A modular light emitting diode (LED) mounting configuration is provided including a light source module having a plurality of pre-packaged LEDs arranged in a serial array. The module includes a heat conductive body portion adapted to conduct heat generated by the LEDs to an adjacent heat sink. As a result, the LEDs are able to be operated with a higher current than normally allowed. Thus, brightness and performance of the LEDs is increased without decreasing the life expectancy of the LEDs. The LED modules can be used in a variety of illumination applications employing one or more modules.

An LED light bulb provides a supporting structure having a central axis, a substantially circular configuration of LEDs surrounding said central axis and mounted to said supporting structure, a bulb envelope surrounding the central axis and enclosing the circular configuration of LEDs, and at least one of the LEDs being at least partially surrounded by a light collecting optic having an optical axis radiating outwardly from the central axis, that collects and projects light emanating from the LEDs as a concentrated beam along and surrounding the optical axis of the light collecting optic away from the bulb envelope.

An electrical interface module (EIM) is provided between an LED illumination device and a light fixture. The EIM includes an arrangement of contacts that are adapted to be coupled to an LED illumination device and a second arrangement of contacts that are adapted to be coupled to the light fixture and may include a power converter. Additionally, an LED selection module may be included to selectively turn on or off LEDs. A communication port may be included to transmit information associated with the LED illumination device, such as identification, indication of lifetime, flux, etc. The lifetime of the LED illumination device may be measured and communicated, e.g., by an RF signal, IR signal, wired signal or by controlling the light output of the LED illumination device. An optic that is replaceably mounted to the LED illumination device may include, e.g., a flux sensor that is connected to the electrical interface.

An electrical interface module (EIM) is provided between an LED illumination device and a light fixture. The EIM includes an arrangement of contacts that are adapted to be coupled to an LED illumination device and a second arrangement of contacts that are adapted to be coupled to the light fixture and may include a power converter. Additionally, an LED selection module may be included to selectively turn on or off LEDs. A communication port may be included to transmit information associated with the LED illumination device, such as identification, indication of lifetime, flux, etc. The lifetime of the LED illumination device may be measured and communicated, e.g., by an RF signal, IR signal, wired signal or by controlling the light output of the LED illumination device. An optic that is replaceably mounted to the LED illumination device may include, e.g., a flux sensor that is connected to the electrical interface.

A linear lamp is provided having one or more light emitting elements provided therein. The light emitting elements are directed to emit light in a direction different from the primary direction of the illumination of the lamp. The light emitting elements may be supported by a supporting optical element. The supporting optical element may permit the transmission of light therethrough. The supporting optical element may be an integral window upon which the light emitting elements are disposed.

A light source comprises a light emitting diode array (101) and a collimator array (102). The light emitting diode array (101) comprises at least two light emitting diode units (101a, 101b) that emit light of different colors; the collimator array (102) is used for collimating light emitted by the light emitting diode units (101a, 101b) and keep the optical extension of the light emitted by the light emitting diode units (101a, 101b) substantially unchanged. The light source further comprises a dodging device (103) used for dodging light emerging from the collimator array (102). An illuminating device comprises the light source. The light emitting diode units (101a, 101b) and the collimator unit (102a) in the light source and the illuminating device minimize the optical extension of the emergent light, thereby maximizing the luminance.

A light source comprises a light emitting diode array (101) and a collimator array (102). The light emitting diode array (101) comprises at least two light emitting diode units (101a, 101b) that emit light of different colors; the collimator array (102) is used for collimating light emitted by the light emitting diode units (101a, 101b) and keep the optical extension of the light emitted by the light emitting diode units (101a, 101b) substantially unchanged. The light source further comprises a dodging device (103) used for dodging light emerging from the collimator array (102). An illuminating device comprises the light source. The light emitting diode units (101a, 101b) and the collimator unit (102a) in the light source and the illuminating device minimize the optical extension of the emergent light, thereby maximizing the luminance.

The present invention provides a light-emitting diode (LED) device and a method for manufacturing the same. The LED device comprises: a substrate (1); a chip (2) disposed on the substrate (1); and a first lens (3) disposed on the substrate (1) and spaced from the chip (2); wherein the first lens (3) comprises luminescent powder (7) and at least one of light-diffusing particles (8) and light-reflecting particles (10). The LED device provided by the present invention has a high luminous efficiency, and solves the problem in the prior art that the LED device has a small angle of emergence and the emergent light emergence lacks of uniformity.

A process for the manufacture of a scattering polymer film can include (a) making available a film made of organic polymer, (b) applying, to one of the faces of the said film, a liquid composition (c) heating and/or irradiating the layer of liquid composition to form a cured scattering layer. A scattering polymer film can be obtained by this process. A substrate for OLED can include such a film adhesively bonded to a transparent substrate.

A process for the manufacture of a scattering polymer film can include (a) making available a film made of organic polymer, (b) applying, to one of the faces of the said film, a liquid composition (c) heating and/or irradiating the layer of liquid composition to form a cured scattering layer. A scattering polymer film can be obtained by this process. A substrate for OLED can include such a film adhesively bonded to a transparent substrate.