C23C18/1882

Sensitizing solution and method of its preparation
20230243039 · 2023-08-03 ·

A sensitizing solution, especially a sensitizing solution for sensitizing surfaces, containing a solution of tin(II) chloride SnCl.sub.2 and distilled water, especially for sensitizing non-conductive surfaces, which further contains glycerine. A method of preparation of the sensitizing solution, especially the method of preparation of the sensitizing solution, according to which the solution of tin(II) chloride SnCl.sub.2 and distilled water is mixed with a reducing agent, which is glycerine.

Method of producing electroconductive substrate, electronic device and display device

A method of producing an electroconductive substrate including a base material, and an electroconductive pattern disposed on one main surface side of the base material includes: a step of forming a trench including a bottom surface to which a foundation layer is exposed, and a lateral surface which includes a surface of a trench formation layer, according to an imprint method; and a step of forming an electroconductive pattern layer by growing metal plating from the foundation layer which is exposed to the bottom surface of the trench.

SOLUTION AND PROCESS FOR THE ACTIVATION OF NONCONDUCTIVE AREA FOR ELECTROLESS PROCESS
20220267906 · 2022-08-25 ·

The present invention discloses a novel activator system for electroless metallization deposition, particularly activators that may be free of tin and surfactants. Activators of the invention are preferably employed for electroless copper deposition.

Manufacturing a package using plateable encapsulant

A method of manufacturing a package, comprising embedding the semiconductor chip with an encapsulant comprising a transition metal in a concentration in a range between 10 ppm and 10,000 ppm; selectively converting of a part of the transition metal, such that the electrical conductivity of the encapsulant increases; and plating the converted part of the encapsulant with an electrically conductive material.

Electrostatic coating of metal thin layers with adjustable film properties

Methods for forming thin, pinhole-free conformal metal layers on both conducting and non-conducting surfaces, where the morphology and properties of the metal layers are tuned to meet desired parameters by adjusting the concentration of ionic liquids during the deposition process. The formed metal films contain tunable properties for solar and electronic use and provide specific advantages for non-conducting surfaces, which are otherwise unsuitable for electroplating without the presence of the formed metal films. The disclosed methods do not require the presence of a voltage or external electric field but form the metal films through an electroless technique using electrostatic interactions between negatively charged nanoparticles. In addition, the disclosed methods are compatible with solution phase processing and eliminate the need to transfer the surfaces into a vacuum chamber for a chemical or physical vapor deposition to form a metal layer.

HIGHLY MAGNETICALLY PERMEABLE ALLOY DEPOSITION METHOD FOR MAGNETIC SENSORS
20210254233 · 2021-08-19 ·

In one example, a method to manufacture a magnetic sensor, comprises providing an electrolyte solution, submersing a substrate in the electrolyte solution, submersing a plurality of ingots in the electrolyte solution, wherein the ingots comprises a metal that is magnetic, and depositing the metal on the substrate by applying a voltage between the metal ingot and the substrate to result in magnetic alloy layer on the substrate. Other examples and related methods are also disclosed herein.

COMPOSITES AND METHODS OF MAKING COMPOSITE MATERIALS

A method of making a composite material includes disposing a carbon-based particulate material, such as graphene or carbon nanotubes, in an activation solution and activating surfaces of the carbon-based particulate material using the activation solution. Once the surfaces of the carbon-based particulate material have been activated, a metallic coating is applied to the activated surfaces to form a composite material. The composite material is then recovered as a particulate material formed having carbon-based particulate material with a metallic coating that is suitable for fusing together for forming electrical conductors, such as with an additive manufacturing technique.

Controlled growth of ultranarrow nanowires on functionalized 2D materials

A method for preparing a nanowire or nanorod on a patterned monolayer or thin film supported by a 2D material substrate in a nonpolar environment comprises the steps of: functionalizing a supporting 2D material substrate using a patterned monolayer or thin film of a polymerized amphiphiles comprising both hydrophobic and hydrophilic constituents; and then growing a nanowire or nanorod on the functionalized supporting 2D material substrate in a salt solution or suspension, wherein the patterned monolayer or thin film comprises a polymerizable phospholipid with a terminal amine. A gold nanowire or nanorod so prepared has a highly controlled diameter of about 2 nm, and a length of about 100 nm, dependent in part on molecular domain sizes in the monolayer.

Electroless plating of silver onto graphite

A one-pot process for the electroless-plating of silver onto graphite powder is disclosed. No powder pretreatment steps for the graphite, which typically require filtration, washing or rinsing, are required. The inventive process comprises mixing together three reactant compositions in water: an aqueous graphite activation composition comprising graphite powder and a functional silane, a silver-plating composition comprising a silver salt and a silver complexing agent, and a reducing agent composition.

Method for forming circuit on substrate

A new method capable of forming a circuit by performing metal plating on a desired portion on a substrate through a small number of steps regardless of the kind of the substrate. A method for forming a circuit on a substrate characterized in that when forming a circuit by plating on a substrate, the method includes steps of applying a coating film containing a silicone oligomer and a catalyst metal onto the substrate, and thereafter, performing an activation treatment of the catalyst metal in the coating film to make the catalyst metal exhibit autocatalytic properties, and then, performing electroless plating.