D21H13/14

ARRAY OF WET WIPE PACKAGES
20210339931 · 2021-11-04 ·

Described herein is an array of wet wipe packages displayed via a merchandise display system. The array of wet wipe packages includes a first package, a second package, and a third package. The first package includes a first wet wipe having a first coform nonwoven material and a first lotion. The second package includes a second wet wipe having a second coform nonwoven material and a second lotion. The third package includes a third wet wipe having a third coform nonwoven material and a third lotion. The third lotion is different than the first lotion and the second lotion. The first coform nonwoven material, the second coform nonwoven material, and/or the third coform nonwoven material has from about 14.5% to about 45% cotton.

Repulpable container

A repulpable insulated container assembly having a container formed of paper such as corrugated cardboard or varying paper materials and defining an interior; and a repulpable insert placed within the interior of the container and formed of a first paper layer; and a paper fiber pad coupled to the first paper layer.

Fibrous Structures and Methods for Making Same

A layered fibrous structure having a first layer including a co-formed fibrous structure containing a plurality of first filaments and a plurality of solid additives and a second layer different from the first layer, wherein the second layer includes a plurality of second filaments is provided.

Fibrous structures and methods for making same

A layered fibrous structure having a first layer including a co-formed fibrous structure containing a plurality of first filaments and a plurality of solid additives and a second layer different from the first layer, wherein the second layer includes a plurality of second filaments is provided.

Airlaid substrates having at least one bicomponent fiber

An airlaid substrate includes at least one bicomponent fiber having a first region and a second region. The first region includes polypropylene and the second includes a blend of an ethylene-base polymer and an ethylene acid copolymer. The ethylene-base polymer has a density from 0.920 g/cm.sup.3 to 0.970 g/cm.sup.3 and a melt index (I.sub.2) from 0.5 g/10 min to 150 g/10 min. The ethylene acid copolymer includes the polymerized reaction product of from 60 wt % to 99 wt % ethylene monomer and from 1 wt % to 40 wt % unsaturated dicarboxylic acid comonomer, based on the total weight of the monomers in the ethylene acid copolymer. The ethylene acid copolymer having a melt index (I.sub.2) from 0.5 g/10 min to 500 g/10 min.

Airlaid substrates having at least one bicomponent fiber

An airlaid substrate includes at least one bicomponent fiber having a first region and a second region. The first region includes polypropylene and the second includes a blend of an ethylene-base polymer and an ethylene acid copolymer. The ethylene-base polymer has a density from 0.920 g/cm.sup.3 to 0.970 g/cm.sup.3 and a melt index (I.sub.2) from 0.5 g/10 min to 150 g/10 min. The ethylene acid copolymer includes the polymerized reaction product of from 60 wt % to 99 wt % ethylene monomer and from 1 wt % to 40 wt % unsaturated dicarboxylic acid comonomer, based on the total weight of the monomers in the ethylene acid copolymer. The ethylene acid copolymer having a melt index (I.sub.2) from 0.5 g/10 min to 500 g/10 min.

Multi-layer substrates comprising sandwich layers and polyethylene

Multi-layer substrates comprising a top surface layer of pulp fibers, a bottom surface layer of pulp fibers, and a melted thermoplastic material layer between the pulp fiber layers, where the thermoplastic material comprises polyethylene or has a tan delta value of 0.2 to 0.4 within the temperature range of 100° F. to 350° F. The multi-layer substrate can include a cleaning composition loaded onto the multi-layer substrate, where a fluid pathway through the melted thermoplastic material allows the cleaning composition to travel from the top surface layer to the bottom surface layer. The multi-layer substrate may be void of chemical adhesives, where adhesion between the top surface layer and the thermoplastic layer, and between the bottom surface layer and the thermoplastic layer is instead provided by the thermoplastic material itself, which bonds to groups of fibers in the pulp fibers top and bottom surface layers that are in contact with the thermoplastic material as it melts.

Multi-layer substrates comprising sandwich layers and polyethylene

Multi-layer substrates comprising a top surface layer of pulp fibers, a bottom surface layer of pulp fibers, and a melted thermoplastic material layer between the pulp fiber layers, where the thermoplastic material comprises polyethylene or has a tan delta value of 0.2 to 0.4 within the temperature range of 100° F. to 350° F. The multi-layer substrate can include a cleaning composition loaded onto the multi-layer substrate, where a fluid pathway through the melted thermoplastic material allows the cleaning composition to travel from the top surface layer to the bottom surface layer. The multi-layer substrate may be void of chemical adhesives, where adhesion between the top surface layer and the thermoplastic layer, and between the bottom surface layer and the thermoplastic layer is instead provided by the thermoplastic material itself, which bonds to groups of fibers in the pulp fibers top and bottom surface layers that are in contact with the thermoplastic material as it melts.

Multi-layer substrates comprising sandwich layers and polyethylene

Multi-layer substrates comprising top and bottom surface layers comprised of synthetic nonwoven fibers, and a melted thermoplastic material layer between the top and bottom layers, where the thermoplastic material comprises polyethylene or has a tan delta value of 0.2 to 0.4 within the temperature range of 100° F. to 350° F. The multi-layer substrate can include a cleaning composition loaded onto the multi-layer substrate, where a fluid pathway through the melted thermoplastic material allows the cleaning composition to travel from the top surface layer to the bottom surface layer. The multi-layer substrate may be void of chemical adhesives, where adhesion between the top surface layer and the thermoplastic layer, and between the bottom surface layer and the thermoplastic layer is instead provided by the thermoplastic material itself, which bonds to groups of fibers in the top and bottom surface layers that are in contact with the thermoplastic material as it melts.

Multi-layer substrates comprising sandwich layers and polyethylene

Multi-layer substrates comprising top and bottom surface layers comprised of synthetic nonwoven fibers, and a melted thermoplastic material layer between the top and bottom layers, where the thermoplastic material comprises polyethylene or has a tan delta value of 0.2 to 0.4 within the temperature range of 100° F. to 350° F. The multi-layer substrate can include a cleaning composition loaded onto the multi-layer substrate, where a fluid pathway through the melted thermoplastic material allows the cleaning composition to travel from the top surface layer to the bottom surface layer. The multi-layer substrate may be void of chemical adhesives, where adhesion between the top surface layer and the thermoplastic layer, and between the bottom surface layer and the thermoplastic layer is instead provided by the thermoplastic material itself, which bonds to groups of fibers in the top and bottom surface layers that are in contact with the thermoplastic material as it melts.