A prepreg contains: a reinforcing fiber material; and a resin composition with which the reinforcing fiber material is impregnated. The resin composition contains an epoxy resin, an amine curing agent, and an imidazole curing agent. An amount of the amine curing agent is less than or equal to 3.8 parts by mass, relative to 100 parts by mass of the epoxy resin, and a sum of the amount of the amine curing agent and an amount of the imidazole curing agent is less than or equal to 10 parts by mass, relative to 100 parts by mass of the epoxy resin. The fiber-reinforced composite material is a cured product of the prepreg.

Curable compositions are provided including a curable system that requires a thermally generated amine to cause curing of the system, and a self-assembled particle distributed in the curable system. The curable system contains at least one reactive moiety and the self-assembled particle comprises a reactive amine ionically bound to a chromonic network. A multilayer article is also provided, including a substrate, a chromonic amine layer disposed on the substrate, and a curable layer disposed on the chromonic amine layer. Methods of making a cured composition and of adhering two substrates together are further provided.

A prepreg comprising: carbon fibers; and a resin composition containing an epoxy resin having a biphenyl structure, a curing agent, and melamine cyanurate.

A coating composition including an epoxy resin in an amount of about 75 weight percent to about 80 weight percent; an isocyanate compound in an amount of about 10 weight percent to about 15 weight percent; and a melamine compound in an amount of about 5 weight percent to about 10 weight percent, where all weight percents are based on a total weight of the coating composition.

Provided is a thermally curable coating composition for alloy substrates, comprising: curable components, comprising an epoxy resin and a multifunctional (meth)acrylate; latent curing agents, which crosslink with the curable components upon heating, and comprise an isocyanate having at least two NCO groups and an amino resin; a curing promoter, comprising an aromatic phosphate comprising at least one hydroxy group connected with the phosphorous atom; and an organic solvent. Also provided are a method for providing a coating layer onto an alloy substrate and a coating layer thus obtained.

An adhesive film according to the present invention includes a resin composition layer (layer A) for an interlayer insulating layer, a thermosetting resin composition layer (layer B), and a support film (layer C), and the layer C, the layer A, and the layer B are sequentially arranged in this order. The layer A is a resin composition which contains a thermosetting resin (a1) and an inorganic filler (b1) having a specific surface area of 20 m.sup.2/g or more, and the mass ratio of the thermosetting resin (a1) to the inorganic filler (b1) is within the range from 30:1 to 2:1. The layer B contains a thermosetting resin composition which is in a solid state at a temperature lower than 40 C. but melts at a temperature of 40 C. or higher but lower than 140 C. Consequently, the adhesive film according to the present invention can solve problems in a laser process and a desmear removal process following the laser process and can form a conductor layer which has a high adhesion strength even on an interlayer insulating layer having a smooth surface-roughened state.

A cured-film formation composition that forms a cured film exhibiting excellent liquid-crystal orientation properties and excellent light transmission properties when the cured-film formation composition is used as an orientation material and a layer of a polymerizable liquid crystal is arranged thereon. A cured-film formation composition including a component (A) that is a compound obtained by reacting a cinnamic acid compound of Formula (1) below with a compound having at least one epoxy group in one molecule, ##STR00001##
wherein R.sup.1, R.sup.2, R.sup.3, R.sup.4, and R.sup.5 are each independently a substituent selected from a hydrogen atom, a halogen atom, a C.sub.1-6 alkyl, a C.sub.1-6 haloalkyl, a C.sub.1-6 alkoxy, a C.sub.1-6 haloalkoxy, cyano, and nitro; and a component (B) that is a cross-linking agent, an orientation material which is obtained from the composition, and a retardation material which is obtained from the composition.

Provided is a curable resin composition for obtaining a cured product that can satisfy both high heat resistance and high adhesiveness to metal, a cured product thereof, and methods of producing the curable resin composition and the cured product, and a semiconductor device using the cured product as a sealant. A curable resin composition containing (A) a multifunctional benzoxazine compound having two or more benzoxazine rings, (B) a multifunctional epoxy compound having at least one norbornane structure and at least two epoxy groups, (C) a curing agent, (D) a triazole-based compound, and optionally (E) a curing accelerator and (F) an inorganic filler, a cured product thereof, and methods of producing the curable resin composition and the cured product. A semiconductor device in which a semiconductor element is disposed in a cured product obtained by curing a curable resin composition containing components (A) to (D), and optionally components (E) and (F).

A composition comprising both a polymer which contains triazine-ring-containing repeating units represented by formula (17) and a crosslinking agent which consists of either a poly-functional epoxy compound or a polyfunctional (meth)acrylic compound can be photo-cured even without the addition of an initiator to yield a cured film having a high refractive index and high heat resistance. Thus, a photocurable film-forming composition that comprises a triazine-ring-containing polymer, which can achieve, even without the addition of a metal oxide by the polymer alone, high heat resistance, high transparency, a high refractive index, high solubility and low volume shrinkage, and that is curable even without the addition of an acid generator can be provided. ##STR00001##

A resin composition for a printed circuit board and an integrated circuit (IC) package, and a product using the same is provided. The resin composition includes an epoxy resin composite comprising an epoxy group, the epoxy resin composite including 5 to 20 parts by weight of a bisphenol A type epoxy resin, 30 to 60 parts by weight of a cresol novolak epoxy resin, 20 to 35 parts by weight of a phosphorus-based flame-retardant epoxy resin, and 5 to 30 parts by weight of a rubber-modified epoxy resin, based on 100 parts by weight of the epoxy resin composite, an aminotriazine-based hardener, a hardening accelerator, a filler, and 0.01 to 5 parts by weight of a surface improving agent based on 100 parts by weight of the epoxy resin composite.