The present invention relates to an aqueous, solids-containing dipping bath composition for treating reinforcing inserts for rubber products comprising the following components or consisting of these components, (A) at least one blocked MDI mixture, the MDI mixture comprising MDI oligomers of formula (I), n being a whole number from 1 to 8, and MDI monomers; (B) at least one latex; (C) at least one compound selected from the group consisting of polyacrylates, lignin derivatives and mixtures hereof; and (D) possibly at least one additive; the dipping bath composition being essentially free of epoxides, and the dipping bath composition being essentially free of resorcinol, formaldehyde and the reaction products thereof. ##STR00001##

A modified polymer includes a diene-based polymeric chain and at least one end terminated with a blocked isocyanate group. The blocked isocyanate group may be the reaction product of an isocyanate and a blocking agent, and the blocking agent is selected, such that the modified polymer deblocks at temperatures of at least 100 C. An aqueous emulsion of the modified polymer may be provided that may be surfactant-free. The emulsion may be combined with one or more latexes to provide a treatment solution for a fabric or fiber that does not require the use of resorcinol and formaldehyde. Once treated and dried, the fabric or fiber may be used to impart tensile strength to rubber products, such as tires, air springs, flexible couplings, power transmission belts, conveyor belts, and fluid routing hoses.

The present invention provides a process for preparing a pre-treated low Dk-type glass fabric for constituting a circuit board, comprising pre-treating low Dk-type glass fabric with a pre-treating varnish having a Dk close to the Dk of the used low Dk-type glass fabric at different temperatures and having a small Df. The present invention further provides a bonding sheet and a circuit board prepared thereby. The circuit boards prepared by the preparation process of the present invention have a Dk having small differences in warp and weft directions, and can effectively solve the problem of signal propagation delay. The circuit boards have a small Df, so as to have a small signal loss. Meanwhile, the cured, partially-cured or uncured dry glue obtained after drying the solvent of the pre-treating varnish has similar dielectric properties at different temperatures to the used low Dk-type glass fabric, so that the circuit boards have a very small signal propagation delay at different temperatures.

The present invention provides a process for preparing a pre-treated low Dk-type glass fabric for constituting a circuit board, comprising pre-treating low Dk-type glass fabric with a pre-treating varnish having a Dk close to the Dk of the used low Dk-type glass fabric at different temperatures and having a small Df. The present invention further provides a bonding sheet and a circuit board prepared thereby. The circuit boards prepared by the preparation process of the present invention have a Dk having small differences in warp and weft directions, and can effectively solve the problem of signal propagation delay. The circuit boards have a small Df, so as to have a small signal loss. Meanwhile, the cured, partially-cured or uncured dry glue obtained after drying the solvent of the pre-treating varnish has similar dielectric properties at different temperatures to the used low Dk-type glass fabric, so that the circuit boards have a very small signal propagation delay at different temperatures.

Light-reflective materials and methods for their preparation and use are described. The materials can have multiple particles or voids arranged in a crystal structure. The materials can reflect various types of light such as visible light, ultraviolet light, or infrared light.

Light-reflective materials and methods for their preparation and use are described. The materials can have multiple particles or voids arranged in a crystal structure. The materials can reflect various types of light such as visible light, ultraviolet light, or infrared light.

Described herein are molecular inks, methods for printing the molecular inks on flexible substrates, and methods for forming printed electronic elements, such as resistive heaters, force sensors, motion sensors, and devices that include these elements, such as force responsive conductive heaters. The methods include printing a molecular ink on a flexible substrate that is heated to 30° C. to 90° C. before and/or during the printing process and curing the substrate to produce a conductive pattern thereon. The molecular inks generally include a particle-fee metal-complex composition formulated from at least one metal complex and a solvent, and optionally, a conductive filler material, and/or surfactant.

The present disclosure relates generally to flame retarding building materials and methods for making them. More particularly, the present disclosure relates to flame retarding building materials that have both flame retardant character and desirable water vapor permeability values. In one embodiment, the disclosure provides a flame retardant vapor retarding membranes comprising: a building material substrate sheet having a melt viscosity of about 1 Pa.Math.s to about 100,000 Pa.Math.s at about 300° C. at 1 rad/s; and a polymeric coating layer disposed on the building material substrate layer, wherein the coating layer has a melt viscosity of about 1 Pa.Math.s to about 100,000 Pa.Math.s at about 300° C. at 1 rad/s.

The present disclosure relates generally to flame retarding building materials and methods for making them. More particularly, the present disclosure relates to flame retarding building materials that have both flame retardant character and desirable water vapor permeability values. In one embodiment, the disclosure provides a flame retardant vapor retarding membranes comprising: a building material substrate sheet having a melt viscosity of about 1 Pa.Math.s to about 100,000 Pa.Math.s at about 300° C. at 1 rad/s; and a polymeric coating layer disposed on the building material substrate layer, wherein the coating layer has a melt viscosity of about 1 Pa.Math.s to about 100,000 Pa.Math.s at about 300° C. at 1 rad/s.

A composite containing a fabric and a polyampholyte hydrogel is provided. In the composite, the polyampholyte hydrogel is a hydrogel of a polymer containing randomly dispersed cationic and anionic repeat groups and at least a part of the fabric is coated with the polyampholyte hydrogel. A method of preparation of the composite involves steps (a) to (c): (a) providing a monomer mixture for preparation of a polyampholyte hydrogel; (b) immersing a fabric in the monomer mixture solution; and (c) polymerizing monomers in the monomer mixture solution to obtain a precursor of the composite.