A hot melt adhesive composition includes a polyolefin-polydiorganosiloxane block copolymer, a polydiorganosiloxane, and a polyorganosilicate resin. The hot melt adhesive composition is useful in electronic device assembly processes.

A hot melt adhesive composition includes a polyolefin-polydiorganosiloxane block copolymer, a polydiorganosiloxane, and a polyorganosilicate resin. The hot melt adhesive composition is useful in electronic device assembly processes.

The present disclosure is directed to a silicon-terminated organo-metal composition comprising a compound of formula (I). Embodiments relate to a process for preparing the silicon-terminated organo-metal composition comprising the compound of formula (I), the process comprising combining starting materials comprising (A) a vinyl-terminated silicon-based compound, (B) a chain shuttling agent, (C) a procatalyst, and (D) an activator, thereby obtaining a product comprising the silicon-terminated organo-metal composition. In further embodiments, the starting materials of the process may further comprise (E) a solvent and/or (F) a scavenger.

The present disclosure is directed to a silicon-terminated organo-metal composition comprising a compound of formula (I). Embodiments relate to a process for preparing the silicon-terminated organo-metal composition comprising the compound of formula (I), the process comprising combining starting materials comprising (A) a vinyl-terminated silicon-based compound, (B) a chain shuttling agent, (C) a procatalyst, and (D) an activator, thereby obtaining a product comprising the silicon-terminated organo-metal composition. In further embodiments, the starting materials of the process may further comprise (E) a solvent and/or (F) a scavenger.

The present disclosure is directed to a silicon-terminated organo-metal composition comprising a compound of formula (I). Embodiments relate to a process for preparing the silicon-terminated organo-metal composition comprising the compound of formula (I), the process comprising combining starting materials comprising (A) a vinyl-terminated silicon-based compound and (B) a chain shuttling agent, thereby obtaining a product comprising the silicon-terminated organo-metal composition. In further embodiments, the starting materials of the process may further comprise (C) a solvent.

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The present disclosure is directed to a silicon-terminated organo-metal composition comprising a compound of formula (I). Embodiments relate to a process for preparing the silicon-terminated organo-metal composition comprising the compound of formula (I), the process comprising combining starting materials comprising (A) a vinyl-terminated silicon-based compound and (B) a chain shuttling agent, thereby obtaining a product comprising the silicon-terminated organo-metal composition. In further embodiments, the starting materials of the process may further comprise (C) a solvent.

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A polyorganosiloxane hot melt adhesive composition includes a polyolefin-polydiorganosiloxane block copolymer, a polydiorganosiloxane, and a polyorganosilicate resin. The hot melt adhesive composition is useful in electronic device assembly processes.

A polyorganosiloxane hot melt adhesive composition includes a polyolefin-polydiorganosiloxane block copolymer, a polydiorganosiloxane, and a polyorganosilicate resin. The hot melt adhesive composition is useful in electronic device assembly processes.

The present disclosure relates to a capped dual-headed organoaluminum composition having the formula (I) and processes to prepare the same. In at least one aspect, the capped dual-headed organoaluminum compositions can be used in olefin polymerization.

The present disclosure relates to a capped dual-headed organoaluminum composition having the formula (I) and processes to prepare the same. In at least one aspect, the capped dual-headed organoaluminum compositions can be used in olefin polymerization.