D03D1/0082

HOMOGENEOUS COMPOSITE SUBSTRATE
20240227347 · 2024-07-11 ·

A homogeneous composite substrate includes a woven cloth and at least one fiber membrane. The woven cloth includes a plurality of first fibers. The fiber membrane is disposed on at least one surface of the woven cloth, and the fiber membrane includes a plurality of second fibers, in which a material of the first fibers and a material of the second fibers are the same, a fiber diameter of each first fiber is larger than or equal to 20 ?m and smaller than or equal to 130 ?m, and a fiber diameter of each second fiber is larger than or equal to 3 ?m and smaller than or equal to 10 ?m.

Fabric-based devices with force sensing

A fabric-based item such as a fabric glove may include force sensing circuitry. The force sensing circuitry may include force sensor elements formed from electrodes on a compressible substrate such as an elastomeric polymer substrate. The fabric may include intertwined strands of material including conductive strands. Signals from the force sensing circuitry may be conveyed to control circuitry in the item using the conductive strands. Wireless circuitry in the fabric-based item may be used to convey force sensor information to external equipment. The compressible substrate may have opposing upper and lower surfaces. Electrodes for the force sensor elements may be formed on the upper and lower surfaces. Stiffeners may overlap the electrodes to help decouple adjacent force sensor elements from each other. Integrated circuits can be attached to respective force sensing elements using adhesive.

Fabric-Based Devices With Force Sensing

A fabric-based item such as a fabric glove may include force sensing circuitry. The force sensing circuitry may include force sensor elements formed from electrodes on a compressible substrate such as an elastomeric polymer substrate. The fabric may include intertwined strands of material including conductive strands. Signals from the force sensing circuitry may be conveyed to control circuitry in the item using the conductive strands. Wireless circuitry in the fabric-based item may be used to convey force sensor information to external equipment. The compressible substrate may have opposing upper and lower surfaces. Electrodes for the force sensor elements may be formed on the upper and lower surfaces. Stiffeners may overlap the electrodes to help decouple adjacent force sensor elements from each other. Integrated circuits can be attached to respective force sensing elements using adhesive.

Fabric control device

A fabric-based item may include a housing that is covered in fabric. Areas of the fabric may overlap input circuitry such as button switches, touch sensors, force sensors, proximity sensors, and other sensing circuitry and may overlap other components such as light-emitting components and haptic output devices. The fabric-based item may include control circuitry that gathers user input from the input circuitry and wireless communications circuitry that the control circuitry uses to transmit remote control commands and other wireless signals in response information from the input circuitry. The fabric-based item may have a weight that is located in the housing to orient the housing in a desired direction when the housing rests on a surface. A movable weight may tilt the housing in response to proximity sensor signals or other input. Portions of the fabric may overlap light-emitting components and optical fiber configured to emit light.

GLASS CLOTH, PREPREG, AND PRINTED WIRING BOARD

The present invention provide a glass cloth comprising a warp yarn and a weft yarn woven together, the warp yarn and the weft yarn each being a glass yarn including multiple glass filaments, wherein at least one of the warp yarn and the weft yarn comprises filaments each having an amount of SiO.sub.2 in the composition thereof of 98 to 100% by mass, an average filament diameter of the glass filaments is 3 to 10 m, number of the filaments is 20 to 300, each of the weaving densities of the warp yarn and the weft yarn configuring the glass cloth is independently 20 to 140/inch, a thickness of the glass cloth is 5 to 100 m, an ignition loss of the glass cloth is 0.12% by mass or more but 1.0% by mass or less, a permittivity of the glass cloth is 4.4 or less, and a surface of the glass yarn is treated with a silane coupling agent having an unsaturated double bond group.

LIQUID IMMERSION TECHNIQUES FOR IMPROVED RESISTANCE TO CONDUCTIVE ANODIC FILAMENT FORMATION

An immersion weaving system includes a first drum immersed in a first bath of a liquid. The first drum is configured to form a glass strand from individual glass filaments. The immersion weaving system also includes a second drum immersed in the first bath of the liquid. The second drum is configured to form a yarn spool from the glass strand. The immersion weaving system further includes a loom immersed in a second bath of the liquid. The loom is configured to form a void-free glass cloth.

MICRO CONDUCTIVE THREAD INTERCONNECT COMPONENT TO MAKE AN INTERCONNECT BETWEEN CONDUCTIVE THREADS IN FABRICS TO PCB, FPC, AND RIGID-FLEX CIRCUITS
20180255639 · 2018-09-06 · ·

An interconnect component is configured as an adapter or interposer providing mechanical and electrical interconnects between conductive threads, such as those woven within fabrics, and electrical connection points, such as contact pads on a printed circuit board (PCB), a flexible printed circuit (FPC), and/or a rigid-flex circuit board.

Thermal management of printed circuit board components

A first thermal management approach involves an air flow through cooling mechanism with multiple airflow channels for dissipating heat generated in a PCA. The air flow direction through at least one of the channels is different from the air flow direction through at least another of the channels. Alternatively or additionally, the airflow inlet of at least one channel is off-axis with respect to the airflow outlet. A second thermal management approach involves the fabrication of a PCB with enhanced durability by mitigating via cracking or PTH fatigue. At least one PCB layer is composed of a base material formed from a 3D woven fiberglass fabric, and conductive material deposited onto the base material surface. A conductive PTH extends through the base material of multiple PCB layers, where the CTE of the base material along the z-axis direction substantially matches the CTE of the conductive material along the x-axis direction.

WIRING BOARD AND METHOD OF MANUFACTURING WIRING BOARD
20180242443 · 2018-08-23 · ·

A wiring board includes a core, and a differential signal wire disposed on a surface of the core, wherein the core includes a glass cloth formed such that a warp yarn and a weft yarn that are each formed of a glass fiber are woven, a resin in which the glass cloth is embedded, and a powder that disperses in a stitch of the glass cloth that is surrounded by the warp yarn and the weft yarn and that is formed of a material having a relative permittivity more than a relative permittivity of the resin.

ANGLED FIBERGLASS CLOTH WEAVES

A process of forming an angled fiberglass cloth weave includes weaving a first set of fibers oriented at a first non-orthogonal angle with respect to a printed circuit board to be formed from the angled fiberglass cloth weave with a second set of fibers oriented at a second non-orthogonal angle with respect to the printed circuit board to be formed form the angled fiberglass cloth weave.