The invention relates to a method for controlling and/or monitoring a compressor system comprising several components, namely one or more compressors (11, 12, 13) and one or more peripheral devices (14 to 21), and also a control/monitoring unit (22), wherein the compressors (11, 12, 13) and peripheral devices (14 to 21) are arranged or connected in a certain configuration. The method distinguishes itself in that in a measured-value-capture step, measured values are captured within the compressor system or the components, in an allocation step, context information is allocated to the measured value or measured values in advance, simultaneously, or after the measured-value capture, in order to standardize the measured values, and in an evaluation step, the measured value or measured values standardized by the context information is used in a control, monitoring, diagnostics, or evaluation routine.

The invention relates to a method for controlling and/or monitoring a compressor system comprising several components, namely one or more compressors (11, 12, 13) and one or more peripheral devices (14 to 21), and also a control/monitoring unit (22), wherein the compressors (11, 12, 13) and peripheral devices (14 to 21) are arranged or connected in a certain configuration. The method distinguishes itself in that in a measured-value-capture step, measured values are captured within the compressor system or the components, in an allocation step, context information is allocated to the measured value or measured values in advance, simultaneously, or after the measured-value capture, in order to standardize the measured values, and in an evaluation step, the measured value or measured values standardized by the context information is used in a control, monitoring, diagnostics, or evaluation routine.

Systems and methods that facilitate forming and maintaining FRCs with superior stability as well as particle, energy and flux confinement and, more particularly, systems and methods that facilitate forming and maintaining FRCs with elevated system energies and improved sustainment utilizing multi-scaled capture type vacuum pumping.

Systems and methods that facilitate forming and maintaining FRCs with superior stability as well as particle, energy and flux confinement and, more particularly, systems and methods that facilitate forming and maintaining FRCs with elevated system energies and improved sustainment utilizing multi-scaled capture type vacuum pumping.

A pump cassette is disclosed. The pump cassette includes a housing having at least one fluid inlet line and at least one fluid outlet line. The cassette also includes at least one reciprocating pressure displacement membrane pump within the housing. The pressure pump pumps a fluid from the fluid inlet line to the fluid outlet line. A hollow spike is also included on the housing as well as at least one metering pump. The metering pump is fluidly connected to the hollow spike on the housing and to a metering pump fluid line. The metering pump fluid line is fluidly connected to the fluid outlet line.

A pump cassette is disclosed. The pump cassette includes a housing having at least one fluid inlet line and at least one fluid outlet line. The cassette also includes at least one reciprocating pressure displacement membrane pump within the housing. The pressure pump pumps a fluid from the fluid inlet line to the fluid outlet line. A hollow spike is also included on the housing as well as at least one metering pump. The metering pump is fluidly connected to the hollow spike on the housing and to a metering pump fluid line. The metering pump fluid line is fluidly connected to the fluid outlet line.

A gas control device includes a first pump, a second pump, and a connection casing. The first pump includes a first pump casing, a first suction hole, and a first discharge hole. The first pump casing has a plurality of outer walls. The second pump includes a second pump casing, a second suction hole, and a second discharge hole. The connection casing has a first opening and a second opening. The connection casing forms, together with the first pump casing and the second pump casing, a first closed space. The second discharge hole and the first suction hole communicate with each other via the first closed space. The first pump and the second pump are connected in series with each other. The outer wall in which first suction hole is provided faces the first closed space.

A gas control device includes a first pump, a second pump, and a connection casing. The first pump includes a first pump casing, a first suction hole, and a first discharge hole. The first pump casing has a plurality of outer walls. The second pump includes a second pump casing, a second suction hole, and a second discharge hole. The connection casing has a first opening and a second opening. The connection casing forms, together with the first pump casing and the second pump casing, a first closed space. The second discharge hole and the first suction hole communicate with each other via the first closed space. The first pump and the second pump are connected in series with each other. The outer wall in which first suction hole is provided faces the first closed space.

A pumping line arrangement includes a chamber connecting line which is fluidly connectable to a process chamber that forms part of a semiconductor fabrication tool. The pumping line arrangement also includes a valve module which is fluidly connected to the chamber connecting line. The valve module splits the chamber connecting line into respective first and second pumping lines. The first pumping line is intended to carry a first process flow and the second pumping line is intended to carry a second process flow which is incompatible with the first process flow. At least one of the first pumping line or the second pumping line includes fluidly connected therewithin a pre-abatement module that is configured to remove one or more incompatible constituents from the process flow intended to be carried by the other pumping line.

A pumping line arrangement includes a chamber connecting line which is fluidly connectable to a process chamber that forms part of a semiconductor fabrication tool. The pumping line arrangement also includes a valve module which is fluidly connected to the chamber connecting line. The valve module splits the chamber connecting line into respective first and second pumping lines. The first pumping line is intended to carry a first process flow and the second pumping line is intended to carry a second process flow which is incompatible with the first process flow. At least one of the first pumping line or the second pumping line includes fluidly connected therewithin a pre-abatement module that is configured to remove one or more incompatible constituents from the process flow intended to be carried by the other pumping line.