A compressor is disclosed, including an outer casing and a fluid guide around a cavity within the casing. An inlet is in operative fluid communication with the cavity, and an outlet is also in operative fluid communication with the cavity. A prime mover includes an actuator disposed in the cavity. The actuator includes a surface arranged to receive fluid in the cavity from the inlet, impart compression to received fluid in the cavity, and discharge compressed fluid to the outlet. A surface of the compressor includes a cladding of a second aluminum alloy over a core of a first aluminum alloy, wherein the second aluminum alloy is less noble than the first aluminum alloy and includes an alloying element selected from tin, indium, gallium, or combinations thereof.

The present invention provides a high temperature chemical solution supply system for cleaning substrates. The system includes a solution tank, a buffer tank, a first pump and a second pump. The solution tank contains high temperature chemical solution. The buffer tank has a tank body, a vent line and a needle valve. The tank body contains the high temperature chemical solution. An end of the vent line connects to the tank body, and the other end of the vent line connects to the solution tank. The needle valve is mounted on the vent line, wherein the needle valve is adjusted to reach a flow rate to vent gas bubbles inside of the high temperature chemical solution out of the buffer tank through the vent line. An inlet of the first pump connects to the solution tank, and an outlet of the first pump connects to the buffer tank. An inlet of the second pump connects to the buffer tank, and an outlet of the second pump connects to a cleaning chamber in which a substrate is cleaned. The present invention also provides an apparatus including the high temperature chemical solution supply system and an ultra or mega sonic device for cleaning the substrate. The present invention also provides methods for cleaning the substrates.

The present invention provides a high temperature chemical solution supply system for cleaning substrates. The system includes a solution tank, a buffer tank, a first pump and a second pump. The solution tank contains high temperature chemical solution. The buffer tank has a tank body, a vent line and a needle valve. The tank body contains the high temperature chemical solution. An end of the vent line connects to the tank body, and the other end of the vent line connects to the solution tank. The needle valve is mounted on the vent line, wherein the needle valve is adjusted to reach a flow rate to vent gas bubbles inside of the high temperature chemical solution out of the buffer tank through the vent line. An inlet of the first pump connects to the solution tank, and an outlet of the first pump connects to the buffer tank. An inlet of the second pump connects to the buffer tank, and an outlet of the second pump connects to a cleaning chamber in which a substrate is cleaned. The present invention also provides an apparatus including the high temperature chemical solution supply system and an ultra or mega sonic device for cleaning the substrate. The present invention also provides methods for cleaning the substrates.

A fluid pump including a fluid end body having a plurality of interconnected fluid paths, a plurality of valves located within the plurality of interconnected fluid paths and a plunger located within at least one of the plurality of interconnected fluid paths to push a first portion of the volume of fluid through a first section of the plurality of interconnected fluid paths and from a second fluid port during a push stroke to push a second portion of the volume of fluid through a second section of the plurality of interconnected fluid paths and from the second fluid port during a back stroke. Each of the plurality of valves is movable between an open position and a closed position to form the first section and the second section.

A hydraulic machine includes: a casing; a differential piston having an upper ring and a lower base, sliding reciprocally in the casing and a cylindrical housing inside the envelope, separating two chambers of the casing; a hydraulic switch conveying liquid to/from the chambers, the switch controlled by movement of the piston and including at least one rod acting on a distribution member that includes an upper valve cooperating with a first seat in the upper ring of the piston and at least one lower valve cooperating with a second seat in the lower base of the piston; and a trigger causing, at the end of the stroke, a sudden change in the position of the switch to reverse the stroke. The lower and upper valve seats accept upper and lower frustoconical portions and a lower frustoconical portion tapering in opposite directions. Also disclosed is a reversible metering pump.

A hydraulic machine includes: a casing; a differential piston having an upper ring and a lower base, sliding reciprocally in the casing and a cylindrical housing inside the envelope, separating two chambers of the casing; a hydraulic switch conveying liquid to/from the chambers, the switch controlled by movement of the piston and including at least one rod acting on a distribution member that includes an upper valve cooperating with a first seat in the upper ring of the piston and at least one lower valve cooperating with a second seat in the lower base of the piston; and a trigger causing, at the end of the stroke, a sudden change in the position of the switch to reverse the stroke. The lower and upper valve seats accept upper and lower frustoconical portions and a lower frustoconical portion tapering in opposite directions. Also disclosed is a reversible metering pump.

The present invention provides a high temperature chemical solution supply system for cleaning substrates. The system includes a solution tank, a buffer tank, a first pump and a second pump. The solution tank contains high temperature chemical solution. The buffer tank has a tank body, a vent line and a needle valve. The tank body contains the high temperature chemical solution. An end of the vent line connects to the tank body, and the other end of the vent line connects to the solution tank. The needle valve is mounted on the vent line, wherein the needle valve is adjusted to reach a flow rate to vent gas bubbles inside of the high temperature chemical solution out of the buffer tank through the vent line. An inlet of the first pump connects to the solution tank, and an outlet of the first pump connects to the buffer tank. An inlet of the second pump connects to the buffer tank, and an outlet of the second pump connects to a cleaning chamber in which a substrate is cleaned. The present invention also provides an apparatus including the high temperature chemical solution supply system and an ultra or mega sonic device for cleaning the substrate. The present invention also provides methods for cleaning the substrates.

The present invention provides a high temperature chemical solution supply system for cleaning substrates. The system includes a solution tank, a buffer tank, a first pump and a second pump. The solution tank contains high temperature chemical solution. The buffer tank has a tank body, a vent line and a needle valve. The tank body contains the high temperature chemical solution. An end of the vent line connects to the tank body, and the other end of the vent line connects to the solution tank. The needle valve is mounted on the vent line, wherein the needle valve is adjusted to reach a flow rate to vent gas bubbles inside of the high temperature chemical solution out of the buffer tank through the vent line. An inlet of the first pump connects to the solution tank, and an outlet of the first pump connects to the buffer tank. An inlet of the second pump connects to the buffer tank, and an outlet of the second pump connects to a cleaning chamber in which a substrate is cleaned. The present invention also provides an apparatus including the high temperature chemical solution supply system and an ultra or mega sonic device for cleaning the substrate. The present invention also provides methods for cleaning the substrates.

A fluid end is formed from a first body attached to a separate second body. Each body includes an external surface. When the bodies are attached, their respective external surfaces are in flush engagement. A plurality of bores are formed in the second body that are alignable with a plurality of corresponding bores formed in the first body. The fluid end may be used with seals disposed within recesses within each bore to seal against corresponding sealing surfaces. Further, retaining closures may be bolted to the fluid end bodies, such that the closures have a threadless connection to the fluid end bodies. Various combinations of such components may be utilized.

A fluid end is formed from a first body attached to a separate second body. Each body includes an external surface. When the bodies are attached, their respective external surfaces are in flush engagement. A plurality of bores are formed in the second body that are alignable with a plurality of corresponding bores formed in the first body. The fluid end may be used with seals disposed within recesses within each bore to seal against corresponding sealing surfaces. Further, retaining closures may be bolted to the fluid end bodies, such that the closures have a threadless connection to the fluid end bodies. Various combinations of such components may be utilized.