The invention concerns a method of SZ stranding into one strand a bundle of two or more flexible micromodules, each micromodule comprising one or more optical fibers. A first pulley is located with its winding surface adjacent to a longitudinal axis of a cabling line. The bundle of micromodules is guided over the winding surface of the first pulley, the first pulley being rotating around the longitudinal axis of the cabling line. The rotational speed, or the rotational direction of the first pulley, is alternating.

A continuous stranding system is disclosed. According to an aspect of the present disclosure, a continuous stranding system including: a plurality of stranders configured to receive a center wire and a plurality of peripheral wires provided from outside to manufacture and discharge a strand in a shape of the plurality of peripheral wires stranded to a single layer around the center wire; and a winding spool configured to wind the manufactured strand into a shape of the peripheral wires stranded to multiple layers around the center wire by sequentially through the plurality of stranders may be provided. A first disposed strander among the plurality of stranders is configured to receive a wire from a supply spool of a plurality of wires as the center wire and the plurality of peripheral wires and other stranders among the plurality of stranders are configured to receive a strand discharged from a preceding strander as a center wire and a wire from the supply spool of a plurality of wires as a plurality of peripheral wires.

The method makes it possible to manufacture an assembly (A) comprising a layer (C) of metal filamentary elements (14) wound in a helix. The method comprises a step (100) of supplying a temporary assembly (22) comprising a layer (13) of M>1 metal filamentary elements (14) and a temporary centre (16), and a step (110) of separating the temporary assembly (22) between a first split assembly (25), a second split assembly (27) and the temporary centre (16). The method comprises a step (140) of reassembling the first split assembly (25) with the second split assembly (27) so as to form the layer (C) of the assembly (A).