A flooring assembly includes a base for supporting at least one flooring element. A pin is secured to the base and extends from the upper surface of the base. The pin has a body portion adjacent to the base and a head portion extending upwardly from the body portion. The head portion has a lower head surface. A recess is formed in a flooring element. A collar is positioned adjacent to the recess. The collar has an inner diameter that is less than a diameter of the recess. The collar has an upper collar surface configured to engage the lower head surface to limit a vertical motion of the flooring element with respect to the base when a central vertical axis of the pin is laterally offset from a central vertical axis of the recess. In some embodiments, petals secured in the recess are used instead of a collar.

An elevated flooring system using various flooring panels is provided. The elevated flooring system can include a scaffolding framework that can include a series of support beams and a support structure for undergirding the support beams. The support structure can include various upright portions and bracing portions can be arranged in a gridlike pattern. The support beams and the support structure can support the various flooring panels to provide a leveled deck. And the various flooring panels can be provided between the support beams, and can include a first end portion, an opposite second end portion, various hangers, various joists, and a decking portion.

A floor tile for a data center floor is provided that includes a first tile module having a main surface including a first side wall portion and a second side wall portion extending from opposite edges of the main surface, the first side wall portion and second side wall portion each including at least one recess for receiving cabling; and a second tile module having a main further surface adapted to form a removable lid of the first tile module. A data center floor including such a floor tile and a data center including such a data center floor are also provided.

Disclosed are a raised access floor panel material structure disposed on a floor of a structure, wherein a floor panel material of floor material capable of easily accommodating wires for power, computer and communication or devices such as air conditioning facilities etc. at its lower part is formed in an assembled manner by a floor consisting of combined unit panels and is conveniently laid on the a floor surface to form a neat floor panel and a method for forming the raised floor panel material structure.

A floor tile for a data center floor is provided that includes a first tile module having a main surface including a first side wall portion and a second side wall portion extending from opposite edges of the main surface, the first side wall portion and second side wall portion each including at least one recess for receiving cabling; and a second tile module having a main further surface adapted to form a removable lid of the first tile module. A data center floor including such a floor tile and a data center including such a data center floor are also provided.

A piping-container module includes a module body, a first portion formed in the module body, and a second portion formed in the module body. The first portion is configured to receive first liquid-cooling piping coupled to a cooling-distribution unit. The second portion is configured to receive second liquid-cooling piping coupled to an equipment rack. The piping-container module further includes a seal coupled to the first portion and the second portion and a walking platform configured to be coupled to the module body. The walking platform is configured to enable a person to walk on the piping-container module.