surface of the metallic wires is achieved by roughening or texturing the catalytic photoresist, by selecting parameters of electronless plating of copper, or both. An RMS surface roughness of about 50 nm would scatter approximately 70% of incident cyan light incident at 30°.

Provided is an aluminum alloy substrate for a magnetic disk that includes an aluminum alloy containing 0.4 to 3.0 mass % (hereinafter abbreviated as “%”) of Fe, 0.005% to 1.000% of Cu, and 0.005% to 1.000% of Zn, with a balance of Al and unavoidable impurities. This substrate has a ratio A/B of 0.70 or more, where A indicates a distribution density of Al—Fe intermetallic compound particles having maximum diameters of 10 μm or more and less than 16 μm, and B indicates a distribution density of Al—Fe intermetallic compound particles having maximum diameters of 10 μm or more. The distribution density of Al—Fe intermetallic compound particles having maximum diameters of 40 μm or more is at most one per square millimeter. Also provided are a method of fabricating this aluminum alloy substrate for a magnetic disk and a magnetic disk composed of the aluminum alloy substrate for a magnetic disk.

A semiconductor wafer suppressed in voids produced in the interface between a passivation film and an electroless nickel plating film, and configured such that an electrode pad is entirely covered by the electroless nickel plating film. The semiconductor wafer includes, on a substrate, an electrode pad and a passivation film covering the upper surface of the substrate and an opening from which the electrode pad is exposed. The semiconductor wafer sequentially includes, on the electrode pad, an electroless nickel plating film, an electroless palladium plating film and an electroless gold plating film. A void, present in the interface between the passivation film and the electroless nickel plating film, has a length from the forefront of the void to the surface of the electrode pad of 0.3 μm or more and a width of 0.2 μm or less. The electrode pad is entirely covered by the electroless nickel plating film.

The present invention provides a bump that can prevent diffusion of a metal used as a base conductive layer of the bump into a surface of an Au layer or an Ag layer. A conductive bump of the present invention is a conductive bump formed on a substrate. The conductive bump comprises, at least in order from the substrate: a base conductive layer; a Pd layer; a Pt layer; and an Au layer or an Ag layer having directly contact with the Pd layer, wherein a diameter of the conductive bump is 20 μm or less.

Provided is a method for producing a porous copper foil. The method includes forming a release layer on a metal carrier, growing copper islands on the metal carrier formed with the release layer by electroless copper plating, forming a porous copper thin layer by copper electroplating, and peeling off the porous copper thin layer from the release layer.

A method for forming a self-forming barrier in a feature of a substrate is provided, including the following operations: depositing a metallic liner in the feature of the substrate, the metallic liner being deposited over a dielectric of the substrate; depositing a zinc-containing precursor over the metallic liner; performing a thermal soak of the substrate; repeating the depositing of the zinc-containing precursor and the thermal soak of the substrate for a predefined number of cycles; wherein the method forms a zinc-containing barrier layer at an interface between the metallic liner and the dielectric.

In a preferred embodiment, there is provided a modified fabric composition, the composition comprising a fabric member and an electroactive member for storing energy, wherein the fabric member comprises a fabric framework defining a deformable plane and a plurality of projections extending at an angle from the plane, and wherein the electroactive member is coupled to at least one of the projections.

The silver-coated silicone rubber particles according to the present invention are each formed by providing a first coating layer comprising silicon or a silicon compound on the surface of a silicone rubber particle and further providing a second coating layer comprising silver on the surface of the first coating layer. In a conductive paste containing the silver-coated silicone rubber particles, the silver-coated silicone rubber particles are dispersed evenly.