A method for forming a tin oxide multilayer film with a catalyst layer, the method including preparing a concentrated liquid in which a tin compound is dissolved in a polar solvent; diluting the concentrated liquid with the polar solvent and a fluoride solution to prepare a reaction liquid that is a stable divalent tin solution; immersing a substance to be treated in the reaction liquid to form a tin oxide layer on a surface of the substance to be treated; and immersing the substance to be treated having the tin oxide layer formed on the surface in a catalyst solution containing catalyst metal ions to form a catalyst layer on the tin oxide layer.

A method for forming a tin oxide multilayer film with a catalyst layer, the method including preparing a concentrated liquid in which a tin compound is dissolved in a polar solvent; diluting the concentrated liquid with the polar solvent and a fluoride solution to prepare a reaction liquid that is a stable divalent tin solution; immersing a substance to be treated in the reaction liquid to form a tin oxide layer on a surface of the substance to be treated; and immersing the substance to be treated having the tin oxide layer formed on the surface in a catalyst solution containing catalyst metal ions to form a catalyst layer on the tin oxide layer.

The present invention relates to a method for manufacturing a catalyst for water electrolysis using a fluorine-doped support, comprising: preparing a support; doping fluorine onto the support; and forming a metal particle catalyst on a surface of the fluorine-doped support, and to a catalyst for water electrolysis manufactured thereby. The present invention uses a dry plasma process to omit the cleaning process and can easily form fluorine doping on the surface without causing structural collapse of the support material.

Methods and systems for forming a palladium film having an amide species are described. An ink or a precursor solution is prepared to include a palladium carboxylate, an ester solvent, and an amine. The ink or the precursor solution is applied to a substrate. The applied solution is activated using one or more of thermal, infrared, ultraviolet, X-ray, coherent, or non-coherent radiation. Activating the solution deposits palladium and a monomeric or polymeric amide on the substrate, such that the deposited palladium or amide is suitable for the deposition of electroless copper on a dielectric.