A sensor element for a cutting tool has a hard portion having a first sensing surface, first and second electrodes, and first and second sets of thermocouple wires, and an electrically insulating portion. The second electrode has a second sensing surface, The hard portion comprises hard and/or super-hard material and the first and second electrodes comprise electrically conductive hard and/or super-hard material, the hard portion isolating the first sensing surface from the second sensing surface. The second electrode is attached to or forms part of an electrically conductive region of the hard portion or a region attached thereto. Electric current flows between the first and second electrodes through external material when the sensing surfaces contact the material in response to the cutting tool engaging the material. The first and second electrodes are operable to indicate any one or more of a temperature of the first and second electrodes, and conductivity between the electrodes.

A sensor element for a cutting tool has a hard portion having a first sensing surface, first and second electrodes, and first and second sets of thermocouple wires, and an electrically insulating portion. The second electrode has a second sensing surface, The hard portion comprises hard and/or super-hard material and the first and second electrodes comprise electrically conductive hard and/or super-hard material, the hard portion isolating the first sensing surface from the second sensing surface. The second electrode is attached to or forms part of an electrically conductive region of the hard portion or a region attached thereto. Electric current flows between the first and second electrodes through external material when the sensing surfaces contact the material in response to the cutting tool engaging the material. The first and second electrodes are operable to indicate any one or more of a temperature of the first and second electrodes, and conductivity between the electrodes.

A method of positioning a slide for examination is disclosed. The method includes the steps of placing the slide in a carrier configured to retain the slide, placing the carrier in a cartridge configured to accept the carrier, coupling the cartridge to a microscope, and activating the microscope to automatically extract the carrier from the cartridge and position the carrier such that a portion of the slide is disposed within a field of view (FOV) of the microscope.

A cutting element may include a substrate and an ultrahard layer. A top surface of the ultrahard layer includes a peripheral edge extending around the cutting element, a cutting crest extending across a major dimension of the cutting element from a cutting edge at a first portion of the peripheral edge to a modified region at a central axis of the ultrahard layer, and a lateral portion extending across a minor dimension of the cutting element from the peripheral edge to the modified region. The modified region along the major dimension includes a concave cross-sectional shape. The lateral portion along the minor dimension from the peripheral edge to the modified region includes one or more of a linear shape and a convex shape, and the modified region along the minor dimension includes a planar shape perpendicular to the central axis.

A cutting element may include a substrate and an ultrahard layer. A top surface of the ultrahard layer includes a peripheral edge extending around the cutting element, a cutting crest extending across a major dimension of the cutting element from a cutting edge at a first portion of the peripheral edge to a modified region at a central axis of the ultrahard layer, and a lateral portion extending across a minor dimension of the cutting element from the peripheral edge to the modified region. The modified region along the major dimension includes a concave cross-sectional shape. The lateral portion along the minor dimension from the peripheral edge to the modified region includes one or more of a linear shape and a convex shape, and the modified region along the minor dimension includes a planar shape perpendicular to the central axis.

A method of forming a polycrystalline diamond compact comprises providing metallized diamond particles including diamond particles including nanograins of a sweep catalyst secured thereto, the sweep catalyst comprising at least one of tungsten and tungsten carbide and constituting between about 0.01 weight percent and about 1.0 weight percent of the metallized diamond particles and placing the metallized diamond particles and a metal solvent catalyst in a container. The metallized diamond particles are subjected to a high-temperature, high-pressure process in the presence of the metal solvent catalyst to form a polycrystalline diamond material having inter-bonded diamond grains and nanograins of tungsten carbide, the nanograins of tungsten carbide covering less than about twenty percent of a surface area of the inter-bonded diamond grains. Polycrystalline diamond compacts and earth-boring tools including the polycrystalline diamond compacts are also disclosed.

A method of forming a polycrystalline diamond compact comprises providing metallized diamond particles including diamond particles including nanograins of a sweep catalyst secured thereto, the sweep catalyst comprising at least one of tungsten and tungsten carbide and constituting between about 0.01 weight percent and about 1.0 weight percent of the metallized diamond particles and placing the metallized diamond particles and a metal solvent catalyst in a container. The metallized diamond particles are subjected to a high-temperature, high-pressure process in the presence of the metal solvent catalyst to form a polycrystalline diamond material having inter-bonded diamond grains and nanograins of tungsten carbide, the nanograins of tungsten carbide covering less than about twenty percent of a surface area of the inter-bonded diamond grains. Polycrystalline diamond compacts and earth-boring tools including the polycrystalline diamond compacts are also disclosed.

A polycrystalline compact includes diamond, cubic boron nitride, and at least one hard material, which may be aluminum nitride, gallium nitride, silicon nitride, titanium nitride, silicon carbide, titanium carbide, titanium boride, titanium diboride, and/or aluminum boride. The diamond, the cubic boron nitride, and the hard material are intermixed and interbonded to form a polycrystalline material. An earth-boring tool includes a bit body and a polycrystalline diamond compact secured to the bit body. Methods of fabricating polycrystalline compacts include forming a mixture comprising diamond, non-cubic boron nitride, and a metal or semimetal; encapsulating the mixture in a container; and subjecting the encapsulated mixture to high-pressure and high-temperature conditions to form a polycrystalline material.

A subterranean support-bolt drill bit includes a bit body rotatable about a central axis and at least one cutting element mounted to the bit body. The at least one cutting element has a cutting face, a cutting edge adjacent the cutting face, and a back surface opposite the cutting face. A first recess is defined in the bit body and positioned adjacent the at least one cutting element. A first opening extends through a portion of the bit body, the first opening extending from the first recess. A coupling projection extends from the back surface of the at least one cutting element, the coupling projection being positioned within the first recess and bonded to the coupling recess by brazing. A coupling attachment extends through the first opening and is attached to the coupling projection.

A subterranean support-bolt drill bit includes a bit body rotatable about a central axis and at least one cutting element mounted to the bit body. The at least one cutting element has a cutting face, a cutting edge adjacent the cutting face, and a back surface opposite the cutting face. A first recess is defined in the bit body and positioned adjacent the at least one cutting element. A first opening extends through a portion of the bit body, the first opening extending from the first recess. A coupling projection extends from the back surface of the at least one cutting element, the coupling projection being positioned within the first recess and bonded to the coupling recess by brazing. A coupling attachment extends through the first opening and is attached to the coupling projection.