Provided is a composite structure capable of bonding a fabric and a synthetic resin material with good workability without affecting the texture of the fabric and having sufficient load-withstanding performance at a very high temperature.

The composite structure comprising a synthetic resin material, a fabric, and a double-sided adhesive tape that is disposed between the synthetic resin material and the fabric and bonds them together, the composite structure having a shear strength at 140° C. 15 mN/mm.sup.2 or more.

The invention relates to an adhesive dual-component composition based on polyurethane, comprising an —NCO component and an —OH component such that: the —NCO component is a composition comprising A) at least one polyurethane prepolymer comprising at least two NCO terminal groups obtained by polyaddition reaction of at least one aliphatic polyisocyanate selected from aliphatic diisocyanate monomers and mixtures of at least one aliphatic diisocyanate monomer with at least one triisocyanate based on XDI, and at least one polyester diol, and B) at least one triisocyanate based on XDI; and the —OH component is a composition comprising at least one polyester polyol. The invention relates to a method for producing a multilayer structure implementing an adhesive composition according to the invention, as well as to the use of such a structure in the field of flexible packaging.

Provided are a laminating adhesive, a laminate, and a packaging material which are excellent in retorting resistance and content resistance. The adhesive includes a polyol composition (A) including a polyester polyol (A1), and a polyisocyanate composition (B) including a polyisocyanate compound (B1), in which the polyester polyol (A1) is a reaction product of a composition including a polycarboxylic acid and a polyhydric alcohol, the polycarboxylic acid including a tetramer acid. The laminate and the packaging material are produced using the adhesive.

Provided are a laminating adhesive, a laminate, and a packaging material which are excellent in retorting resistance and content resistance. The adhesive includes a polyol composition (A) including a polyester polyol (A1), and a polyisocyanate composition (B) including a polyisocyanate compound (B1), in which the polyester polyol (A1) is a reaction product of a composition including a polycarboxylic acid and a polyhydric alcohol, the polycarboxylic acid including a tetramer acid. The laminate and the packaging material are produced using the adhesive.

The invention discloses a low-viscosity hydroxyl-terminated resin with diisocyanate as a core, and a preparation method therefor and the use thereof. During preparation, 1 mole of a micromolecular polyol is first modified with 1-3 moles of a monoepoxide so as to obtain a modified polyol; and then 2 moles of the modified polyol is reacted with 1-3 moles of a diisocyanate so as to obtain the hydroxyl-terminated resin. The prepared hydroxyl-terminated resin has the advantages of simple synthesis process, high solid content and low viscosity; the hydroxyl value thereof (at 80% solid mass content) is 140-300 mg KOH/g and the viscosity thereof at 25° C. (at 80% solid mass content) is 300-3000 cp. The hydroxyl-terminated resin is capable of crosslinking with a polyurethane curing agent containing isocyanate groups, and the prepared high solid content dual-component polyurethane coating has a VOC content of less than 380 g/L at the applicable viscosity thereof, and the performance of the coating meets the national standards for solvent based dual-component polyurethane woodenware coatings.

A pressure sensitive adhesive tape for semiconductor processing includes a base having a Young's modulus of 1000 MPa or more at 23° C., and a pressure sensitive adhesive layer provided on at least one surface of the base, and the product (N)×(C) of (N) and (C) is 500 or more at 30° C., and 9000 or less at 60° C., where (N) [μm] is a thickness of the pressure sensitive adhesive layer and (C) [μm] is a creep amount.

Provided is a polymer capable of providing a coating film that has good initial adhesiveness to a base material and good adhesiveness thereto after a pressure cooker test, and has excellent abrasion resistance as determined by a falling sand abrasion test. The polymer includes a perhaloolefin unit, a vinyl ester unit that contains neither a hydroxy group nor an aromatic ring; and a hydroxy group-containing monomer unit. The polymer has a hydroxyl value of 110 mgKOH/g or greater.

Provided are a method of preparing a polyurethane prepolymer with high functionality and the polyurethane prepolymer with high functionality prepared therefrom and a curing agent comprising the same. The method includes the steps of: Step (A): providing an alcohol composition comprising a first polyol having 2 or 3 OH groups and a second polyol having 4 or more OH groups; Step (B): reacting the alcohol composition with a polyisocyanate to undergo a first polymerization, so as to obtain an intermediate; wherein a molar ratio of a total number of the OH groups of the alcohol composition to a total number of NCO groups of the polyisocyanate is from 1:2 to 1:6; and Step (C): adding a catalyst to carry out a second polymerization of the intermediate to obtain the polyurethane prepolymer with high functionality, which has four or more NCO groups.

A pressure-sensitive adhesive layer formed from a pressure-sensitive adhesive composition containing, as monomer units, at least a (meth)acrylic polymer (A) that contains an alkyl (meth)acrylate, and a silicon compound (B), wherein: the silicon compound (B) is one or more silicon compounds selected from the group consisting of alkoxysilane compounds and organopolysiloxane compounds having an acidic group or an acid anhydride group derived from an acidic group and having no polyether group in the molecule, and/or a hydrolytic condensate thereof; and the pressure-sensitive adhesive layer satisfies the conditions of the resistance value change ratio represented by general formula (1). Formula (1): R.sub.250/R.sub.i≤3.0. This pressure-sensitive adhesive layer has reworkability with respect to a transparent conductive layer, corrosion resistance, and high durability.

The pressure sensitive adhesive tape for semiconductor processing includes a base which has a Young's modulus of 1000 MPa or more at 23° C., a buffer layer which is provided on at least one surface of this base, and a pressure sensitive adhesive layer provided on the other surface of the base. The buffer layer has a tensile storage elastic modulus (E.sub.23) of 100-2000 MPa at 23° C., and a tensile storage elastic modulus (E.sub.60) of 20-1000 MPa at 60° C.