Patent classifications
F16L9/02
TRANSFER LINE
A transfer line between the outlet of a steam cracker and the inlet for the quench system has metallic or ceramic inserts having a pore size from about 0.001 to about 0.5 microns inside the line forming a gas tight barrier with the inner surface of the line and having a vent for the resulting gas tight pocket are used to separate H.sub.2, CH.sub.4, CO and CO.sub.2 from cracked gases reducing the load on the down-stream separation train of the steam cracker.
TRANSFER LINE
A transfer line between the outlet of a steam cracker and the inlet for the quench system has metallic or ceramic inserts having a pore size from about 0.001 to about 0.5 microns inside the line forming a gas tight barrier with the inner surface of the line and having a vent for the resulting gas tight pocket are used to separate H.sub.2, CH.sub.4, CO and CO.sub.2 from cracked gases reducing the load on the down-stream separation train of the steam cracker.
Joint structure for metallic pipes
One of a first metallic pipe containing a first metal as a main component and a second metallic pipe containing a second metal as a main component includes an expanded-diameter connecting part which is formed at an end part of the one metallic pipe. An inner diameter of the end part is greater than an inner diameter of an adjacent part that is adjacent to the end part. An intermetallic compound layer of the first and second metal is present at an interface of the first and second metal located between a brazing filler metal and the one or the other of the metallic pipes. A thickness of the intermetallic compound layer is configured such that the thickness of an end portion on the side of a base end is smaller than the thickness of an end portion on the side of an open end.
DIRECT OR INDIRECT METAL PIPE EXTRUSION PROCESS, MANDREL FOR EXTRUDING METAL PIPES, METAL PIPE EXTRUDER AND EXTRUDED METAL PIPE
If a mandrel for extruding metal pipes, having two axially offset pressing surfaces with different radial embossing and having a transition region between these two pressing surfaces has a support surface in the transition region then the negative effect of narrowing, which arises owing to the mandrel shifting from a first pressing position, in which the first of the two pressing surfaces interacts with a die, to a second pressing position, in which the second pressing surface interacts with the die, can be minimized.
NI-BASED ALLOY TUBE
A Ni-based alloy tube includes a base metal having a chemical composition consisting, by mass percent, of C: 0.15% or less, Si: 1.0% or less, Mn: 2.0% or less, P: 0.030% or less, S: 0.030% or less, Cr: 10.0 to 40.0%, Ni: 50.0 to 80.0%, Ti: 0.50% or less, Cu: 0.60% or less, Al: 0.20% or less, N: 0.20% or less, and the balance: Fe and impurities; and a low Cr content complex oxide film having a thickness of 25 nm or smaller at least on an inner surface of the base metal, wherein contents of Al, Ni, Si, Ti, and Cr in the film satisfy [at % Al/at % Cr≦2.00], [at % Ni/at % Cr≦1.40], and [(at % Si+at % Ti)/at % Cr≧0.10].
NI-BASED ALLOY TUBE
A Ni-based alloy tube includes a base metal having a chemical composition consisting, by mass percent, of C: 0.15% or less, Si: 1.0% or less, Mn: 2.0% or less, P: 0.030% or less, S: 0.030% or less, Cr: 10.0 to 40.0%, Ni: 50.0 to 80.0%, Ti: 0.50% or less, Cu: 0.60% or less, Al: 0.20% or less, N: 0.20% or less, and the balance: Fe and impurities; and a low Cr content complex oxide film having a thickness of 25 nm or smaller at least on an inner surface of the base metal, wherein contents of Al, Ni, Si, Ti, and Cr in the film satisfy [at % Al/at % Cr≦2.00], [at % Ni/at % Cr≦1.40], and [(at % Si+at % Ti)/at % Cr≧0.10].
FORMULATION AND METHOD FOR INHIBITING CARBON-BASED DEPOSITS
There is a formulation and a method for inhibiting carbon-based deposits on metal substrate. The method comprises the use of a formulation comprising at least one oxidizing agent and at least one etchant capable of forming free metal ions from the metal substrate, at least one sequestering agent having a ligand capable of forming a complex with the free metal ions and at least one chelating agent having a ligand capable of complexing with at least one surface metal atom.
FORMULATION AND METHOD FOR INHIBITING CARBON-BASED DEPOSITS
There is a formulation and a method for inhibiting carbon-based deposits on metal substrate. The method comprises the use of a formulation comprising at least one oxidizing agent and at least one etchant capable of forming free metal ions from the metal substrate, at least one sequestering agent having a ligand capable of forming a complex with the free metal ions and at least one chelating agent having a ligand capable of complexing with at least one surface metal atom.
Thermal pyrolytic graphite tube device for directional thermal management
The present technology provides a non-cylindrical structure for transporting media, including gases, liquids, solids, or energy comprising a layer of thermal pyrolytic graphite (TPG) surrounded by an outer layer and an inner layer comprising a metal, a ceramic, a glass, or a plastic. In particular, the present technology relates to a non-cylindrical tube or a pipe having an inner layer, an outer layer, and a layer of TPG between the inner layer and the outer layer wherein the TPG layer is configured to manage the direction of heat conduction.
High temperature field joints
A method for forming a high temperature field joint between two insulated pipe sections, and an insulated conduit having a low temperature field joint. The conduit comprises a steel pipe with a corrosion protection coating and a pipe insulation layer comprising a polymer composition having thermal conductivity of less than about 0.40 W/mk, and/or heat resistance to continuous operating temperatures from about 150° C. to above about 205° C. After a circumferential weld joint is formed between the two pipes, a first field joint insulation layer is applied over the joint area, the first field joint insulation layer comprises a polymer composition having heat resistance to continuous operating temperatures from about 150° C. to above about 205° C.