Patent classifications
F16B9/01
Method For Manufacture Of A Multi-Layer Plate Device
A method for the joining of ceramic pieces with a hermetically sealed joint comprising brazing a layer of joining material between the two pieces. The wetting and flow of the joining material is controlled by the selection of the joining material, the joining temperature, the joining atmosphere, and other factors. The ceramic pieces may be aluminum nitride and the pieces may be brazed with an aluminum alloy under controlled atmosphere. The joint material is adapted to later withstand both the environments within a process chamber during substrate processing, and the oxygenated atmosphere which may be seen within the shaft of a heater or electrostatic chuck.
Low Temperature Method For Hermetically Joining Non-Diffusing Ceramic Materials In Multi-Layer Plate Devices
A method for the joining of ceramic pieces with a hermetically sealed joint comprising brazing a layer of joining material between the two pieces. The wetting and flow of the joining material is controlled by the selection of the joining material, the joining temperature, the joining atmosphere, and other factors. The ceramic pieces may be on a non-diffusable type, such as aluminum nitride, alumina, beryllium oxide, and zirconia, and the pieces may be brazed with an aluminum alloy under controlled atmosphere. The joint material is adapted to later withstand both the environments within a process chamber during substrate processing, and the oxygenated atmosphere which may be seen within the shaft of a heater or electrostatic chuck.
FRAME JOINT STRUCTURE
A frame joint structure includes a connecting member positioned adjacent to a joint between a first frame and a second frame. The connecting member has a first joint surface that abuts only one flat surface of the first frame, and a second joint surface that is integrally continuous with the first joint surface and abuts only one flat surface of the second frame. The connecting member is joined to the first frame and the second frame by a first joining member (such as adhesive).
Low temperature method for hermetically joining non-diffusing ceramic materials
A method for the joining of ceramic pieces with a hermetically sealed joint comprising brazing a layer of joining material between the two pieces. The wetting and flow of the joining material is controlled by the selection of the joining material, the joining temperature, the joining atmosphere, and other factors. The ceramic pieces may be on a non-diffusable type, such as aluminum nitride, alumina, beryllium oxide, and zirconia, and the pieces may be brazed with an aluminum alloy under controlled atmosphere. The joint material is adapted to later withstand both the environments within a process chamber during substrate processing, and the oxygenated atmosphere which may be seen within the shaft of a heater or electrostatic chuck.
Multi-Layer Plate Device
A method for the joining of ceramic pieces with a hermetically sealed joint comprising brazing a continuous layer of joining material between the two pieces. The wetting and flow of the joining material is controlled by the selection of the joining material, the joining temperature, the time at temperature, the joining atmosphere, and other factors. The ceramic pieces may be aluminum nitride and the pieces may be brazed with an aluminum alloy under controlled atmosphere. The joint material is adapted to later withstand both the environments within a process chamber during substrate processing, and the oxygenated atmosphere which may be seen within the shaft of a heater or electrostatic chuck.
Method for manufacture of a multi-layer plate device
A method for the joining of ceramic pieces with a hermetically sealed joint comprising brazing a continuous layer of joining material between the two pieces. The wetting and flow of the joining material is controlled by the selection of the joining material, the joining temperature, the time at temperature, the joining atmosphere, and other factors. The ceramic pieces may be aluminum nitride and the pieces may be brazed with an aluminum alloy under controlled atmosphere. The joint material is adapted to later withstand both the environments within a process chamber during substrate processing, and the oxygenated atmosphere which may be seen within the shaft of a heater or electrostatic chuck.
Fast-detaching structure
A fast-detaching structure, includes a mounting member and a first connection member. The mounting member includes a bottom wall, two positioning walls, and two fixation edges. The bottom wall is connected to the two positioning walls. The bottom wall and the two positioning walls cooperatively define a mounting slot. The two fixation edges are arranged on top of the two positioning walls. The fixation edge extends towards an inside of the mounting slot. The bottom wall defines a snapping slot. The first connection member is detachably mounted in the mounting slot. The first connection member includes two abutting ends and a deforming end. The two abutting ends are arranged corresponding to the two positioning walls. The deforming end can be elastically deformed. A snapping tab is arranged on the deforming end and protruding towards the bottom wall.
FAST-DETACHING STRUCTURE
A fast-detaching structure, includes a mounting member and a first connection member. The mounting member includes a bottom wall, two positioning walls, and two fixation edges. The bottom wall is connected to the two positioning walls. The bottom wall and the two positioning walls cooperatively define a mounting slot. The two fixation edges are arranged on top of the two positioning walls. The fixation edge extends towards an inside of the mounting slot. The bottom wall defines a snapping slot. The first connection member is detachably mounted in the mounting slot. The first connection member includes two abutting ends and a deforming end. The two abutting ends are arranged corresponding to the two positioning walls. The deforming end can be elastically deformed. A snapping tab is arranged on the deforming end and protruding towards the bottom wall.
FAST-DETACHING STRUCTURE
A fast-detaching structure, including a mounting member and a first connection member. The mounting member includes: a bottom wall, two positioning walls and a limiting wall. The limiting wall is disposed between the two positioning walls; the bottom wall is connected to the two the positioning walls and the limiting wall; the bottom wall, the two positioning walls and the limiting wall cooperatively define a mounting slot; the limiting wall is arranged with a connection part, a wire channel is defined in the connection part. The first connection member is detachably mounted in the mounting slot. The first connection member includes two abutting ends and a front abutting end connected between the two abutting ends; the two abutting ends are disposed corresponding to the two positioning walls; the front abutting end correspondingly defines a receiving opening; the connection part is received in the receiving opening.