A conductive nanowire film based on a high aspect-ratio metal is disclosed. The nanowire film is produced by inducing metal reduction in a concentrated surfactant solution containing metal precursor ions, a surfactant and a reducing agent. The metal nanostructures demonstrate utility in a great variety of applications.

This invention relates generally to uses of novel nanomaterial composition and the systems in which they are used, and more particularly to nanomaterial compositions generally comprising carbon and a metal, which composition can be exposed to pulsed emissions to react, activate, combine, or sinter the nanomaterial composition. The nanomaterial compositions can alternatively be utilized at ambient temperature or under other means to cause such reaction, activation, combination, or sintering to occur.

A dyeing system includes a conveyance device, a reader, a dye fixing device, and a controller. The conveyance device conveys a conveyance unit including the resin body. The reader reads information relating to the conveyance unit. The dye fixing device heats the resin body in the conveyance unit conveyed by the conveyance device and fixes a dye adhering to a surface of the resin body, on the resin body. The controller acquires a parameter for a process executed to the resin body in the conveyance unit, based on the information read by the reader. The controller controls the dye fixing device based on the acquired parameter.

The present disclosure provides a high-temperature resistant nano-copper produced by laser direct writing, a preparation method and an application thereof. The high-temperature resistant nano-copper exhibits excellent oxidation resistance, thermal stability and superior conductivity. In this disclosure, the preparation is simple, and the nano-copper oxide ink can be stored for extended periods without being affected by oxidation. It is suitable for various manufacturing processes including printing, coating, and other similar methods. Moreover, based on laser direct writing, the processing efficiency is high, enabling the one-step integration of multi-performance of the high-temperature resistant nano-copper. The high-temperature resistant nano-copper described in the present disclosure can be used as an interconnection circuit in an integrated sensor system based on all-laser in-situ direct writing, and can be widely applied in fields of aerospace, automobile, electronics, etc.

An apparatus for manufacturing a display apparatus is provided. The apparatus includes a stage that has a first surface and a second surface. A display substrate is arranged on the first surface, and the second surface is opposite to the first surface. The apparatus also includes a jig facing the second surface, a heat transfer unit arranged on the jig and including a protrusion pin protruding toward the second surface, and a laser unit configured to irradiate a laser beam to the heat transfer unit.

An apparatus for manufacturing a display apparatus is provided. The apparatus includes a stage that has a first surface and a second surface. A display substrate is arranged on the first surface, and the second surface is opposite to the first surface. The apparatus also includes a jig facing the second surface, a heat transfer unit arranged on the jig and including a protrusion pin protruding toward the second surface, and a laser unit configured to irradiate a laser beam to the heat transfer unit.