A compressor device includes first and second compressors. The first and second compressors include first and second casings having bottom portions in which lubricant is to be stored, first and second compression mechanisms provided in the casings to compress refrigerant and discharge the compressed refrigerant into the casings, and first and second motors provided in the casings. The first and second motors each include a stator and a rotor, and drive the first and second compression mechanisms. The second compressor compresses the refrigerant discharged from the first compressor. The first and second motors have first and second passages extending from axial ends of the first and second motors and through which the refrigerant discharged from the first and second compression mechanisms passes. A cross-sectional area of the second passage is larger than a cross-sectional area of the first passage. A refrigeration apparatus includes the compressor device.

A motor-operated compressor includes a housing and a driving motor disposed in an inner space of the housing. The driving motor includes a stator and a rotor. A rotary shaft is coupled to the rotor. A first scroll is provided on one side of the driving motor and the rotary shaft passes through and is rotatably coupled to the first scroll. A second scroll is coupled to the first scroll and an eccentric part of the rotary shaft passing through the first scroll to form a compression chamber between the first scroll and the second scroll. A frame is provided opposite to the driving motor with the first scroll and the second scroll interposed therebetween and configured to axially support the second scroll and radially support one end of the rotary shaft passing through the second scroll.

A device evacuates a chamber and purifies the gas extracted from said chamber of any foreign substances. The device comprises a dry-condensing vacuum pump having an input connected to the chamber to be evacuated and is suitable for maintaining the input pressure at a constant level at the output despite variable conditions. An intermediate line which connects to the output of the dry-condensing vacuum pump and a liquid ring vacuum pump, the input of which is connected to the intermediate line, are additionally provided. A corresponding method makes it possible to purify the gas of any foreign substances reliably and effectively.

The present invention relates to a pumping system to generate a vacuum (SP), comprising a main vacuum pump which is a claw pump (3) having a gas suction inlet (2) connected to a vacuum chamber (1) and a gas discharge outlet (4) leading into a gas evacuation conduit (5) in the direction of a gas exhaust outlet (8) outside the pumping system. The pumping system comprises a non-return valve (6) positioned between the gas discharge outlet (4) and the gas exhaust outlet (8), and an auxiliary vacuum pump (7) connected in parallel to the non-return valve. In a pumping method by means of this pumping system (SP), the main vacuum pump (3) is started up in order to pump the gases contained in the vacuum chamber (1) and to discharge these gases through its gas discharge outlet (4), simultaneously to which the auxiliary vacuum pump (7) is started up. Moreover the auxiliary vacuum pump (7) continues to pump all the while that the main vacuum pump (3) pumps the gases contained in the vacuum chamber (1) and/or all the while that the main vacuum pump (3) maintains a defined pressure in the vacuum chamber (1).

A leak detector is provided for leak-testing objects that are to be tested by spraying tracer gas, the leak detector including: a detection inlet configured to be connected to an object that is to be tested; a pumping device including a vacuum line connected to the detection inlet, a rough-vacuum pump connected to the vacuum line, and a turbomolecular vacuum pump connected to the vacuum line, a delivery of which is connected to the rough-vacuum pump; and a gas detector connected to the turbomolecular vacuum pump, the pumping device further including an ancillary pump connected to the rough-vacuum pump and being configured to lower an ultimate-vacuum pressure of tracer gas in the rough-vacuum pump. A leak detection method for leak-testing objects that are to be tested by spraying tracer gas is also provided.

A heat exchanger for changing a temperature of a pumped gas flow and a pump comprising the heat exchanger is disclosed. The heat exchanger comprises: at least one tube configured to contain a flow of fluid; said at least one tube being at least partially embedded within a block of material; wherein said heat exchanger comprises mounting means configured to mount said heat exchanger adjacent to a gas port of a pump such that a least a portion of said heat exchanger extends into a path for gas flow flowing through said gas port; wherein the mounting means comprises a flange, the flange being configured to connect with the gas port of the pump, the block being mounted to the flange such that the block extends towards the rotor of the pump when the flange is connected with the gas port of the pump.

The present invention provides a method for cleaning a component for use in an ultra-high vacuum. The method may comprise the steps of placing the component to be cleaned in a vacuum furnace chamber; plasma cleaning the component at a temperature of greater than about 80 C.; and evacuating the chamber to a pressure of less than about 10E-5 mbar. Apparatus for performing such methods and kits comprising said components are also provided.

A vacuum pumping arrangement comprises a first pump which has a first inlet and a first outlet. The first inlet is fluidly connected to a first common pumping line. The first common pumping line includes a plurality of first pumping line inlets each of which is fluidly connectable to a least one process chamber within a group of process chambers that form a semiconductor fabrication tool. The vacuum pumping arrangement also includes a reserve pump which has a reserve inlet and a reserve outlet. The reserve inlet is selectively fluidly connectable to each process chamber within the group of process chambers that form the semiconductor fabrication tool. The vacuum pumping arrangement additionally includes a controller which is configured to selectively fluidly isolate the pump from one or more given process chambers and selectively fluidly connect the reserve pump with the said one or more given process chambers.

Combining at least one centrifugal compression stage and at least one positive displacement compression stage in an integrally geared compressor to allow for different types of compression based on a temperature or a volume of gas to be compressed by the integrally geared compressor.

A two-stage compressor includes a casing, a first compression mechanism and a second compression mechanism. The casing has a first compression chamber, a second compression chamber and an oil tank, wherein the first compression chamber communicates with the second compression chamber and the oil tank is located in the second compression chamber. The first compression mechanism is disposed in the first compression chamber. The second compression mechanism is disposed in the second compression chamber and the second compression mechanism corresponds to the oil tank. The first compression mechanism and the second compression mechanism consume different amounts of lubricant oil respectively.