Patent classifications
C08G18/8022
ADHESIVE DUAL-COMPONENT COMPOSITION BASED ON POLYURETHANE
The invention relates to an adhesive dual-component composition based on polyurethane, comprising an NCO component and an OH component such that: the NCO component is a composition comprising A) at least one polyurethane prepolymer comprising at least two NCO terminal groups obtained by polyaddition reaction of at least one aliphatic polyisocyanate selected from aliphatic diisocyanate monomers and mixtures of at least one aliphatic diisocyanate monomer with at least one triisocyanate based on XDI, and at least one polyester diol, and B) at least one triisocyanate based on XDI; and the OH component is a composition comprising at least one polyester polyol. The invention relates to a method for producing a multilayer structure implementing an adhesive composition according to the invention, as well as to the use of such a structure in the field of flexible packaging.
One component, low temperature cure coating formed via a double layer curing mechanism
Shelf-stable low temperature cure coating compositions that include a hydroxy-functional resin, a crosslinking agent, and a catalyst that does not catalyze the crosslinking reaction between hydroxy-functional resin and the crosslinking agent contained therein, but instead between a hydroxy-functional resin and a crosslinking agent contained in a different low temperature cure coating composition. In addition, low temperature cure composite coatings that include: a basecoat of a low temperature cure coating composition containing a first hydroxy-functional resin, a first crosslinking agent, and a first catalyst; and a topcoat containing a second hydroxy-functional resin, a second crosslinking agent, and a second catalyst, where the first catalyst migrates into the topcoat from the basecoat and catalyzes the reaction between the second hydroxy-functional resin and crosslinking agent, and the second catalyst migrates into the basecoat from the topcoat and catalyzes the reaction between the first hydroxy-functional resin and crosslinking agent.
Adhesive composition, adhesive sheet, and method for producing semiconductor device
An adhesive composition includes an acrylic polymer (A) having a weight-average molecular weight (Mw) of 350,000 or higher obtained by polymerizing an acrylic monomer by living radical polymerization using an organotellurium-containing compound as the polymerization initiator, an epoxy thermosetting resin (B), and a thermosetting agent (C). The adhesive composition is capable of joining with sufficient adhesive strength and capable of achieving high package reliability in a semiconductor device.
Self-crosslinkable polyhydroxy polyurethane resin, resinaceous material that contains the resin, process for production of the resin, and imitation leather, surfacing material and weatherstrip material, using the resin
Provided are a self-crosslinking polyhydroxy polyurethane resin derived from a reaction of a 5-membered cyclic carbonate compound and an amine compound and having masked isocyanate groups in its structure; a process for producing the resin; an imitation leather composed of a base fabric and a resin composition composed of the resin as its principal component and impregnated in or laminated on the base fabric; as kin material made of a thermoplastic polyolefin resin, said skin material including a thermoplastic polyolefin resin sheet and a top coat layer formed directly or via a primer layer on the sheet, wherein the top coat layer has been formed with a resin composition composed of the resin as its principal component; and a weather strip material composed, as its principal components, of the resin and a specific diorganopolysiloxane and/or a silicone oil.
Heat-resistant adhesive sheet for semiconductor testing
A heat-resistant adhesive sheet for semiconductor testing, used in a performance test while semiconductor chips are heated includes: a base material; and an adhesive layer provided on the base material, the base material having a thermal shrinkage of lower than 1% when being heated at 150 degrees Celsius for 30 minutes and a linear expansion coefficient of equal to or lower than 5.010.sup.5 at 60 to 150 degrees Celsius, and the adhesive layer containing a (meth)acrylic acid ester copolymer, a photopolymerizable compound, a polyfunctional isocyanate curing agent, and photoinitiator. The adhesive layer contains 5 to 200 parts by mass of the photopolymerizable compound, 0.5 to 20 parts by mass of the polyfunctional isocyanate curing agent, and 0.1 to 20 parts by mass of the photoinitiator, with respect to 100 parts by mass of the(meth)acrylic acid ester copolymer. The adhesive layer is free of tackifying resin.
ELECTRICALLY PEELABLE ADHESIVE COMPOSITION, ELECTRICALLY PEELABLE ADHESIVE PRODUCT, AND UTILIZATION THEREOF
The present invention is to address the problem of providing an electrically peelable adhesive product having excellent electric peelability even when being exposed to high temperature conditions over a long period of time. The problem is solved by an electrically peelable adhesive composition, comprising an acrylic polymer, an ionic liquid and a highly water-absorbing polymer.
ONE COMPONENT, LOW TEMPERATURE CURE COATING FORMED VIA A DOUBLE LAYER CURING MECHANISM
Shelf-stable low temperature cure coating compositions that include a hydroxy-functional resin, a crosslinking agent, and a catalyst that does not catalyze the crosslinking reaction between hydroxy-functional resin and the crosslinking agent contained therein, but instead between a hydroxy-functional resin and a crosslinking agent contained in a different low temperature cure coating composition. In addition, low temperature cure composite coatings that include: a basecoat of a low temperature cure coating composition containing a first hydroxy-functional resin, a first crosslinking agent, and a first catalyst; and a topcoat containing a second hydroxy-functional resin, a second crosslinking agent, and a second catalyst, where the first catalyst migrates into the topcoat from the basecoat and catalyzes the reaction between the second hydroxy-functional resin and crosslinking agent, and the second catalyst migrates into the basecoat from the topcoat and catalyzes the reaction between the first hydroxy-functional resin and crosslinking agent.
GEL PARTICLES, PHOTOSENSITIVE COMPOSITION, INK COMPOSITION, METHOD OF PRODUCING WATER DISPERSION OF GEL PARTICLES, AND IMAGE FORMING METHOD
Provided are gel particles each having a three-dimensional crosslinked structure having at least one bond selected from a urethane bond and a urea bond, the gel particles each including: a maleimide group represented by Formula 1 below, a photosensitive composition, an ink composition, a method of producing water dispersion of gel particles, and an image forming method. In Formula 1, R.sub.1 and R.sub.2 each independently represent a hydrogen atom or an alkyl group, R.sub.1 and R.sub.2 may be bonded to each other to form a ring, and * represents a bonding site.
##STR00001##
High-functionality polyisocyanates containing urethane groups
The present invention relates to new, urethane-group-containing polyisocyanates based on aliphatic and/or cycloaliphatic diisocyanates, and to their use.
CHAIN TRANSFER AGENT, PRODUCTION METHOD OF POLYMER, POLYMER, ADHESIVE COMPOSITION AND POLYMER PARTICLES
A chain transfer agent represented by following general formula (1):
##STR00001##
In general formula (1), X is a group selected from among a cyano group, an optionally substituted aryl group, an acyl group, a carboxy group, COOR.sup.1, C(O)NH.sub.2, C(O)NHR.sup.1, C(O)NR.sup.1.sub.2, SOR.sup.1, SO.sub.2R.sup.1, SO.sub.3R.sup.1, and OR.sup.1; each Y and Z is a group selected from among a cyano group, an optionally substituted aryl group, an acyl group, a carboxy group, COOR.sup.1, C(O)NH.sub.2, C(O)NHR.sup.1, C(O)NR.sup.1.sub.2, SOR.sup.1, SO.sub.2R.sup.1, SO.sub.3R.sup.1, OR.sup.1, OC(O)R.sup.1, N(H)C(O)R.sup.1, and a halogen, or Y and Z are bonded to form an optionally substituted carbocyclic structure or an optionally substituted heterocyclic structure; X, Y and Z are the same or different; R.sup.1 is an optionally substituted alkyl group having 1 to 8 carbon atoms.