A method to improve vibration isolation in semiconductor process level inhibits vibration frequencies transmitted through building structure from production tools, pumps, compressors, chillers, AHUs (Air Handling Units), and footfalls traffic on raised floor system on to tool pedestals and pads from affecting semiconductor fabrication processes. Rapid advancement and technological evolution in semiconductor industry foresee the imminent requirements for decrease in semiconductor chip node sizes to single digit nanometer. Dealing with such advancements, the tool pedestal systems are also requiring tighter specifications for stiffness and vibration isolation/reduction. Some key tools used in the semiconductor fabrication process require improved barrier from electromagnetic interference (EMI), as the disturbance from EMI degrade the performance of semiconductor processing tools that are key to the fabrication process and production yield rate.

A first protrusion formed on stone or porcelain tile extending from an edge of the tile configured to abut a second tile to space the first tile apart from the second tile by the first protrusion.

Set comprising a device for slope compensation of a construction surface and a fixing foot having a gripping member, which device comprises a first and second slope compensation element mounted as to rotate with respect to each other, each element presents a range having a predetermined number of positions where each position corresponds to a slope compensation value, the first and second element comprising a first, respectively a second, series of windows applied each time on each of the elements, the windows of said first and second series of windows being arranged such that for each of the positions, where slope compensation value of the first and second slope compensation element corresponds, at least one of the windows of each of the slope compensation elements being positioned such as to be opposite to each other, the windows when positioned opposite to each other serve to engage the gripping member.

A method to improve vibration isolation in semiconductor process level inhibits vibration frequencies transmitted though building structure from production tools, pumps, compressors, chillers, AHUs (Air Handling Units), and footfalls traffic on raised floor system on to tool pedestals and pads from affecting semiconductor fabrication processes. The tool pedestal/pad for modern semiconductor FABs are required have very small tolerance to ambient vibration. Therefore, reduction and isolation of vibration of tool pedestal/pad is the key requirement for safe, reliable and uninterrupted operation of modern semiconductor FABs. Sound proofing material and foam is injected into hollow steel and/or aluminum support members and sound proofing adhesives and/or caulking are applied at points of connections in conjunction with mechanical fastening. In various applications, placement of shaped wielded rod utilized for dissipating vibration energy in center of hollow member which is surrounded with sound proofing material and/or foam.

Disclosed herein is a structure for supporting an access floor panel, which includes a plurality of X-axis beams arranged to be spaced apart in an X-axis direction, each having an X-axis guide groove formed on a center of an upper surface thereof in the X-axis direction, a plurality of Y-axis beams arranged to be spaced apart in a Y-axis direction at the same height as the X-axis beams, each having a Y-axis guide groove formed on a center of an upper surface thereof in the Y-axis direction, a post configured to have a post head and support each of the X-axis beams and an associated one of the Y-axis beams, and a connection bracket configured to fix each of the X-axis beams and an associated one of the Y-axis beams to the post head.

Disclosed herein is a structure for supporting an access floor panel, which includes a plurality of X-axis beams arranged to be spaced apart in an X-axis direction, each having an X-axis guide groove formed on a center of an upper surface thereof in the X-axis direction, a plurality of Y-axis beams arranged to be spaced apart in a Y-axis direction at the same height as the X-axis beams, each having a Y-axis guide groove formed on a center of an upper surface thereof in the Y-axis direction, a post configured to have a post head and support each of the X-axis beams and an associated one of the Y-axis beams, and a connection bracket configured to fix each of the X-axis beams and an associated one of the Y-axis beams to the post head.

In one aspect of a tile and support structure, a support structure may be engaged with a top portion of a pedestal. The support structure may be formed with a generally vertical spine having at least one rail extending outward from a distal end thereof. The spine and rail(s) may be configured to secure one or more tiles, which tiles may be formed with a groove on at least one edge thereof, and wherein one or more rails may be positioned within the groove.

A support structure configured for attachment to a pedestal upper surface with a support structure spine extending upward from the support structure; a first support structure rail and second support structure rail each extending perpendicularly outward from the support structure spine. A tile comprising a groove formed in at least one of the plurality of side edges; wherein the groove of the at least one of the plurality of edges of the tile is configured for engagement by the first support structure rail of the support structure.

A modular deck system includes a plurality of base frames that each include four peripheral frame members that are to be fastened together into a rectangular box, and one or more internal frame members that each are to be secured within the box between opposing peripheral frame members. A plurality of frame legs that are each to be secured to one of the base frames to support the respective base frame above a ground surface. The plurality of base frames are fastened to one another to provide a support structure on which to secure deck material.

The present invention is a raised flooring system adapted for use in commercial and residential flooring construction. The flooring system comprises of inverted-T-shaped tracks with a plurality of adjustable supporting legs mounted thereon to adjust the height of the inverted-T-shaped track. The inverted-T-shaped tracks create a void space for air circulation, installation of insulation panels, noise reduction, in-floor heating and water drainage. The void space also allows for cables and services to run below the floor. The inverted-T-shaped track is made of rigid insulation which is durable and mold resistant.