A fluid control apparatus includes a valve and a pump. The valve has a valve chamber. The first main plate has a first aperture through which the valve chamber communicates with the outside, and the second main plate has a second aperture through which the valve chamber communicates with the outside. The valve further includes a valve diaphragm disposed inside the valve chamber. The valve diaphragm is configured to switch the communication state. The pump includes a piezoelectric device. The pump has a pump chamber. The pump chamber communicates with the valve chamber through the second aperture. In addition, in flexural vibration of the vibration unit, a frequency coefficient of the first main plate is greater than a frequency coefficient of the second main plate.

A piezoelectric element includes: a substrate; a first electrode which is disposed on the substrate; a piezoelectric body layer which is disposed on the first electrode, which has a plurality of layers configured to contain a piezoelectric body material, and in which the total thickness of the plurality of layers is within a range of 1.6 m to 10 m; and an intermediate layer which is disposed on an interlayer of the piezoelectric body layer, and which is configured to contain titanium.

A system for cooling a mobile phone and method for using the system are described. The system includes an active piezoelectric cooling system, a controller and an interface. The active piezoelectric cooling system is configured to be disposed in a rear portion of the mobile phone distal from a front screen of the mobile phone. The controller is configured to activate the active piezoelectric cooling system in response to heat generated by heat-generating structures of the mobile phone. The interface is configured to receive power from a mobile phone power source when the active piezoelectric cooling system is activated.

A fluid control device includes a piezoelectric actuator and a deformable substrate. The piezoelectric actuator includes a piezoelectric element and a vibration plate. The piezoelectric element is attached on a first surface of the vibration plate. The piezoelectric element is subjected to deformation in response to an applied voltage. The vibration plate is subjected to a curvy vibration in response to the deformation of the piezoelectric element. A bulge is formed on a second surface of the vibration plate. The deformable substrate includes a flexible plate and a communication plate, which are stacked on each other. Consequently, a synchronously-deformed structure is defined by the flexible plate and the communication plate collaboratively, and there is a specified depth maintained between the flexible plate and the bulge of the vibration plate. The flexible plate includes a movable part corresponding to the bulge of the vibration plate.

A cuff pressure controller device (100) is connected to a foregoing cuff (10) via an air supply tube (125). The cuff pressure controller device (100) includes a controller unit (111), a cuff pressure detector unit (113), a driver circuit (119), a piezoelectric pump (101), a check valve (121), and a release valve (122). The cuff pressure detector unit (113) detects the cuff pressure of the cuff (10). The driver circuit (119) drives the piezoelectric pump (101) at a drive frequency of 20 kHz or higher. The controller unit (111) controls the cuff pressure detector unit (113), the driver circuit (119), and the release valve (122) in such a way that the cuff pressure stays within a predetermined range based on detection results of the cuff pressure detector unit (113) and the like.

A system and methods for reducing the operating temperature of a solid state pumping system for lifting liquids from a wellbore. The pumping system and methods utilizing a solid state electrical actuator system. The cooling systems and methods including a heat sink for cooling the solid state actuator. The heat sink comprising at least one of; (i) a dielectric oil bath, (ii) a thermoelectric cooling element, (iii) an aperture within the at least one solid state actuator for conveying a cooling fluid through the aperture, and (iv) combinations thereof. The pumping system including and an electrical power source for powering the solid state pump.

According to an embodiment, a piezoelectric pump includes a pressure chamber. A groove is provided to a bottom portion of the pressure chamber. The groove includes an inlet and an outlet on a bottom portion of the groove, liquid being caused to flow in the pressure chamber through the inlet and to be discharged from the pressure chamber through the outlet.

A device that includes a region comprising an integrated device, and a heat dissipating device coupled to the region comprising the integrated device. The heat dissipating device is configured to dissipate heat away from the region. The heat dissipating device includes a fluid, an evaporator configured to evaporate the fluid, a condenser configured to condense the fluid, an inner wall coupled to the evaporator and the condenser, an outer shell encapsulating the fluid, the evaporator, the condenser and the inner wall, an evaporation portion configured to channel an evaporated fluid from the evaporator to the condenser, and a collection portion configured to channel a condensed fluid from the condenser to the evaporator. The heat dissipating device includes one or more piezo structures configured to move fluid inside the heat dissipating device.

A MEMS pump module includes a MEMS chip, at least one signal electrode, a plurality of MEMS pumps and a plurality of switch units. The MEMS chip comprises a chip body. The signal electrode is disposed on the chip body. Each of the MEMS pumps comprises a first electrode and a second electrode. The second electrode is electrically connected to the signal electrode. The switch units are electrically connected to the first electrodes of the MEMS pumps. A modulation voltage is received by the at least one signal electrode and then is transmitted to the second electrodes of the MEMS pumps. The on-off actions of MEMS pumps are controlled by the plurality of switch units.

A fluid transportation device for transportation fluid comprises a valve main body, a valve chamber base, a valve membrane, an actuator and a cover body, and locked and positioned by several locking elements, the electrically conductive locking elements are correspondingly penetrated through the penetration holes of the valve main body, the valve chamber base and the vibration plate of the valve membrane to lock with the corresponding screw holes, and a plurality of thread grooves respectively disposed on the vibration plate, the valve main body and the valve chamber base are corresponding to two thread grooves of the cover body, and an electrode lead of the piezoelectric element is embedded into the two thread grooves of the cover body and embedded into the thread grooves of the vibration plate, valve main body and the valve chamber base, so that the fluid transportation device is assembled.