A modular fluid retention system and method for exemplary uses collecting and temporarily retaining fluids, for example stormwater run-off. One example of the system includes a plurality of modular retaining units which are selectively connected together to form an interior chamber volume for collecting stormwater run-off directed into the chamber volume. A plurality of modular trays are engaged with portions of the respective retention units to prevent relative movement of the retention units and eliminate, or substantially reduce, the need for porous material to be installed in and around the retention units greatly increasing the excavation void space usable for water collection and retention. In an alternate application, only a plurality of modular trays are used as the vertical support and fluid retention volume structure for the fluid retention system.

A system for assembling a transpiring, disposable heat-insulation shuttering mould and/or formwork used to cast a concrete surface, which includes at least one supporting plane featuring one upper surface on which a plurality of supports are arranged, which are suited to accommodate and retain (at least sideways inside themselves) at least one longitudinal or reticular portion of a tubular element.

A structural heat-insulation spacing, element used for making a disposable heat-insulation formwork used to cast reinforced concrete into a crawl space, made up of at least one supporting body defining, inside itself, at least one through-hollow co-axial to such supporting body, such through-hollow being suited to minimize a contact surface on the ground provided by such spacing element.

A method to improve vibration isolation in semiconductor process level inhibits vibration frequencies transmitted through building structure from production tools, pumps, compressors, chillers, AHUs (Air Handling Units), and footfalls traffic on raised floor system on to tool pedestals and pads from affecting semiconductor fabrication processes. Rapid advancement and technological evolution in semiconductor industry foresee the imminent requirements for decrease in semiconductor chip node sizes to single digit nanometer. Dealing with such advancements, the tool pedestal systems are also requiring tighter specifications for stiffness and vibration isolation/reduction. Some key tools used in the semiconductor fabrication process require improved barrier from electromagnetic interference (EMI), as the disturbance from EMI degrade the performance of semiconductor processing tools that are key to the fabrication process and production yield rate.

A method to improve vibration isolation in semiconductor process level inhibits vibration frequencies transmitted through building structure from production tools, pumps, compressors, chillers, AHUs (Air Handling Units), and footfalls traffic on raised floor system on to tool pedestals and pads from affecting semiconductor fabrication processes. Rapid advancement and technological evolution in semiconductor industry foresee the imminent requirements for decrease in semiconductor chip node sizes to single digit nanometer. Dealing with such advancements, the tool pedestal systems are also requiring tighter specifications for stiffness and vibration isolation/reduction. Some key tools used in the semiconductor fabrication process require improved barrier from electromagnetic interference (EMI), as the disturbance from EMI degrade the performance of semiconductor processing tools that are key to the fabrication process and production yield rate.

A method to improve vibration isolation in semiconductor process level inhibits vibration frequencies transmitted though building structure from production tools, pumps, compressors, chillers, AHUs (Air Handling Units), and footfalls traffic on raised floor system on to tool pedestals and pads from affecting semiconductor fabrication processes. The tool pedestal/pad for modern semiconductor FABs are required have very small tolerance to ambient vibration. Therefore, reduction and isolation of vibration of tool pedestal/pad is the key requirement for safe, reliable and uninterrupted operation of modern semiconductor FABs. Sound proofing material and foam is injected into hollow steel and/or aluminum support members and sound proofing adhesives and/or caulking are applied at points of connections in conjunction with mechanical fastening. In various applications, placement of shaped wielded rod utilized for dissipating vibration energy in center of hollow member which is surrounded with sound proofing material and/or foam.

A modular support structure for floors may include: a plurality of support elements, configured to combine with one another, for formation of a plane on which concrete can be laid, on which a floor in turn can be made. Each of the support elements includes at least one sustaining element, on top of which at least one insulating plate is associated, the at least one insulating plate configured to form a plane for the concrete. The at least one sustaining element includes at least one sustaining tubular element configured to extend from the at least one insulating plate to the ground. The support elements are configured to keep free space between the at least one insulating plate and the ground. The at least one sustaining tubular element is open on top, so that the concrete enters the at least one sustaining tubular element to form a sustaining pillar.

A floor construction on a subsurface has a screed with a reinforcement made of a 3D textile with a lower and an upper textile ply which are connected together by one or more pile threads, wherein the lower textile ply is arranged in the lower half of the screed and the upper textile ply is arranged in the upper half of the screed, wherein an insulation layer is preferably furthermore arranged between the subsurface and the screed. The reinforced screed of the floor construction allows thin screed layers with good load-bearing capacity. Good footfall sound insulation can be achieved with the floor construction containing an insulation layer.