Electrically-conductive silver metal can be provided in a thin film or pattern on a substrate from a silver complex having reducing silver ions and represented by:
(Ag.sup.+).sub.a(L).sub.b(P).sub.c (I)
wherein L represents an -oxy carboxylate; P represents a 5- or 6-membered N-heteroaromatic compound; a is 1 or 2; b is 1 or 2; and c is 1, 2, 3, or 4, provided that when a is 1, b is 1, and when a is 2, b is 2. The silver complex is mixed in a hydroxy-free, nitrile-containing aprotic solvent with a polymer that is either (i) a hydroxy-containing cellulosic polymer or (ii) a non-cellulosic acrylic polymer having a halo- or hydroxy-containing side chain. The reducible silver ions in the a thermally sensitive thin film or pattern can be thermally converted to electrically-conductive metallic silver under suitable heating conditions to provide a product article that can be used in various devices.

A surface-treated material of the present disclosure has a conductive substrate, and a surface treatment film which includes at least one layer of metal layers and is formed on the conductive substrate. The surface treatment film is a plating film. The surface treatment film is formed on a whole surface or a part of the conductive substrate through a zinc-containing layer that contains zinc as a main component and has a thickness of 50 nm or less, or is formed on the conductive substrate without through the zinc-containing layer. The surface-treated material has a ratio of a contact area to a test area of 85% or more as measured according to a tape test method defined in JIS H 8504: 1999.

The instant disclosure provides a self-adsorbed catalyst composition, a method for preparing the self-adsorbed catalyst composition and a method for manufacturing an electroless plating substrate. The self-adsorbed catalyst composition includes colloidal nanoparticles and a silane compound. The colloidal nanoparticles include palladium nanoparticles and capping agents enclosing the palladium nanoparticles. The silane compound has at least an amino group, and an interaction is established between the amino group of the silane compound and the colloidal nanoparticle.

A plating solution for electroless plating is disclosed, the solution including a metal salt, a reducing agent, a complexing agent, and a dispersion including polytetrafluoroethylene (PTFE) particulate matter and at least one particulate matter stabilizer, where said dispersion includes 400 parts per million or less of perfluorooctanoic acid (PFOA), and said dispersion is usable for an electroless plating bath to form a coating including PTFE particulate matter on an article.

A non-aqueous silver precursor composition contains at least 1 weight % of one or more (a) polymers that are certain cellulosic polymers; (b) reducible silver ions; and (c) an organic solvent medium consisting of: (i) a hydroxylic organic solvent having an -hydrogen atom and a boiling point at atmospheric pressure of 100-500 C., and, optionally, (ii) a nitrile-containing aprotic solvent or a carbonate-containing aprotic solvent different from the (i) organic solvent, each having a boiling point at atmospheric pressure of 100-500 C. The (b) reducible silver ions are present in an amount of 0.1-400 weight %, based on the total weight of the one or more (a) polymers. This composition can be used to form silver nanoparticles under silver ion reducing conditions and then applied to various substrates to provide silver nanoparticle patterns.

A heat-insulating layer exhibiting high resistance to cracks, peeling, deformation, and gasoline and high heat insulation is obtained on the wall surface of an engine member (19). First, a heat insulator layer including a silicone-based resin and hollow particles containing a Si-based oxide is formed on a wall surface of the engine member (19). Then, Si-based oxide is produced through oxidation of a silicone-based resin in at least part of the surface of the heat insulator layer by heating the surface of the heat insulator layer. Thereafter, a catalytic metal is added to the silicone-based resin in the surface of the heat insulator layer and/or Si-based oxide derived from the hollow particles. Using the catalytic metal as nuclei, electroless plating is performed. In this manner, a heat-insulating layer (21) in which the surface of the heat-insulating film (27) is covered with a plating film (29) is obtained.

Electrically-conductive silver metal can be provided in a thin film or pattern on a substrate from a silver complex having reducing silver ions and represented by:

(Ag.sup.+).sub.a(L).sub.b(P).sub.c (I)

wherein L represents an -oxy carboxylate; P represents a 5- or 6-membered N-heteroaromatic compound; a is 1 or 2; b is 1 or 2; and c is 1, 2, 3, or 4, provided that when a is 1, b is 1, and when a is 2, b is 2. The silver complex is mixed in a hydroxy-free, nitrile-containing aprotic solvent with a polymer that is either (i) a hydroxy-containing cellulosic polymer or (ii) a non-cellulosic acrylic polymer having a halo- or hydroxy-containing side chain. The reducible silver ions in the a thermally sensitive thin film or pattern can be thermally converted to electrically-conductive metallic silver under suitable heating conditions to provide a product article that can be used in various devices.

Electrically-conductive silver metal can be provided in a thin film or pattern on a substrate from a silver complex having reducing silver ions and represented by:

##STR00001##

wherein L represents an -oxy carboxylate; P represents a primary alkylamine compound; a is 1 or 2; b is 1 or 2; and c is 1, 2, 3, or 4, provided that when a is 1, b is 1, and when a is 2, b is 2. The silver complex is mixed in a hydroxy-free, nitrile-containing aprotic solvent with a polymer that is either (i) a hydroxy-containing cellulosic polymer or (ii) a non-cellulosic acrylic polymer having a halo- or hydroxy-containing side chain. The reducible silver ions in the a thermally sensitive thin film or pattern can be thermally converted to electrically-conductive metallic silver under suitable heating conditions to provide a product article that can be used in various devices.

A method of activating a metal structure on an intermediate semiconductor device structure toward metal plating. The method comprises providing an intermediate semiconductor device structure comprising at least one first metal structure and at least one second metal structure on a semiconductor substrate. The at least one first metal structure comprises at least one aluminum structure, at least one copper structure, or at least one structure comprising a mixture of aluminum and copper and the at least one second metal structure comprises at least one tungsten structure. One of the at least one first metal structure and the at least one second metal structure is activated toward metal plating without activating the other of the at least one first metal structure and the at least one second metal structure. An intermediate semiconductor device structure is also disclosed.

Articles can be prepared having silver layers or patterns using a non-aqueous silver precursor composition consisting essentially of: at least 1 weight % of one or more (a) cellulosic polymers, (b) at least 0.1 weight % of reducible silver ions, and (c) an organic solvent medium consisting of: (i) one or more hydroxylic organic solvents, and, optionally, (ii) a nitrile-containing or carbonate-containing aprotic solvent. This composition is subjected to a temperature of at least 20 C. for a time sufficient to convert at least 90 mol % of the (b) reducible silver ions to (d) silver nanoparticles having a mean particle size of at least 25 nm and up to and including 750 nm. Additional (ii) nitrile-containing or carbonate-containing aprotic solvent can be added, and (e) carbon black can be added sufficient to provide at least 5 weight % carbon black. The resulting silver nanoparticle-containing composition can be disposed onto a supporting surface of a substrate to form a silver nanoparticle-containing pattern, and any organic solvents can be removed. This pattern can also be electrolessly plated to form an electrically-conductive pattern.