A substrate liquid processing apparatus 1 includes a substrate holding unit 52 configured to hold a substrate W; a processing liquid supply unit 53 configured to supply a processing liquid L1 onto a top surface of the substrate W held by the substrate holding unit 52; and a cover body 6 configured to cover the substrate W. Here, the cover body 6 includes a ceiling unit 61 disposed above the substrate W, a sidewall unit 62 downwardly extended from the ceiling unit 61,and a heating unit 63 provided at the ceiling unit 61 and configured to heat the processing liquid L1 on the substrate W. The sidewall unit 62 of the cover body 6 is placed at an outer periphery side of the substrate W when the processing liquid L1 on the substrate W is heated.

A roll-to-roll electroless plating system including a reservoir containing a plating solution. A web advance system advances a web of substrate though the plating solution in the reservoir along a web advance direction, wherein a plating substance in the plating solution is plated onto predetermined locations on a surface of the web of substrate. A pump circulates plating solution from an output of the reservoir to an inlet of the reservoir located below the web of substrate. A spreader duct includes a channel that is in fluidic communication with the inlet of the reservoir, wherein the channel is positioned below the web of substrate and includes at least one outlet disposed beyond the first edge or the second edge of the web of substrate and has no outlets disposed immediately below the web of substrate.

A roll-to-roll electroless plating system including a sump and a pan containing a plating solution. A web advance system advances a web of substrate though the plating solution in the pan along a web advance direction, wherein a plating substance in the plating solution is plated onto predetermined locations on a surface of the web of substrate. A pan-replenishing pump moves plating solution from the sump to an inlet of the pan through a pipe connected to an outlet of the pan-replenishing pump, the inlet of the pan being located below the web of substrate. A spreader duct includes a channel that is in fluidic communication with the inlet of the pan, wherein the channel is positioned below the web of substrate and includes at least one outlet disposed beyond the first edge or the second edge of the web of substrate.

A substrate processing apparatus includes one or more substrate processing units 11 to 18 each processing a substrate 3 with a processing fluid; processing fluid supply units 19 and 20 supplying the heated processing fluid to the substrate processing units 11 to 18; and a controller 21 controlling the processing fluid supply units 19 and 20. The processing fluid supply units 19 and 20 include a storage tank 35 storing the processing fluid; a heating heat exchanger 51 heating the processing fluid; and a supply path 52 supplying the processing fluid to the substrate processing units 11 to 18. The supply path 52 includes a bypass path 71 bypassing the heating heat exchanger 51 at an upstream of the substrate processing units 11 to 18. The processing fluid heated by the heating heat exchanger 51 and the processing fluid supplied from the bypass path 71 are mixed to be supplied.

A plating or coating method for producing a metal-ceramic composite coating on a substrate is provided. The method

N comprises adding a sol of a ceramic phase to a plating solution or electrolyte and controlling the pH, degree of mixing, and/or temperature of the plating solution or electrolyte. An item or surface comprising a substrate and a metal-ceramic composite coating on the substrate, the metal-ceramic composite coating comprising a ceramic phase of dispersed amorphous ceramic particles having an average diameter of from 1 to 100 nm is also provided.

The present invention relates to an apparatus (1) for the electroless metallization of a target surface of at least one workpiece (5), having a vessel (10) to accommodate a metallization solution having an inlet (15) and an outlet (16) for the metallization solution, and a holder (20) for accommodating the at least one workpiece (5) and can be arranged within the vessel (10), wherein at least one diffuser plate (30) is provided between the at least one inlet (15) and the holder (20) and has a multitude of diffuser openings (35) spaced apart in a plane of a plate (E), and wherein a movement device (40) is provided, which can move the diffuser plate (30) in at least one spatial direction in the vessel (10). The present invention further relates to a method for the electroless metallization of the target surface of the at least one workpiece (5).

A substrate is efficiently cleaned.

A plating module 400 includes: a plating tank 410 configured to accommodate a plating solution; a substrate holder 440 configured to hold a substrate Wf with a surface to be plated Wf-a facing downward; a rotation mechanism 446 configured to rotate the substrate holder 440; an inclination mechanism 447 configured to incline the substrate holder 440; and a substrate cleaning member 472 for cleaning the surface to be plated Wf-a of the substrate Wf held by the substrate holder 440. The substrate cleaning member 472 is configured to discharge a cleaning liquid to the surface to be plated Wf-a of the substrate Wf rotated by the rotation mechanism 446 from a position corresponding to a lower end toward a position corresponding to an upper end of the substrate Wf inclined by the inclination mechanism 447.

A plating apparatus 20 includes a substrate holding device 110 configured to hold and rotate the substrate 2; a first discharge device 30 configured to discharge a plating liquid toward the substrate 2 held on the substrate holding device 110; and a top plate 21 that is provided above the substrate 2 and has an opening 22. The first discharge device 30 includes a first discharge unit 33 configured to discharge the plating liquid toward the substrate 2, and the first discharge unit 33 is configured to be moved between a discharge position where the plating liquid is discharged and a standby position where the plating liquid is not discharged. Further, the first discharge unit 33 is configured to be overlapped with the opening 22 of the top plate 21 at the discharge position.

The disclosure relates to a distribution system for a process fluid for a chemical and/or electrolytic surface treatment of a substrate, comprising: a distribution body, and a substrate holder, wherein the substrate holder has a substrate holder length (L) and a substrate holder width (W) and is configured to hold the substrate to be treated, wherein the distribution body comprises several openings for a process fluid and/or an electric current, wherein the distribution body and the substrate holder are moveable relative to each other, wherein the distribution body has a distribution body length (l) and a distribution body width (w), and wherein the distribution body length (l) is smaller than the substrate holder length (L).

The present disclosure is directed to a monitoring system for a plating process using a monitoring device including a metrology component for collecting agitation intensity data on at least one agitation component within a plating equipment and transferring the collected agitation intensity data to a process control station.