E04C2/02

SYSTEMS AND METHODS FOR CLEANABLE AND SLIP RESISTANT TILE

Disclosed herein are floor tiles comprising, for instance, a substrate and a surface coating provided on an upper surface of the substrate, wherein the surface coating comprises (i) a base formula comprising a glaze and (ii) solid particles comprising tabular alumina.

Small mobile space

A small mobile space includes a top plate, a bottom plate, and wall modules between the top plate and the bottom plate and is connected in sequence. The top plate, the bottom plate and the wall modules jointly define an accommodating space. A door assembly is arranged on at least one of the wall modules. A joint between every two adjacent wall modules, a joint between each wall module and the top plate, as well as a joint between the bottom plate and each of wall modules are clamped respectively by using a concave-convex structure. An air inlet module is arranged in the top plate and includes an air inlet channel, and a sound absorption component in the air inlet channel. An air inlet of the air inlet channel is communicated to the outside. An air outlet of the air inlet channel is communicated with the accommodating space.

Small mobile space

A small mobile space includes a top plate, a bottom plate, and wall modules between the top plate and the bottom plate and is connected in sequence. The top plate, the bottom plate and the wall modules jointly define an accommodating space. A door assembly is arranged on at least one of the wall modules. A joint between every two adjacent wall modules, a joint between each wall module and the top plate, as well as a joint between the bottom plate and each of wall modules are clamped respectively by using a concave-convex structure. An air inlet module is arranged in the top plate and includes an air inlet channel, and a sound absorption component in the air inlet channel. An air inlet of the air inlet channel is communicated to the outside. An air outlet of the air inlet channel is communicated with the accommodating space.

Stud connection structure for noise reducing wall

A noise reducing wall system is provided. The noise reducing wall system includes first and second board layers facing in parallel with each other along a longitudinal direction thereof, a heat insulation member surrounded by the first and second board layers, and a stud connection structure that fastens the first and second board layers using a stud bolt passing through the heat insulation member to connect the first board layer and the second board layer. The stud bolt connects the first and second board layers in a thickness direction and has a bent portion extending in the longitudinal direction and disposed at an intermediate point in the thickness direction.

Stud connection structure for noise reducing wall

A noise reducing wall system is provided. The noise reducing wall system includes first and second board layers facing in parallel with each other along a longitudinal direction thereof, a heat insulation member surrounded by the first and second board layers, and a stud connection structure that fastens the first and second board layers using a stud bolt passing through the heat insulation member to connect the first board layer and the second board layer. The stud bolt connects the first and second board layers in a thickness direction and has a bent portion extending in the longitudinal direction and disposed at an intermediate point in the thickness direction.

STUD CONNECTION STRUCTURE FOR NOISE REDUCING WALL
20210071414 · 2021-03-11 ·

A noise reducing wall system is provided. The noise reducing wall system includes first and second board layers facing in parallel with each other along a longitudinal direction thereof, a heat insulation member surrounded by the first and second board layers, and a stud connection structure that fastens the first and second board layers using a stud bolt passing through the heat insulation member to connect the first board layer and the second board layer. The stud bolt connects the first and second board layers in a thickness direction and has a bent portion extending in the longitudinal direction and disposed at an intermediate point in the thickness direction.

STUD CONNECTION STRUCTURE FOR NOISE REDUCING WALL
20210071414 · 2021-03-11 ·

A noise reducing wall system is provided. The noise reducing wall system includes first and second board layers facing in parallel with each other along a longitudinal direction thereof, a heat insulation member surrounded by the first and second board layers, and a stud connection structure that fastens the first and second board layers using a stud bolt passing through the heat insulation member to connect the first board layer and the second board layer. The stud bolt connects the first and second board layers in a thickness direction and has a bent portion extending in the longitudinal direction and disposed at an intermediate point in the thickness direction.

Systems and methods for cleanable and slip resistant tile

Disclosed herein are floor tiles comprising, for instance, a substrate and a surface coating, wherein the surface coating comprises (i) a base formula comprising a glaze and (ii) particles comprising alumina trihydrate.

Systems and methods for cleanable and slip resistant tile

Disclosed herein are floor tiles comprising, for instance, a substrate and a surface coating, wherein the surface coating comprises (i) a base formula comprising a glaze and (ii) particles comprising alumina trihydrate.

Framed element and its use
10883269 · 2021-01-05 · ·

A framed element includes an insulating core layer, an upper surface layer arranged on the insulating core layer, a frame structure including frame profiles which have been arranged to form at least part of the outer edges of the element and elongated support profiles in the length and/or width direction of the element. The insulating core layer is made of foamed glass or a combination of lightweight aggregates and a fire-retardant resin. The element further includes an elastic sealing compound arranged at least partly between the core layer and the upper surface layer of the element.