An example method of coating a substrate involves cleaning the substrate and, after cleaning the substrate, sensitizing the substrate using a sensitizing solution including tin chloride and hydrochloric acid. The method also involves, after sensitizing the substrate, activating the substrate in an activating solution including palladium chloride and hydrochloric acid. Further, the method involves subsequently neutralizing the substrate using a neutralizing solution including ammonium hydroxide. Still further, the method involves, after neutralizing the substrate, depositing an electroless nickel layer on the substrate. The method may then involve depositing an electrolytic nickel layer on top of the electroless nickel layer, and depositing an outer layer of metallic material, ceramic material, polymeric material, or any combination thereof on top of the electrolytic nickel layer.

A method of producing an electroconductive substrate including a base material, and an electroconductive pattern disposed on one main surface side of the base material includes: a step of forming a trench including a bottom surface to which a foundation layer is exposed, and a lateral surface which includes a surface of a trench formation layer, according to an imprint method; and a step of forming an electroconductive pattern layer by growing metal plating from the foundation layer which is exposed to the bottom surface of the trench.

A method of manufacturing a plated component includes: a molding step of molding a substrate including a plurality of plateable portions, which are spaced apart from each other, and coupling portions, which couple the plateable portions to each other, the substrate being a nonconductive plastic molding; an electroless plating step of forming a conductive coating on the plateable portions; and an electrolytic plating step of conducting different electrolytic plating processes on the plateable portions on which different metallic coatings are to be formed.

An electrically conductive material with which excellent conduction reliability can be achieved for an oxide layer. The electrically conductive material contains electrically conductive particles including resin core particles, a plurality of electrically insulating particles being disposed on the surface of the resin core particles and forming protrusions, and an electrically conductive layer being disposed on the surface of the resin core particles and the electrically insulating particles, a Mohs' hardness of the electrically insulating particles being greater than 7. As a result, the electrically conductive particles pierce and sufficiently penetrate the oxide layer of the electrode surface so that excellent conduction reliability can be achieved.

An object of the present invention is to provide a film having a plated-layer precursor layer which is capable of forming a metal layer having excellent roll-to-roll productivity and excellent adhesiveness to a substrate. Another object of the present invention is to provide a film having a patterned plated layer as well as an electroconductive film and a touch panel using the same.

The film having a plated-layer precursor layer of the present invention is a film having a plated-layer precursor layer including a substrate, and an undercoat and a plated-layer precursor layer disposed on the substrate in this order from the substrate side, in which the undercoat has a hardness on the surface thereof of 10 N/mm.sup.2 or less and a friction coefficient with release paper of 5 or less.

Devices produced by patterning electroless metals on a substrate are presented. An active catalyst layer on the substrate is covered with a patterned mask and treated with a deactivating chemical reagent, which deactivates the catalyst layer not covered by the mask. Once the patterned mask is removed, the electroless metal layer can be placed to have a patterned electroless metals. Alternatively, a substrate can be coated with a blocking reagent in a pattern first to inhibit formation of the catalyst layer before a catalyst layer can be placed over the blocking agent layer and then electroless metal layer is placed on the catalyst layer. The pattern of the blocking reagent acts as a negative pattern of the final conductive line pattern.

Methods and devices for patterning electroless metals on a substrate are presented. An active catalyst layer on the substrate can be covered with a patterned mask and treated with a deactivating chemical reagent, which deactivates the catalyst layer not covered by the mask. Once the patterned mask is removed, the electroless metal layer can be placed to have a patterned electroless metals. Alternatively, a substrate can be coated with a blocking reagent in a pattern first to inhibit formation of the catalyst layer before a catalyst layer can be placed over the blocking agent layer and then electroless metal layer is placed on the catalyst layer. The pattern of the blocking reagent acts as a negative pattern of the final conductive line pattern.

This application relates to a metal coating method for plastic outer part requiring robustness. In the metal coating method, first, provide a plastic outer part as a motion assistance tool. Thereafter, a cold plasma treatment is performed to introduce a polar functional group to a surface of the plastic outer part by treating the plastic outer part with cold plasma. Next, a metal coating layer is formed on the surface of the plastic outer part treated with the cold plasma by an electroless plating method. Thereafter, an adhesive strength improvement process of improving an adhesive strength between the metal coating layer and the plastic outer part to 1,000 g/cm.sup.2 or more by heat treatment of the plastic outer part with the metal coating layer thereon is performed.

Systems and methods that entail polymeric fibers produced via an electrospinning process, and metallic nanostructures adhered to surfaces of the polymeric fibers via an electroless deposition process. Suitable materials for the polymeric fibers and metallic nanostructures include polyacrylonitrile (PAN) fibers and copper nanostructures, respectively.

Proposed is a mobile device case that accommodates or covers a substrate and an electronic element located on the substrate. The case includes: a case frame made of a high molecular material including a resin and having a cover part for accommodating or covering the substrate and protrusions protruding from the cover part in such a manner as to be extended close to the electronic element; and a metal coating layer formed by coating a metal on a surface of the case frame including the protrusions to improve electromagnetic shielding ability.