D06M11/45

AQUEOUS DIPPING COMPOSITION

The present invention relates to an aqueous dipping composition for coating a textile reinforcing material, comprising at least one rubber latex, at least one blocked isocyanate, at least one filler, at least one epoxy group-containing compound, and at least one polymer with carboxylic acid functional groups. The present invention further relates to the use of such a composition, to a process for coating a textile reinforcing material with this composition, to a coated textile reinforcing material and a respective elastomeric article comprising the coated textile reinforcing material.

Flame retardant material and system

Systems, apparatuses, and methods are described that combine a sorbent containing a flame retardant with a substrate, which is capable of responding to temperature increases to prevent, suppress, delay the spread of, or otherwise mitigate a proximal thermal event. A flame retardant system has a flame retardant material that is incorporated into a matrical sorbent material, which is incorporated into a substrate. The matrical sorbent material is configured to release the flame retardant material upon exposure to an elevated temperature, e.g., a temperature that is greater than 300° C. in one embodiment.

Composite thermal insulation sheet including aerogel

Provided is a composite thermal insulation sheet including an aerogel and a method for manufacturing the same. The methods yield an ultra-thin aerogel composite sheet having characteristics of low dust, high strength and high thermal insulation, thereby having an increased applicability thereof to an electronic device.

Laminate

A laminated body formed by laminating a fiber substrate composed of a plurality of fibers and a polymer layer formed from a polymer latex. The polymer layer covers the fiber substrate in a state in which a portion of the polymer layer has permeated among the fibers. A ratio (t.sub.1/d) of a thickness t.sub.1 of the portion of the polymer layer that has permeated among the fibers (from a top surface of the fiber substrate) to a substrate layer average thickness d is 0.1 to 0.95. A thickness t.sub.2 of the portion of the polymer layer covering the top surface of the fiber substrate (from the top surface of the fiber substrate) is 80 μm or more.

Circuit board and process for preparing the same

The present invention provides a process for preparing a pre-treated low Dk-type glass fabric for constituting a circuit board, comprising pre-treating low Dk-type glass fabric with a pre-treating varnish having a Dk close to the Dk of the used low Dk-type glass fabric at different temperatures and having a small Df. The present invention further provides a bonding sheet and a circuit board prepared thereby. The circuit boards prepared by the preparation process of the present invention have a Dk having small differences in warp and weft directions, and can effectively solve the problem of signal propagation delay. The circuit boards have a small Df, so as to have a small signal loss. Meanwhile, the cured, partially-cured or uncured dry glue obtained after drying the solvent of the pre-treating varnish has similar dielectric properties at different temperatures to the used low Dk-type glass fabric, so that the circuit boards have a very small signal propagation delay at different temperatures.

Circuit board and process for preparing the same

The present invention provides a process for preparing a pre-treated low Dk-type glass fabric for constituting a circuit board, comprising pre-treating low Dk-type glass fabric with a pre-treating varnish having a Dk close to the Dk of the used low Dk-type glass fabric at different temperatures and having a small Df. The present invention further provides a bonding sheet and a circuit board prepared thereby. The circuit boards prepared by the preparation process of the present invention have a Dk having small differences in warp and weft directions, and can effectively solve the problem of signal propagation delay. The circuit boards have a small Df, so as to have a small signal loss. Meanwhile, the cured, partially-cured or uncured dry glue obtained after drying the solvent of the pre-treating varnish has similar dielectric properties at different temperatures to the used low Dk-type glass fabric, so that the circuit boards have a very small signal propagation delay at different temperatures.

Coating materials, and personal protective clothing items coated with the coating materials

Coating materials and coated personal protective clothing items incorporating the coating material are described. The coating material includes a polymeric component; a metal oxide component; and a catalytic component. The catalytic component includes a metal oxide or a mixed metal oxide which is an effective catalyst for an oxidation reaction. The coated personal protective clothing item includes a personal protective clothing substrate with a coating including the coating material.

COMPLEXES OF HYDROTALCITES AND FIBERS
20210338547 · 2021-11-04 ·

The present invention aims to provide techniques for preparing complexes of a hydrotalcite and a fiber. The complexes of a hydrotalcite and a fiber can be synthesized efficiently by synthesizing the hydrotalcite in an aqueous system in the presence of the fiber.

COMPLEXES OF HYDROTALCITES AND FIBERS
20210338547 · 2021-11-04 ·

The present invention aims to provide techniques for preparing complexes of a hydrotalcite and a fiber. The complexes of a hydrotalcite and a fiber can be synthesized efficiently by synthesizing the hydrotalcite in an aqueous system in the presence of the fiber.

Ceramic Composite Materials

Composite ceramic materials are disclosed in which an interconnected network of ceramic material on a substrate contains pores with an accessible pore volume that is at least partially filled with a polymer, resin, and/or wax.