A building is constructed by providing a subfloor and forming a hole in the subfloor. A hole protector includes a cylinder, a skirt disposed around the cylinder, and a cap disposed on the cylinder. The hole protector is disposed over the hole with the cylinder extending into the hole. The hole protector is fastened to the subfloor. The cap is removed from the hole protector. An MPE is disposed through the cylinder.

A double floor member is provided with: a guide rail 24 affixed to the upper face side; a first connection member 27 movable in the longitudinal direction of the guide rail 24 and engaged with the guide rail 24 so as not to be dislodged upward from the guide rail 24; and a second connection member 34 connected to the first connection member 27 so as not to lift upward from the first connection member 27. The second connection member 34 can be moved in a direction different from the longitudinal direction of the guide rail 24 by horizontally moving the position where the second connection member 34 is connected to the first connection member 27.

The invention pertains to a modular presentation system for the display and support of goods and a build-up method therefor. The system comprises floor tiles, blocks, and cover plates. Two floor tiles can be interconnected by placing the two floor tiles adjacent and subsequently mounting a connection piece in connection recesses provided in the two floor tiles. Floor tiles, blocks, and cover plates are configured to clamp on top of floor tiles and blocks. The present invention allows to quickly and efficiently build up the modular presentation system.

The invention relates to a surface element (1), intended for use as a floor, wall and/or ceiling surface element for a floor, wall and/or ceiling covering, having at least one carrier plate (2) and at least one functional layer (3), wherein the carrier plate (2) comprises a top side (5) facing a usable side (4) and an underside (7) opposite the top side (5) and facing the underground (6). According to the invention, it is provided that the functional layer (3) is provided underneath the carrier plate (2), and that the functional layer (3) is designed in such a way that, in the installed state, it projects beyond the side edge (10) of the side (8), in particular of the long side (9), on at least one side (8), especially on at least one long side (9).

A floor system in a server room includes a main panel and a sub-panel. The main panel includes main panel inlaid cables and main panel connectors where the main panel inlaid cables connect a first set of the main panel connectors to a second set of the main panel connectors. The sub-panel includes sub-panel inlaid cables and sub-panel connectors where the sub-panel inlaid cables connect the sub-panel connectors to one another. The floor system provides an operating floor via the main panel and the sub-panel where the operating floor is raised relative to a sub-floor and the main panel is a removable floor panel to access a space between the operating floor and the sub-floor. The main panel inlaid cables and the sub-panel inlaid cables establish a current pathway from a power source.

Various embodiments are described that relate to a rapid deployment communications tile. As opposed to running various data and/or power wires, a construction crew can use set of tiles that have built in data and/or power transmission capabilities. These tiles can be keyed such that they interlock together to form a relatively uniform surface, such that the surface can also be used as a floor. Further, the tiles can have hardware components that enable the data and/or power transmission capabilities. These hardware components can be environmentally protected such that their performance is not subject to environmental factors.

The invention relates to surface covering elements for integrating at least one electronic device electrically powered by conductive circuit in a surface covering. The surface covering element comprises at least one, preferably at least two, electrically conductive strip conductors arranged within the surface covering element between its front and back surfaces and at least one recess opening into the back surface between so as to uncover the at least one electrically conductive strip conductor over a certain length. The at least one recess may comprise one or more device recesses and/or one or more connector recesses. Any device recess is preferably placed within the interior of the back face area, whereas any connector recess is preferably placed at an edge of the back face area.

Load distribution structures are provided for a raised floor tile(s) of a raised floor data center. The load distribution structure, which resides adjacent to an opening in the raised floor tile(s), such as a cutout in the raised floor tile(s), to facilitate supporting a frame load, includes a frame load distributor and an edging bracket. The frame load distributor resides on the raised floor tile adjacent to the opening in the raised floor tile(s), and distributes, at least in part, the frame load on the raised floor tile(s). The edging bracket couples to the frame load distributor to, at least in part, hold the frame load distributor in fixed position on the raised floor tile(s). The edging bracket extends, at least in part, into the opening in the raised floor tile to secure the frame load distributor in fixed position relative to the opening in the raised floor tile(s).

Load distribution structures are provided for a raised floor tile(s) of a raised floor data center. The load distribution structure, which resides adjacent to an opening in the raised floor tile(s), such as a cutout in the raised floor tile(s), to facilitate supporting a frame load, includes a frame load distributor and an edging bracket. The frame load distributor resides on the raised floor tile adjacent to the opening in the raised floor tile(s), and distributes, at least in part, the frame load on the raised floor tile(s). The edging bracket couples to the frame load distributor to, at least in part, hold the frame load distributor in fixed position on the raised floor tile(s). The edging bracket extends, at least in part, into the opening in the raised floor tile to secure the frame load distributor in fixed position relative to the opening in the raised floor tile(s).

Load distribution structures are provided for a raised floor tile(s) of a raised floor data center. The load distribution structure, which resides adjacent to an opening in the raised floor tile(s), such as a cutout in the raised floor tile(s), to facilitate supporting a frame load, includes a frame load distributor and an edging bracket. The frame load distributor resides on the raised floor tile adjacent to the opening in the raised floor tile(s), and distributes, at least in part, the frame load on the raised floor tile(s). The edging bracket couples to the frame load distributor to, at least in part, hold the frame load distributor in fixed position on the raised floor tile(s). The edging bracket extends, at least in part, into the opening in the raised floor tile to secure the frame load distributor in fixed position relative to the opening in the raised floor tile(s).