A primer composition for optical articles includes (A) a urethane prepolymer which is a reaction product of an aromatic polyisocyanate compound and a polyol compound, and which has a reactive group at an end, the reactive group being selected from among an isocyanate group and a hydroxyl group, (B) a light absorbing compound which has a maximum absorption wavelength within the range of from 320 nm to 650 nm (inclusive) and (C) an organic solvent which has a solubility parameter of 8 (cal/cm.sup.3).sup.1/2 or more, while containing no active hydrogen.

Provided herein is a process for producing fiber composite materials which includes mixing an isocyanate component A and a polyol component B to afford a reaction mixture, impregnating fibers with the reaction mixture and the curing the impregnated fibers, wherein the polyol component B includes the alkoxylation product of a mixture of fat-based alcohol (i) and at least one OH-functional compound having aliphatically bonded OH groups and an OH functionality of 2 to 4 which is not a fat-based alcohol (ii). The present compound further relates to a fiber composite material obtainable by such a process and using the fiber composite material as a mast.

A two-liquid type urethane adhesive composition includes a main agent and a curing agent. The main agent includes a poly isocyanate component, and the isocyanate group content in the main agent is 5 mass % or more of the total amount. The curing agent contains a compound having a plurality of active hydrogen-containing groups per molecule, and the compound having a plurality of active hydrogen-containing groups per molecule includes a high molecular weight polyol having two or three hydroxyl groups per molecule and a number average molecular weight of 1800 or greater, a low molecular weight polyol A having two hydroxyl groups per molecule and a number average molecular weight of 200 or less, and a low molecular weight polyol B having three hydroxyl groups per molecule, with at least one of the three hydroxyl groups being secondary hydroxyl groups, and a number average molecular weight of 1200 or less.

The present invention relates to a composition for preparing flexible foams and the application thereof. The composition comprises the following components: a. an isocyanate mixture comprising: a1) an aliphatic and/or alicyclic isocyanate monomer, and a2) an aliphatic and/or alicyclic; isocyanate trimer, wherein the mass ratio of said monomer to said trimer is in a range of 3:1-200:1; b. a polymer polyol mixture comprising: b1) a first polyether polyol having a number average molecular weight of not less than 3000 g/mol with an ethylene oxide content of 5-20 wt. %, b2) a second polyether polyol having a number average molecular weight of not less than 3000 g/mol with an ethylene oxide content of more than 60 wt. %, wherein the mass ratio of said first polyether polyol to said second polyether polyol is in a range of 4:1-100:1; c. an isocyanate-reactive group comprising compound having a number average molecular weight of 32-400 g/mol; d. a catalyst; e. a foaming agent; and f. optionally, an additive; wherein said composition has an isocyanate index of 70-120.

A polyurethane insulation foam composition is disclosed herein. The polyurethane insulation foam comprises: (i) an aromatic isocyanate compound; (ii) an isocyanate reactive compound; (iii) water; (iv) a tertiary amine compound; (v) a hydrophilic carboxylic acid compound; (vi) a halogenated olefin compound; (vii) a stabilizing compound, and (vii) optionally, other additives.

In a method for reducing a volatile organic compound, a polyurethane foam contains a compound represented by the following formula (1).

##STR00001##

(wherein, NR represents the following partial structural formula (A) or the following partial structural formula (B), and X.sup. represents an anion.)

##STR00002##

(wherein, R.sup.1 is preferably a methyl group.)

##STR00003##

(wherein, R.sup.2 is preferably a methyl group and n preferably represents 1.)

The present invention provides methods of CMP polishing a metal surface, such as a copper or tungsten containing metal surface in a semiconductor wafer, the methods comprising CMP polishing the substrate with a CMP polishing pad that has a top polishing surface in a polishing layer which is the reaction product of an isocyanate terminated urethane prepolymer and a curative component comprising a polyol curative having a number average molecular weight of 6000 to 15,000, and having an average of 5 to 7 hydroxyl groups per molecule and a polyfunctional aromatic amine curative, wherein the polishing layer would if unfilled have a water to uptake of 4 to 8 wt. % after one week of soaking in deionized (DI) water at room temperature. The methods form coplanar metal and dielectric or oxide layer surfaces with low defectivity and a minimized degree of dishing.

A polyurethane insulation foam composition is disclosed herein. The polyurethane insulation foam comprises: (i) an aromatic isocyanate compound; (ii) an isocyanate reactive compound; (iii) water; (iv) a tertiary amine compound; (v) a hydrophilic carboxylic acid compound; (vi) a halogenated olefin compound; (vii) a stabilizing compound, and (vii) optionally, other additives.

Embodiments of the present technology may include an open cell spray polyurethane foam. The foam may include a polymer. The polymer may formed by the polymerization of a reaction product of (1) a saccharide with an epoxide and (2) an isocyanate. The reaction product may have greater than 25 weight percent and less than 99 weight percent of the saccharide. The foam may exhibit a fire retardancy sufficient to pass flame tests in accordance with Appendix X and/or ASTM E-4.

The present invention provides methods of CMP polishing a metal surface, such as a copper or tungsten containing metal surface in a semiconductor wafer, the methods comprising CMP polishing the substrate with a CMP polishing pad that has a top polishing surface in a polishing layer which is the reaction product of an isocyanate terminated urethane prepolymer and a curative component comprising a polyol curative having a number average molecular weight of 6000 to 15,000, and having an average of 5 to 7 hydroxyl groups per molecule and a polyfunctional aromatic amine curative, wherein the polishing layer would if unfilled have a water uptake of 4 to 8 wt. % after one week of soaking in deionized (DI) water at room temperature. The methods form coplanar metal and dielectric or oxide layer surfaces with low defectivity and a minimized degree of dishing.