A cutting element for an earth-boring tool, the cutting element has a substrate; and a body of superhard polycrystalline material bonded to the substrate along an interface. Any one or both of the substrate or the body of superhard polycrystalline material has one or more sealed channels or regions therein, one or more of the regions or channels being arranged to retain a tracer element to provide data relating to a condition of the cutting element.

A cutting element for an earth-boring tool, the cutting element has a substrate; and a body of superhard polycrystalline material bonded to the substrate along an interface. Any one or both of the substrate or the body of superhard polycrystalline material has one or more sealed channels or regions therein, one or more of the regions or channels being arranged to retain a tracer element to provide data relating to a condition of the cutting element.

A superabrasive compact (e.g., a polycrystalline diamond compact) including a substrate and at least one feature for reducing the susceptibility of the substrate to liquid metal embrittlement during brazing operations is disclosed. The superabrasive compact may include a region between the substrate and a superabrasive table in which residual tensile stresses are located. The at least one feature may reduce the susceptibility of the substrate to liquid metal embrittlement by altering the stress state and/or substantially preventing the substrate from being wetted at the residual stress region.

A superabrasive compact (e.g., a polycrystalline diamond compact) including a substrate and at least one feature for reducing the susceptibility of the substrate to liquid metal embrittlement during brazing operations is disclosed. The superabrasive compact may include a region between the substrate and a superabrasive table in which residual tensile stresses are located. The at least one feature may reduce the susceptibility of the substrate to liquid metal embrittlement by altering the stress state and/or substantially preventing the substrate from being wetted at the residual stress region.

Disclosed are a sealed cobalt leaching device, a reagent for the cobalt leaching, a method using the device, and use of the method. The sealed cobalt leaching device includes a base, where a top of the base is provided with a first groove; a chemical solution holding tool is provided above the base; a bottom of the chemical solution holding tool is removably connected to the base; a holding through-hole penetrating up and down is formed inside the chemical solution holding tool; and a sealing cover is provided above the chemical solution holding tool. Beneficial effects of the present disclosure: Through the combination of the base, the chemical solution holding tool, and the sealing cover, the holding through-hole inside the chemical solution holding tool is sealed, thereby improving the cobalt leaching temperature and the cobalt leaching efficiency.

The method for forming cutters includes applying a protective layer on an O-ring so as to form a protected O-ring. The protected O-ring is placed around a cutter body having a substrate section and diamond section with a metallic binder. The method includes inserting the cutter body into the pod cavity and leaching the metallic binder through an end portion of the diamond section for at least one day at 60 degrees Celsius or higher so as to form a polycrystalline diamond compact cutter from the cutter body. The protected O-ring seals the substrate section during the step of leaching. The step of leaching forms an exposed O-ring from the protected O-ring with a hardness reduction and a modulus reduction that identifies a time window for maintaining a sealing force to protect the substrate, while achieving the target profile of the diamond table for a high quality and reliable cutter.

The method for forming cutters includes applying a protective layer on an O-ring so as to form a protected O-ring. The protected O-ring is placed around a cutter body having a substrate section and diamond section with a metallic binder. The method includes inserting the cutter body into the pod cavity and leaching the metallic binder through an end portion of the diamond section for at least one day at 60 degrees Celsius or higher so as to form a polycrystalline diamond compact cutter from the cutter body. The protected O-ring seals the substrate section during the step of leaching. The step of leaching forms an exposed O-ring from the protected O-ring with a hardness reduction and a modulus reduction that identifies a time window for maintaining a sealing force to protect the substrate, while achieving the target profile of the diamond table for a high quality and reliable cutter.

A cutting element may include a substrate; and an ultrahard layer on the substrate, the ultrahard layer including a non-planar working surface that is surrounded by a peripheral edge having a varying height around a circumference of the cutting element, the working surface also having: a plurality of cutting crests extending from an elevated portion of the peripheral edge across at least a portion of the working surface; at least one valley between the plurality of cutting crests; and a canted surface extending laterally from each of the outer plurality of cutting crests towards a depressed portion of the peripheral edge, a height between the depressed portion and the elevated portion being greater than a height between the elevated portion and the valley.

A method of forming a supporting substrate for a cutting element comprises forming a precursor composition comprising discrete WC particles, a binding agent, and discrete particles comprising Co, one or more of Al, Be, Ga, Ge, Si, and Sn, and one or more of C and W. The precursor composition is subjected to a consolidation process to form a consolidated structure including WC particles dispersed in a homogenized binder comprising Co, W, C, and one or more of Al, Be, Ga, Ge, Si, and Sn. A method of forming a cutting element, a cutting element, a related structure, and an earth-boring tool are also described.

The invention relates to a PCD composite compact element comprising a PCD structure integrally bonded at an interface to a cemented carbide substrate; the PCD structure comprising coherently bonded diamond grains having a mean size no greater than 15 microns; the cemented carbide substrate comprising carbide particles dispersed in a metallic binder, the carbide particles comprising a carbide compound of a metal; wherein the ratio of the amount of metallic binder to the amount of the metal at points in the substrate deviates from a mean value by at most 20 percent of the mean value. The invention further relates to a method for making a PDC compact element comprising a PCD structure integrally bonded to a substrate formed of cemented carbide; the method including introducing a source of excess carbon to the substrate at a bonding surface of the substrate to form a carburised substrate; contacting an aggregated mass of diamond grains with the carburised substrate; and sintering the diamond grains in the presence of a solvent/catalyst material for diamond; wherein the mean size of the diamond grains in the aggregated mass is no greater than 30 microns.