A floor tile for a data center floor is provided that includes a first tile module having a main surface including a first side wall portion and a second side wall portion extending from opposite edges of the main surface, the first side wall portion and second side wall portion each including at least one recess for receiving cabling; and a second tile module having a main further surface adapted to form a removable lid of the first tile module. A data center floor including such a floor tile and a data center including such a data center floor are also provided.

Various embodiments are described that relate to a rapid deployment communications tile. As opposed to running various data and/or power wires, a construction crew can use set of tiles that have built in data and/or power transmission capabilities. These tiles can be keyed such that they interlock together to form a relatively uniform surface, such that the surface can also be used as a floor. Further, the tiles can have hardware components that enable the data and/or power transmission capabilities. These hardware components can be environmentally protected such that their performance is not subject to environmental factors.

Various embodiments are described that relate to a rapid deployment communications tile. As opposed to running various data and/or power wires, a construction crew can use set of tiles that have built in data and/or power transmission capabilities. These tiles can be keyed such that they interlock together to form a relatively uniform surface, such that the surface can also be used as a floor. Further, the tiles can have hardware components that enable the data and/or power transmission capabilities. These hardware components can be environmentally protected such that their performance is not subject to environmental factors.

A processing facility for manufacturing integrated circuits on semiconductor wafers is provided with at least one radiation generator that generates an EUV (extreme ultraviolet) radiation that is supplied to at least one lithography machine, housed in a factory building, for exposure of the semiconductor wafers. The radiation generator is housed in a building or a building section separate from the factory building. At least one beam guide extends from the building or the building section to the factory building, wherein the EUV radiation is supplied from the building or the building section through the at least one beam guide to the factory building. At least one supply line branches off at an obtuse angle from the at least one beam guide inside the factory building, wherein at least a portion of the EUV radiation is supplied through the at least one supply line to the lithography machine.

Improvements in interlocking cushioned tiles from crumb rubber for the bulk of the tile to be made from recycled tire rubber with virgin material at interlocking areas of the tiles is disclosed. The use of recycled rubber reduces the amount of material in landfills. The density and size of the crumbs is variable to alter the amount of cushion for the tiles. Virgin material bonds easily together and the bonded virgin material has high integrity to keep the interlocking keyed elements together. The interconnection exists on all sides of the tiles and allows for a nearly infinite amount of tiles that can be connected to cover small and large areas. The connection details are essentially lollipop type interconnection male and female members. The interlocking cushioned tiles further include a drain and area for wiring to run under the tiles.

A floor tile for a data center floor is provided that includes a first tile module having a main surface including a first side wall portion and a second side wall portion extending from opposite edges of the main surface, the first side wall portion and second side wall portion each including at least one recess for receiving cabling; and a second tile module having a main further surface adapted to form a removable lid of the first tile module. A data center floor including such a floor tile and a data center including such a data center floor are also provided.

The invention relates to a photoelectric building block comprising a rigid support (1), made of a single extruded piece of non-metal material, provided with a front with a first coupling configuration (10) formed by a sunken channel (11) between two opposing parallel grooved guides (12) that define a narrowing of the opening of the sunken channel (11), at least one photoelectric panel (2) with a second coupling configuration (20) inserted into the sunken channel (11) and having opposite coupling ends (21) inserted into the two grooved guides (12); wherein the photoelectric building block further comprises a retainer device (30) which exerts a thrust on the opposite coupling ends (21) of the second coupling configuration (20), moving them away from the bottom of said sunken channel (11) and thrusting them against the lower surface (13) of the two grooved guides (12), retaining the photoelectric panel (2).

A piping-container module includes a module body, a first portion formed in the module body, and a second portion formed in the module body. The first portion is configured to receive first liquid-cooling piping coupled to a cooling-distribution unit. The second portion is configured to receive second liquid-cooling piping coupled to an equipment rack. The piping-container module further includes a seal coupled to the first portion and the second portion and a walking platform configured to be coupled to the module body. The walking platform is configured to enable a person to walk on the piping-container module.

A raised floor tile enclosure system that includes a pedestal, a bracket connected to the pedestal, and an equipment tray assembly supported by the bracket. The equipment tray assembly includes a bottom wall, at least one side wall that extends from the bottom wall and at least partially forms an interior volume, and a support plate movably positioned within the interior volume. The raised floor tile enclosure system further includes electronic equipment supported by the support plate and a floor tile coupled to the equipment tray that can enclose the interior volume. The support plate can move toward the bottom wall when the floor tile us coupled to the equipment tray. The electronic equipment can be received entirely within the interior volume when enclosed by the floor tile.