Patent classifications
D03D1/0082
Forming electrical connections in fabric-based items
An item may include fabric or other materials formed from intertwined strands of material. The item may include circuitry that produces signals. The strands of material may include non-conductive strands and conductive strands. The conductive strands may carry the signals produced by the circuitry. Each conductive strand may have a strand core, a conductive coating on the strand core, and an insulating layer on the conductive coating. The strand cores may be strands formed from polymer. The conductive coating may be formed from metal. Electrical connections may be made between intertwined conductive strands by selectively removing portions of the outer insulating layer to expose the conductive cores of overlapping conductive strands. A conductive material such as solder or conductive epoxy may be applied to the exposed portions of the conductive cores to electrically and mechanically connect the overlapping conductive strands.
Glass cloth, prepreg and printed wiring board
A glass cloth comprising a glass yarn woven together, the glass yarn comprising multiple glass filaments, wherein an amount of B.sub.2O.sub.3 in a composition of the glass filaments is 15% by mass to 30% by mass, an amount of SiO.sub.2 in the composition thereof is 45% by mass to 60% by mass, and an amount of P.sub.2O.sub.5 in the composition thereof is 2% by mass to 8% by mass, and loss on ignition (LOI) of the glass cloth is 0.90% by mass to 2.0% by mass.
Flexible wiring board, electronic device, and fiber product
In a flexible wiring board including a woven fabric or a knit fabric, the woven fabric or the knit fabric includes, as yarns constituting the woven fabric or the knit fabric, a conductive yarn and insulative yarns.
Glass cloth including attached fibers
A glass fiber cloth includes a first warp glass fiber, a second warp glass fiber, and a weft glass fiber. The second warp glass fiber is adjacent to the first warp glass fiber. The weft glass fiber is overlaid over the first warp glass fiber and the second warp glass fiber. The weft glass fiber is attached to the first warp glass fiber.
Multilayer printed wiring board and method for producing multilayer printed wiring board
A multilayer printed wiring board includes a core substrate, a first buildup layer, and a second buildup layer. The first buildup layer includes a first insulating layer and a first conductor layer alternately laminated with each other. The second buildup layer includes a second insulating layer and a second conductor layer alternately laminated with each other. The core substrate, the first insulating layer, and the second insulating layer each include a glass cloth. The glass cloth is woven with warp threads and weft threads. The warp threads each have a width narrower a width of each of the weft threads. Each of the warp threads constituting the glass cloth in the first insulating layer and the second insulating layer both lying adjacent to the core substrate is arranged perpendicular to each of the warp threads constituting the glass cloth in the core substrate.
LUMINESCENT FIBER, LUMINESCENT FABRIC, AND METHOD FOR PRODUCING A LUMINESCENT FIBER
A luminous fiber may include a flexible printed circuit board extending in a length direction of the fiber, at least one electrically conductive trace being formed on the flexible printed circuit board, at least one light emitting component being arranged on the flexible printed circuit board and being electrically connected to the trace, and a lateral strengthening structure for strengthening the luminous fiber in lateral direction perpendicular to the length direction. The lateral strengthening structure may include two frame bars, which are formed on the flexible printed circuit board and which extend in the length direction of the fiber. The lateral strengthening structure may include several lateral support elements, which are formed on the flexible printed circuit board between the frame bars and which are coupled to the frame bars.
Fabric Control Device
A fabric-based item may include a housing that is covered in fabric. Areas of the fabric may overlap input circuitry such as button switches, touch sensors, force sensors, proximity sensors, and other sensing circuitry and may overlap other components such as light-emitting components and haptic output devices. The fabric-based item may include control circuitry that gathers user input from the input circuitry and wireless communications circuitry that the control circuitry uses to transmit remote control commands and other wireless signals in response information from the input circuitry. The fabric-based item may have a weight that is located in the housing to orient the housing in a desired direction when the housing rests on a surface. A movable weight may tilt the housing in response to proximity sensor signals or other input. Portions of the fabric may overlap light-emitting components and optical fiber configured to emit light.
THERMAL MANAGEMENT OF PRINTED CIRCUIT BOARD COMPONENTS
A first thermal management approach involves an air flow through cooling mechanism with multiple airflow channels for dissipating heat generated in a PCA. The air flow direction through at least one of the channels is different from the air flow direction through at least another of the channels. Alternatively or additionally, the airflow inlet of at least one channel is off-axis with respect to the airflow outlet. A second thermal management approach involves the fabrication of a PCB with enhanced durability by mitigating via cracking or PTH fatigue. At least one PCB layer is composed of a base material formed from a 3D woven fiberglass fabric, and conductive material deposited onto the base material surface. A conductive PTH extends through the base material of multiple PCB layers, where the CTE of the base material along the z-axis direction substantially matches the CTE of the conductive material along the x-axis direction.
Fabric control device
A fabric-based item may include a housing that is covered in fabric. Areas of the fabric may overlap input circuitry such as button switches, touch sensors, force sensors, proximity sensors, and other sensing circuitry and may overlap other components such as light-emitting components and haptic output devices. The fabric-based item may include control circuitry that gathers user input from the input circuitry and wireless communications circuitry that the control circuitry uses to transmit remote control commands and other wireless signals in response information from the input circuitry. The fabric-based item may have a weight that is located in the housing to orient the housing in a desired direction when the housing rests on a surface. A movable weight may tilt the housing in response to proximity sensor signals or other input. Portions of the fabric may overlap light-emitting components and optical fiber configured to emit light.
Fabric with woven wire braid
A conductive fabric includes a fabric with one or more electrically conductive wire braids woven into the fabric. The one or more wire braids are woven into the fabric such that one or more portions of each wire braid are exposed at one or more surfaces of the fabric, the exposed portions of the wire braid forming connection pads. Each connection pad provides an electrical connection point for attachment to a complementary electrical connection point on an electronic component, such as a bond pad, solder bump, or connection lead. A single wire braid can be used to electrically interconnect multiple electronic components. Multiple wire braids can be arranged, with appropriate spacing and alignment of exposed portions, to electrically interconnect multiple electronic components with multiple electrical interconnects between one or more electronic components. Each electrically conductive wire braid includes a plurality of individual electrically conductive wires braided together.