A substrate W having a non-plateable material portion 31 and a plateable material portion 32 formed on a surface thereof is prepared, and then, a catalyst is selectively imparted to the plateable material portion 32 by performing a catalyst imparting processing on the substrate W. Thereafter, a plating layer 35 is selectively formed on the plateable material portion 32 by supplying a plating liquid M1 onto the substrate W. The plating liquid M1 contains an inhibitor which suppresses the plating layer 35 from being precipitated on the non-plateable material portion 31.

A method for electroless deposition of aluminum or an aluminum alloy on a substrate surface. The method includes activating the surface of the substrate to be coated by applying a coating of a catalyst metal; preparing a mixture of urea ((NH.sub.2CONH.sub.2) and anhydrous aluminum chloride (AlCl.sub.3) wherein a molar ratio of AlCl.sub.3:(NH.sub.2CONH.sub.2 is greater than 1:1 to obtain a Lewis acid room temperature ionic liquid (RTIL) optionally containing an alloy metal salt; dissolving a hydride reducing agent in an aprotic anhydrous solvent to obtain a hydride solution; mixing the hydride solution and the AlCl.sub.3:(NH.sub.2CONH.sub.2 RTIL to obtain an electroless Al solution; exposing the activated surface of the substrate to the electroless Al solution; and removing the electroless Al solution from the substrate surface; wherein upon exposure of the activated substrate surface to the electroless Al solution, an Al or Al alloy coating is obtained on the activated substrate surface.

Embodiments utilize an electro-chemical process to deposit a metal gate electrode in a gate opening in a gate replacement process for a nanosheet FinFET device. Accelerators and suppressors may be used to achieve a bottom-up deposition for a fill material of the metal gate electrode.

Provided is a method of preparing a nanocomposite material plated with a network-type metal layer through silica self-cracks and a wearable electronics carbon fiber prepared therefrom. The present disclosure provides a nanocomposite material having excellent electrical conductivity and bending resistance by plating a network-type metal layer on a substrate having a flat surface and/or a curved surface through a method of preparing the nanocomposite material in which the network-type metal layer is plated on silica self-cracks by applying a silica coating solution on the substrate having a flat or curved surface, performing drying after the applying of the silica coating solution to form the silica self-cracks having random crack directions and sizes, and performing electroless metal plating on the surface of the substrate. Further, the present disclosure provides a wearable electronics carbon fiber having excellent electrical conductivity and bending resistance.

A method for the fabrication of an electroless-metal-plated sulfur nanocomposite, an electroless-metal-plated sulfur cathode which is made from the nanocomposite, and a battery that uses the cathode, where the method includes chemically plating a conductive metal nanoshell onto the surface of the insulating sulfur powder to improve the conductivity of the sulfur cathode material, where through enhancing the electrochemical reaction kinetics with metal catalysis capabilities, and performing physical and chemical adsorption of liquid polysulfides with metal activity, the electroless-metal-plated sulfur nanocomposite enables the battery to exhibit high electrochemical utilization and stable cyclability, such that the nanocomposite can achieve a high sulfur content and high metal content, and the cathode demonstrates a high sulfur loading with a low electrolyte-to-sulfur ratio, the lithium-sulfur battery with the cathode exhibiting a high discharge capacity along with high energy density, and maintaining stable and high reversible capacity after 200 cycles within a wide range of cycling rates.

A method of producing an electroconductive substrate including a base material, and an electroconductive pattern disposed on one main surface side of the base material includes: a step of forming a trench including a bottom surface to which a foundation layer is exposed, and a lateral surface which includes a surface of a trench formation layer, according to an imprint method; and a step of forming an electroconductive pattern layer by growing metal plating from the foundation layer which is exposed to the bottom surface of the trench.

The present invention discloses a novel activator system for electroless metallization deposition, particularly activators that may be free of tin and surfactants. Activators of the invention are preferably employed for electroless copper deposition.

Embodiments utilize an electro-chemical process to deposit a metal gate electrode in a gate opening in a gate replacement process for a nanosheet FinFET device. Accelerators and suppressors may be used to achieve a bottom-up deposition for a fill material of the metal gate electrode.

A metal-plated carbon material includes: a carbon material; and a metal layer covering a surface of the carbon material, in which, in the metal layer, crystal grains forming the metal layer have an average crystal grain size of 110 nm or less. A method of manufacturing a metal-plated carbon material, includes: a metal complex fixation step of immersing a carbon material in a supercritical fluid or subcritical fluid containing an organometallic complex of a first metal; and a first energization deposition step of energizing the metal-complex-fixed carbon material in an electroless plating solution containing a second metal.

Provided is a method of preparing a nanocomposite material plated with a network-type metal layer through silica self-cracks and a wearable electronics carbon fiber prepared therefrom. The present disclosure provides a nanocomposite material having excellent electrical conductivity and bending resistance by plating a network-type metal layer on a substrate having a flat surface and/or a curved surface through a method of preparing the nanocomposite material in which the network-type metal layer is plated on silica self-cracks by applying a silica coating solution on the substrate having a flat or curved surface, performing drying after the applying of the silica coating solution to form the silica self-cracks having random crack directions and sizes, and performing electroless metal plating on the surface of the substrate. Further, the present disclosure provides a wearable electronics carbon fiber having excellent electrical conductivity and bending resistance.